All items tagged with hearables (163)

The GSMA Mobile World Congress 2018 Returns to Discuss the Future of Personal Technologies and Wearables

February 3, 2018 by Joao Martins

The GSMA Mobile World Congress 2018 Returns to Discuss the Future of Personal Technologies and Wearables

The Mobile World Congress returns in 2018, held 26 February – 1 March at Fira Gran Via in Barcelona, Spain. The event brings more than 100,000 attendees from over 200 countries and 2,300 exhibitors together in one place, creating a dynamic environment of collaboration, innovation and education that will advance the mobile industry. Front and center in this year's edition will be once again the future of personal mobile technologies, wearables, and many innovations that will affect the audio industry.

CEVA and Silentium Deliver Active Noise Cancellation Solution for the CEVA-TeakLite DSP Family

January 23, 2018 by Joao Martins

CEVA and Silentium Deliver Active Noise Cancellation Solution for the CEVA-TeakLite DSP Family

CEVA and Silentium Ltd., a leading provider of Active Noise Cancellation (ANC) technology and adaptive sound management solutions, announced a partnership to deliver a low power active noise cancellation solution for headsets and hearables. Silentium’s Broadband P2P ANC technology is now available for CEVA’s lowest power audio/voice DSP family.

SoundChip Introduces Waypoints - a Platform for Scaling the Delivery of Class-Leading Noise Cancelling Into Smart Headsets

January 18, 2018 by Joao Martins

SoundChip Introduces Waypoints - a Platform for Scaling the Delivery of Class-Leading Noise Cancelling Into Smart Headsets

SoundChip SA, a Swiss-based global leader in hearable sound technology, announced the introduction of its Waypoints platform, which combines proven methods, tools and expertise to help manufacturers scale the delivery of effective noise cancelling into more products within their headset portfolio than ever before. The new platform supports third-party NC chips in addition to SoundChip's own HD-PA devices.

Qualcomm Introduces New Low Power Bluetooth Audio SoC Series for Wireless Earbuds and Hearables

January 9, 2018 by audioXpress Staff

Qualcomm Introduces New Low Power Bluetooth Audio SoC Series for Wireless Earbuds and Hearables

At CES 2018, Qualcomm introduced the new Qualcomm Low Power Bluetooth SoC QCC5100 series that is designed to help manufacturers develop a new generation of compact, feature-rich, wireless earbuds, hearables and headsets. The new low power, feature-rich Bluetooth solution includes support for voice assistant services, Qualcomm TrueWireless Stereo, Qualcomm aptX HD audio and integrated hybrid ANC.

Bragi Announces Sound Amplification and Hearing Enhancement Collaboration Project with Mimi Hearing Technologies

January 8, 2018 by audioXpress Staff

Bragi Announces Sound Amplification and Hearing Enhancement Collaboration Project with Mimi Hearing Technologies

Bragi announced Project Ears, a special collaboration with Mimi Hearing Technologies to develop sound amplification and hearing enhancement solutions. Project Ears is already in development and will focus on Personal Sound Amplification Systems (PSAP), and will examine the possibilities of hearing enhancement in a multitude of different settings including the home, office, jobsite and even outdoor sport environments.

Change and Opportunities in the Audio Landscape

November 10, 2017 by Joao Martins

Change and Opportunities in the Audio Landscape

On November 9, 2017, I attended the Futuresource Audio Collaborative 2017 conference, at the Ham Yard Hotel in London. With the topic "A Change is Gonna Come," the conference was a valuable and insightful event. To entice our readers to actually spend the hours listening to those interventions (and for those that don't have the time to do it), I will share some of the key highlights, adding some personal takes on the topics addressed.

SoundChip Unveils World’s Lowest Power, Highest Performance Hybrid Noise Cancelling Platform for True Wireless Stereo Headsets

November 3, 2017 by audioXpress Staff

SoundChip Unveils World’s Lowest Power, Highest Performance Hybrid Noise Cancelling Platform for True Wireless Stereo Headsets

SoundChip, a Swiss-based provider or audio processing solutions, unveiled Aurora – an application-specific, low-power, hybrid noise cancelling platform for next-generation True Wireless Stereo (TWS) headsets. According to the company, Aurora delivers up to 35dB of class-leading digitally-programmable feed-forward and feedback (hybrid) noise cancelling, as well as a swathe of software-controlled features, including multi-mode noise cancelling, digitally configurable occlusion control, and situational awareness.

Qualcomm 2017 State of Play Report Now Available

August 28, 2017 by audioXpress Staff

Qualcomm 2017 State of Play Report Now Available

Qualcomm released its 2017 State of Play report. The report based on a survey of 4,000 adult smartphone users in the US and UK conducted by OnePoll, Ltd., helps identify current consumer attitudes and purchase drivers for wireless headphones and speakers. This annual report highlights consumer demand for convenience and quality from personal audio devices.

NXP and Widex Team for Low Power Wireless Audio Streaming Hearing Aids

July 12, 2017 by audioXpress Staff

NXP and Widex Team for Low Power Wireless Audio Streaming Hearing Aids

NXP Semiconductors and hearing aid specialist Widex announced that they have collaborated to develop, test and integrate NXP’s NxH2003 Bluetooth Low Energy (BLE) audio streaming SoC into the new Widex Beyond hearing aids. The two companies worked closely together throughout the product development cycle, to deliver hearing aid devices that can stream wireless audio from an Apple iOS device, consuming only 2.8 mA current at 1.2 Volts, which is currently the best in the industry. This allows end users to enjoy music directly from their personal devices for prolonged periods of time.

Qualcomm Announces Multiple New Audio Platforms to Support New Use Cases for Next Generation of Wireless Speakers, Headphones and Hearables

June 21, 2017 by audioXpress Staff

Qualcomm Announces Multiple New Audio Platforms to Support New Use Cases for Next Generation of Wireless Speakers, Headphones and Hearables

During its voice and music developer conference held recently in Shenzhen, China, Qualcomm made two exciting audio announcements. The company announced its new Smart Audio Platform to help manufacturers accelerate the development and commercialization of smart and networked speakers. Qualcomm also announced multiple new audio platforms for next-gen wireless speakers, headphones and hearables, each one uniquely tailored to support new market demands, particularly as consumers rapidly adopt wireless audio devices.

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