All items tagged with STMicroelectronics (67)

STMicroelectronics Establishes World’s First “Lab-in-Fab” to Advance Adoption of Piezoelectric MEMS in Singapore

November 2, 2020 by audioXpress Staff

STMicroelectronics Establishes World’s First “Lab-in-Fab” to Advance Adoption of Piezoelectric MEMS in Singapore

STMicroelectronics, a leading manufacturer of Micro-Electromechanical Systems (MEMS) technology, announced a collaboration with A*STAR’s Institute of Microelectronics (IME), a research institute in Singapore, and ULVAC, a leading Japanese manufacturing-tool vendor, to jointly setup and operate an 8-inch (200mm) R&D line focused on Piezo MEMS technology within ST’s existing manufacturing facility in Singapore. The concept aims to advance the adoption of piezoelectric MEMS in new applications including augmented reality.

CEVA Extends Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software

September 22, 2020 by audioXpress Staff

CEVA Extends Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software

In the wake of the acquisition of the Hillcrest Laboratories (Hillcrest Labs) business from InterDigital in mid-2019, CEVA now introduced the Hillcrest Labs MotionEngine Hear, a sensor and processor agnostic embedded software solution for hearable devices. The new solution allows SoC vendors, OEMs and ODMs to take advantage of a configurable sensor fusion platform to add intuitive user interface, gesture control, activity tracking and spatial audio capabilities to hearable devices.

STMicroelectronics Extends USB Fast Charging over USB-C with USB-IF-Certified Embedded Development Board

June 29, 2020 by audioXpress Staff

STMicroelectronics Extends USB Fast Charging over USB-C with USB-IF-Certified Embedded Development Board

STMicroelectronics is facilitating modernization of battery-powered products to capture the advantages of the latest USB Power Delivery (USB PD) technology including faster charging and easy reuse of USB-C chargers and cables. The company's latest USB-IF-certified solution provides solid reference for end-product certification, while promoting reuse and reliable interoperability for existing USB-C fast chargers and cables with USB Power Delivery support.

STMicroelectronics Announces New-Generation Class-D Audio Amplifier IC Developed in Cooperation with Alps Alpine

March 5, 2020 by audioXpress Staff

STMicroelectronics Announces New-Generation Class-D Audio Amplifier IC Developed in Cooperation with Alps Alpine

STMicroelectronics announced the new FDA901 class-D audio amplifier IC, a new design that incorporates the world-class audio expertise of Japanese manufacturer of car audio equipment, Alps Alpine. The new ST chip aims to contribute to the creation of multi-function, high-fidelity car audio systems that fuse the high efficiency of class-D amplifiers with the high-quality sound of ST’s class-AB amplifiers.

USound MEMS Microspeakers Now Available to the Audio Industry as Components, Development Platforms, and Reference Designs

December 17, 2019 by Joao Martins

USound MEMS Microspeakers Now Available to the Audio Industry as Components, Development Platforms, and Reference Designs

Austrian microspeaker company USound is the most advanced MEMS Microspeakers initiative currently in the market. Since announcing a production partnership with STMicroelectronics in 2017, the world's first miniature piezoelectric MEMS (Micro-Electro-Mechanical Systems) actuators for smart audio systems in portable devices have become a commercial reality. Targeting multiple possible applications from headsets to high-end speakers and completely new development ideas, USound has announced multiple reference solutions to push the technology forward.

USB-IF Announces Publication of USB4 Specification that Doubles Bandwidth to Extend USB Type-C Performance

September 3, 2019 by Joao Martins

USB-IF Announces Publication of USB4 Specification that Doubles Bandwidth to Extend USB Type-C Performance

The USB Implementers Forum (USB-IF) announced the publication of the USB4 specification, a major update to deliver the next-generation USB architecture that complements and builds upon the existing USB 3.2 and USB 2.0 architectures. The USB4 architecture is based on the Thunderbolt protocol specification contributed by Intel to the USB Promoter Group. It doubles the maximum aggregate bandwidth of USB and enables multiple simultaneous data and display protocols.

Step-Down Converters from STMicroelectronics Save Energy and Space in Connected and Wearable Devices

March 14, 2019 by Cristina Costa

Step-Down Converters from STMicroelectronics Save Energy and Space in Connected and Wearable Devices

STMicroelectronics has announced its ST1PS01 step-down converters. The devices are engineered for small size, low quiescent current and high efficiency at all values of load current, to save energy and real-estate in keep-alive connected devices such as asset trackers, wearables, smart sensors and smart meters. Leveraging synchronous rectification, efficiency is 92% at 400 mA full load and 95% when delivering just 1 mA.

Embedded World 2019 Breaks New Records in Exhibitor Numbers

March 6, 2019 by audioXpress Staff

Embedded World 2019 Breaks New Records in Exhibitor Numbers

In its 17th year, embedded world, Nuremberg, Germany, once again impressed the global embedded electronics community. The results for visitor and exhibitor numbers and display area confirmed around 31,000 trade visitors, the second best visitor total since the trade fair began, and 1,117 companies from all over the world flocked to the 8% larger display area at Exhibition Centre Nuremberg.

Libre Wireless MAVID Device and Software Now with Amazon Alexa Built-in

February 8, 2019 by audioXpress Staff

Libre Wireless MAVID Device and Software Now with Amazon Alexa Built-in

Leading embedded wireless voice/AI solutions provider Libre Wireless Technologies announced that its MAVID (Multiprotocol, Audio, Voice, IoT Device) super compact, ultra-low power mic-to-cloud platform and software SDK, now supports the Alexa Voice Service (AVS) built-in. The breakthrough platform incorporates a complete hardware and software solution for embedded voice, IoT, audio and wireless connectivity, and now features integrated AVS.

New Hybrid Audio Amplifier from Dayton Audio Blends Tube Tone with Class D Power and Bluetooth

January 15, 2019 by audioXpress Staff

New Hybrid Audio Amplifier from Dayton Audio Blends Tube Tone with Class D Power and Bluetooth

Dayton Audio unveiled a new compact design that combines the efficiency and power of solid state class D amplifier topology with the warmth and character of a vacuum tube preamp section. The new Dayton Audio HTA20BT hybrid stereo tube amplifier combines a 12W per channel RMS design (into a 4 ohm load) with Bluetooth 4.2, Aux, and USB inputs, featuring a subwoofer output for adding an active subwoofer and a high quality headphone amplifier built-in. The results, the brand says, are sure to please even the most refined ears.

«
1
2
3
4
5
6
7
»