All items tagged with NXP Semiconductors (67)

The NXP NXH3670 Enables Ideal Wireless Headset Experiences

October 10, 2019 by Special Content

The NXP NXH3670 Enables Ideal Wireless Headset Experiences

Inspired by a wish to enhance gaming audio, NXP Semiconductors designed a single-chip, high performance wireless audio streaming solution. The NxH3670 constitutes a highly integrated, single-chip ultra-low-power wireless transceiver with embedded MCU, targeted at wireless audio streaming for gaming headsets at very low latency. Check out NXP’s proprietary ultra-low power, 2.4 GHz wireless gaming headphone solution. Sponsored Content by NXP Semiconductors.

NXP Announces New Dual-Core Arm Cortex-M Based GHz Crossover Microcontroller for Advanced Machine Learning Applications

October 4, 2019 by audioXpress Staff

NXP Announces New Dual-Core Arm Cortex-M Based GHz Crossover Microcontroller for Advanced Machine Learning Applications

NXP Semiconductors announced the i.MX RT1170 family of crossover MCUs that combines unprecedented levels of performance, reliability, and integration to propel industrial, automotive and consumer machine learning applications. The NXP i.MX RT1170 family reinforces NXP’s commitment to advance edge computing with its EdgeVerse portfolio of solutions and marks a technology breakthrough with MCUs that run up to 1GHz while maintaining low-power efficiency.

Amazon Announces Voice Interoperability Initiative with Leading Technology Companies

September 26, 2019 by audioXpress Staff

Amazon Announces Voice Interoperability Initiative with Leading Technology Companies

Amazon, Baidu, Sony, BMW, Microsoft, Bose, Tencent, Orange, Salesforce, Harman, Logitech, Verizon, Sonos, Spotify, Sound United, and more are joining forces to promote choice by supporting multiple, interoperable voice services on a single device. The idea is to offer multiple, simultaneous wake words, so users can access multiple voice services by simply saying the corresponding wake word – from Alexa and Cortana to Orange’s Djingo, Salesforce’s Einstein, and more.

Audinate Announces Dante Reference Design for Popular NXP i.MX 8M Mini ARM-based Applications Processor

July 23, 2019 by audioXpress Staff

Audinate Announces Dante Reference Design for Popular NXP i.MX 8M Mini ARM-based Applications Processor

Audinate and NXP Semiconductors have collaborated to introduce a new reference design kit for the popular NXP i.MX 8M Mini QuadLite SoC – providing Dante audio-over-IP to OEMs as on-chip software. Following the announced shift from purpose-built hardware to software-based solutions running on standardized hardware, and a similar agreement to supply software running on Linux for x86 and ARM processors, Audinate now extends the support to NXP’s i.MX 8M processors.

Trends in Microspeakers

July 2, 2019 by Mike Klasco

Trends in Microspeakers

Voice Coil April 2019 featured another great Focus article by Mike Klasco (Menlo Scientific) discussing trends in Microspeakers. With more than 1.6 billion mobile phones built annually, each with a microspeaker for the speakerphone and another for the receiver, this side of the speaker industry attracts the giants. Get the full scoop on one of the hottest market segments.

NXP to Acquire Wi-Fi and Bluetooth Connectivity Assets from Marvell

May 31, 2019 by audioXpress Staff

NXP to Acquire Wi-Fi and Bluetooth Connectivity Assets from Marvell

NXP Semiconductors N.V. announced that its wholly owned subsidiary has entered into a definitive agreement with Marvell to acquire Marvell’s Wireless Connectivity portfolio in an all-cash, asset transaction valued at $1.76 billion. The acquisition encompasses Marvell’s Wi-Fi Connectivity Business Unit, Bluetooth technology portfolio and related assets. NXP expects the acquisition to create new revenue opportunities in its target end markets, including connected devices, automotive and communication infrastructure applications.

Mymanu CLIK S All-In-One Truly Wireless Earbuds Unveiled at MWC 2019

February 26, 2019 by audioXpress Staff

Mymanu CLIK S All-In-One Truly Wireless Earbuds Unveiled at MWC 2019

British start-up Mymanu is determined to embrace new challenges, again, with the launch of what the company calls “the most affordable, All-In-One truly wireless earbuds” with extended features. Unveiled at MWC 2019, in Barcelona and targeted to cost 79$ on pre-order, the new Mymanu CLIK S earbuds have been designed with fitness, music and travel lovers in mind. And as with previous initiatives from Mymanu, the focus continues to be the use of TWS earbuds for language translation, supported with a connected smartphone and app.

NXP Brings Dolby Atmos and DTS:X to the Masses with its New Immersiv3D Audio Solution

February 18, 2019 by audioXpress Staff

NXP Brings Dolby Atmos and DTS:X to the Masses with its New Immersiv3D Audio Solution

Following a showcase at CES 2019, NXP Semiconductors announced its Immersiv3D audio solution, combining NXP software on its i.MX 8M Mini applications processor with support both Dolby Atmos and DTS:X immersive audio technologies. The i.MX 8M Mini SoC also brings smart capabilities like voice control to a broader range of consumer devices including soundbars, smart speakers, and AV receivers with the option for adding additional speakers to distribute smart voice control and immersive audio throughout the home.

Android Things is Now Only for Smart Speakers and Displays

February 18, 2019 by LinuxGizmos Editor

Android Things is Now Only for Smart Speakers and Displays

Google announced it is scaling back Android Things as a general-purpose IoT platform. Android Things will now focus solely on OEM-built smart speakers and displays. Google is discontinuing public access to i.MX8M, Snapdragon, and MediaTek based production modules for the OS. The ARM-based production boards from Innocomm, Intrinsyc, and MediaTek that Google was reselling to vendors with pre-loaded Android Things will no longer be publicly supported.

ResearchAndMarkets.com Publishes Bluetooth 5: System-on-Chip Comparisons 2018 - Complete Teardown Report

November 6, 2018 by audioXpress Staff

ResearchAndMarkets.com Publishes Bluetooth 5: System-on-Chip Comparisons 2018 - Complete Teardown Report

The "Bluetooth 5: System-on-Chip Comparison 2018 Complete Teardown Report" report has just been added to ResearchAndMarkets.com's offering. The report presents a technological and economical comparison of four of the newest and most competitive systems-on-chips (SoCs) available on the market today from four different manufacturers. They are: the QN9080 from NXP; the QCC5121 from Qualcomm; the DA14585 from Dialog Semiconductor; and the nRF52810 from Nordic Semiconductor.

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