All items tagged with NXP Semiconductors (67)

NXP Introduces i.MX 93 Applications Processor Family for Secure Connected Devices with Edge AI

November 9, 2021 by audioXpress Staff

NXP Introduces i.MX 93 Applications Processor Family for Secure Connected Devices with Edge AI

NXP Semiconductors is gradually catching up from the time the company wasted in the attempted merger with Qualcomm. The company announced the i.MX 93 family of applications processors designed for automotive, smart home, smart building and smart everything applications. The i.MX 93 family leverages a heterogenous multicore SoC architecture designed to leverage efficient edge machine learning.

NXP Semiconductors Completes Acquisition of Retune DSP

August 30, 2021 by Joao Martins

NXP Semiconductors Completes Acquisition of Retune DSP

NXP expanded its already broad portfolio of voice enablement solutions with the acquisition of Retune DSP, the Denmark-based provider of Digital Signal Processing (DSP) software and algorithms for voice control and communication applications. Announced in July and now confirmed, the acquisition of Retune DSP adds three powerful voice DSP software products that will merge with NXP’s voice solutions. The combination with NXP’s broad customer base, global footprint and scale, promises to expand breakthrough voice solutions through combined R&D, sales force and customer support teams.

NXP Development Tools Support New Ultra-Wideband Applications With iPhone and Apple Watch

June 7, 2021 by Cristina Costa

NXP Development Tools Support New Ultra-Wideband Applications With iPhone and Apple Watch

NXP Semiconductors has announced that it now offers beta Ultra-Wideband (UWB) development tools from its NXP Trimension portfolio that interoperate with the U1 chip in supported Apple products. The beta development tools will allow developers to kick-start the design of innovative applications that interact with UWB enabled Apple products including iPhone and Apple Watch, unleashing the ability to create more precise, directionally aware app experiences.

Dirac Names Wade Giles Vice President, Americas

January 29, 2021 by audioXpress Staff

Dirac Names Wade Giles Vice President, Americas

Swedish sound pioneer Dirac announced the appointment of Wade Giles as Vice President, Americas, overseeing all sales and business development efforts in North America. The announcement follows an executive team realignment that appointed a new CEO and Chief Product Officer, and comes on the heels of a successful 2020 that realized significant sales growth through a range of new partnerships and customer acquisitions.

TOP-electronics Named Global Distributor for ArkX Laboratories Far-Field Voice Capture Technology

January 27, 2021 by audioXpress Staff

TOP-electronics Named Global Distributor for ArkX Laboratories Far-Field Voice Capture Technology

Leading provider of advanced voice technology ArkX Laboratories announced an agreement with TOP-electronics for the global distribution of its EveryWord portfolio of ultra-far-field voice capture solutions. TOP-electronics is an international technology-driven distributor and representative of electronic components and modules. The ArkX high-performance EveryWord product line consists of an Audio Front End (AFE) Module, Integrated Voice Module (SOM + Audio Board w/AFE), and an AVS Development Kit qualified by Amazon Voice Service (AVS).

ArkX Labs EveryWord Far-Field Reference Design Kit Receives Amazon AVS Qualification

November 13, 2020 by audioXpress Staff

ArkX Labs EveryWord Far-Field Reference Design Kit Receives Amazon AVS Qualification

ArkX Laboratories, a joint venture between hardware design and development firm Surfaceink and consumer electronics manufacturing company Ark USA, announced its EveryWord Ultra Far-Field Reference Design Kit has been qualified by Amazon AVS. The advanced far-field development kit features Cirrus Logic SoundClear Technology and NXP i.MX 8 host processor technology and is a powerful solution for manufacturers dealing with noisy environments, different mic array geometry challenges, and the need to support 3 or 5 channels for surround use cases.

NXP Unveils New IW62X Family of 2x2 Wi-Fi 6 + Bluetooth Devices for Advanced Audio Applications and Connected Designs

October 9, 2020 by audioXpress Staff

NXP Unveils New IW62X Family of 2x2 Wi-Fi 6 + Bluetooth Devices for Advanced Audio Applications and Connected Designs

NXP Semiconductors announced its latest family of 2x2 Wi-Fi 6 (802.11ax) Dual Band + Bluetooth/BLE-Audio devices, designed to drive a new phase of connectivity innovation for all sorts of advanced audio, gaming and connected devices. Enabling the world’s first Wi-Fi 6 enabled gaming console (the new PlayStation 5), NXP’s optimized IW62X family of products will provide increased capacity, efficiency and performance for next-generation connectivity solutions including wireless speakers and all sorts of smart devices.

NXP Enables Industry-First Single Controller for In-Vehicle Multi-Device Wireless Charging

August 28, 2020 by Cristina Costa

NXP Enables Industry-First Single Controller for In-Vehicle Multi-Device Wireless Charging

NXP Semiconductors announced that the first multi-device vehicle wireless charging solution driven by a single MWCT controller is now available in production vehicles. The solution charges two mobile devices simultaneously at up to 2x15 Watts using a single MWCT controller and supports all Qi wireless charging enabled phones including latest iPhone models, and products from Samsung, Huawei and others. Optional NFC is available for convenience features such as BLE/Wi-Fi pairing, smart car access with NFC, in-car purchases and NFC card damage protection.

NXP Expands Secure Edge-Connected Platforms Based on its i.MX RT Crossover MCUs and Wi-Fi/Bluetooth Solutions

July 29, 2020 by audioXpress Staff

NXP Expands Secure Edge-Connected Platforms Based on its i.MX RT Crossover MCUs and Wi-Fi/Bluetooth Solutions

NXP Semiconductors announced that its Wi-Fi and Wi-Fi/Bluetooth combo solutions are now pre-integrated across its i.MX RT MCU platform, allowing developers to create the optimal pairing of processing with connectivity. NXP combined its MCU and Wi-Fi/Bluetooth platform solutions within its MCUXpresso Software Development Kit (SDK) to simplify and accelerate the development of connected designs. The company’s connectivity modules and MCU development kits are available now.

Audinate Announces Authorized Implementer Program for Dante AV Products and New Reference Design for Dante Embedded Platform

June 16, 2020 by audioXpress Staff

Audinate Announces Authorized Implementer Program for Dante AV Products and New Reference Design for Dante Embedded Platform

Audinate, the developer of the industry-leading Dante audio networking technology and now also of the Dante AV networking solution, announced a new Authorized Implementer Program for manufacturers seeking to fast-track the development of new Dante AV products. And to better support developers, Audinate launched a reference design kit for Dante Embedded Platform on the popular NXP i.MX 8M Mini QuadLite SoC which provides Dante audio-over-IP to OEMs as on-chip software.

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