Searched for: IoT
Io Audio Technologies Introduces Road-Ready XLR Audio Cables
by audioXpress Staff

Io Audio Technologies Introduces Road-Ready XLR Audio Cables

Io Audio Technologies, a division of Knight Electronics, Inc., has developed a family of 3-pin XLR cables that offer high-quality design and high performance with pricing that speaks for itself. Available in three grades, Premium, Professional and Performance, these audio cables deliver high-quality sound performance with different budgets in mind. The 3-pin XLR cable family provides excellent EMI resistance for low noise performance and uses rugged locking connectors to ensure safe and secure connectivity.
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Genelec Appoints Michael Bohlin as International Sales Manager
by audioXpress Staff

Genelec Appoints Michael Bohlin as International Sales Manager

Genelec announced the return of Michael Bohlin to the brand that brought him into the professional audio industry, almost 25 years ago. Taking the title International Sales Manager, Bohlin, a well known and highly respected figure in the European industry, will be based in Stockholm. Reporting to International Sales Director Ole Jensen, he will be responsible for the development and support of distributor, dealer and key user networks for Genelec’s professional monitoring segment within Europe.
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CEVA Delivers Bluetooth 5 Dual Mode IP to ASR Micro
by audioXpress Staff

CEVA Delivers Bluetooth 5 Dual Mode IP to ASR Micro

CEVA, a licensor of signal processing platforms and artificial intelligence processors for connected devices, reinforced its leadership in the Bluetooth IP market with delivery of its RivieraWaves Bluetooth 5 dual mode IP to multiple licensees, including ASR Microelectronics, a fabless semiconductor company. ASR Micro adopted RivieraWaves Bluetooth 5 Dual Mode IP for smartphones, smart speakers, headsets and IoT Devices.
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CEVA Expands TeakLite Family Audio Applications with Maxim's Dynamic Speaker Management and Nuance Voice Activation Technologies
by Joao Martins

CEVA Expands TeakLite Family Audio Applications with Maxim's Dynamic Speaker Management and Nuance Voice Activation Technologies

During Mobile World Congress 2018, CEVA announced the availability of Dynamic Speaker Management (DSM) software from Maxim Integrated Products for its CEVA-TeakLite-4 family of ultra-low power audio/voice DSPs, allowing for much louder and richer sound on smartphones, wearables and headsets. CEVA also confirmed that Nuance Voice Activation technology is now available for the CEVA-TeakLite family of DSPs, offering improved performance and power efficiency for mobile devices and smart home applications.
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Circuit Cellar and LinuxGizmos.com Form Strategic Partnership
by audioXpress Staff

Circuit Cellar and LinuxGizmos.com Form Strategic Partnership

Circuit Cellar announced a strategic partnership with LinuxGizmos.com to offer an expanded resource of information and know-how on embedded electronics technology for developers, makers, students and educators, early adopters, product strategists, and technical decision makers with a keen interest in emerging embedded and IoT technologies. From March 1, 2018, LinuxGizmos became part of KCK Media Corp.
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MWC 2018 First Impressions: A Connected World Congress
by Joao Martins

MWC 2018 First Impressions: A Connected World Congress

A strange week we had, with most of the technology world focused on another edition of GSMA's Mobile World Congress (MWC), with the usual gush of new iPhone-clone announcements and most of the key semiconductor giants dividing their announcements with embedded world 2018, taking place at the same time in Nuremberg, Germany. Still, neither was much affected by the clash. MWC is more and more consumer electronics, autonomous cars, cloud solutions, and software developers pitching their latest ideas on social-engineered apps.
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Embedded World 2018 Confirms Record Attendance and Exhibitors Growth
by audioXpress Staff

Embedded World 2018 Confirms Record Attendance and Exhibitors Growth

In its closing report, NürnbergMesse confirmed that the 2018 edition of Embedded World - 26 - 28 February 2019, Nuremberg, Germany, has established a new record for the trade-show. Confirming more trade visitors, exhibitors and space, as well as a record 2.000 participants and speakers attending the annual conference sessions, Embedded World 2018 provided a clear sign of a positive momentum in all market segments for embedded electronics applications, with particular emphasis on IoT, industrial connected solutions and automotive.
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Qualcomm Introduces Smart Audio Platform and Speaker Development Kits for Multiple Voice Ecosystems
by Joao Martins

Qualcomm Introduces Smart Audio Platform and Speaker Development Kits for Multiple Voice Ecosystems

Following earlier demonstrations at CES 2018, Qualcomm introduced a series of new platforms, SoC and development kits targeting new advanced audio applications and smart speakers, including the support of key wireless technologies, voice and cloud ecosystems. Solutions include its Smart Audio Platform optimized for smart speakers, a 6-microphone far field voice platform qualified for Amazon AVS, Dolby Audio implementations for wireless speakers and much more.
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TDK Acquires Ultrasonic MEMS Sensing Solutions Developer Chirp Microsystems
by audioXpress Staff

TDK Acquires Ultrasonic MEMS Sensing Solutions Developer Chirp Microsystems

TDK Corporation announced that it has reached an agreement with Chirp Microsystems, a pioneer in high-performance ultrasonic sensing, headquartered in Berkeley, California. With the acquisition, Chirp becomes a wholly owned subsidiary of TDK, enhancing its existing technology in fingerprint sensors, MEMS sensors, and Piezoelectric transducer product lines. “TDK aims to be the leader in the ultrasonic MEMS sensors and solutions market,” says Shigenao Ishiguro, TDK’s President and CEO.
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CEVA Extends its IP Platforms for Bluetooth 5 and Wi-Fi Applications with RISC-V
by Joao Martins

CEVA Extends its IP Platforms for Bluetooth 5 and Wi-Fi Applications with RISC-V

Audio and voice signal processing specialists CEVA announced that the complete RivieraWaves suite of Bluetooth 5 (low energy and dual mode) and Wi-Fi 802.11a/b/g/n/ac/ax intellectual property (IP) platforms are now offered with an optional integrated open-source RISC-V MCU. These integration-ready system solutions are ideal for those manufacturers seeking freedom from standard 3rd party processor architectures.
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