Spikes & Isolation: The Art of Speaker Decoupling for Optimal Audio Performance
This contributed article by IsoAcoustics' founder and president is an interesting piece that sums up his vast experience in the field, working with professional audio engineers, loudspeaker designers, and music lovers all over the world. The article explores how speakers physically interact with their supporting surfaces, the key factors that affect speaker decoupling, and the pros and cons of many common isolation approaches.
Audio Manufacturing and Tariff Strategies Webinar, May 6
The Audio Product Development Alliance (APDA) is hosting a new live talk to discuss the current uncertainty in global manufacturing and trade. Audio manufacturing, tariffs, challenges, and strategies to manage a business in an unprecedented and unpredictable environment are the motivation for this conversation with Ben Yeung, Executive Director and Chief Strategy Officer at Fujikon Industrial, in Hong Kong. Join the live conversation next Tuesday, May 6.
Digigram Releases ALP280e and ALP280e-MIC PCIe Sound Cards
Digigram has announced the release of two new sound cards, ALP280e and ALP280e-MIC, as part of its ALP-X series. Available Q2 2025 from Digigram's network of distributors, the new ALP280e and ALP280e-MIC are the latest additions to the constantly growing range of sound cards launched in 2022. These low-profile cards deliver reliability and the audio quality required for the most demanding 24/7 operations.
Microspeakers to High-End Tweeters in Voice Coil May 2025
Voice Coil May 2025 is now available and in this issue, Vance Dickason explores the popular miniDSP Flex HTx processor, while Mike Klasco dives into the world of microspeakers. For this issue's Test Bench, Vance Dickason characterizes his first driver from the new Italian brand RS Speakers, a new TW 104.28 N/Ag 1.1” tweeter, and next measures the 27TFC/T 1” Soft Dome Tweeter from the SEAS Prestige Titan Line.
Shokz Unveils OpenDots ONE Clip-On Open-Ears
Shokz, the pioneer in bone conduction headsets that gradually is expanding its portfolio towards open-ear air conduction technology, announced the OpenDots ONE, a new design and form factor for the brand. These are clip-on earbuds with a design somewhere in between the Bose Ultra Open Earbuds and the Huawei FreeClip, but using Shokz's own air conduction approach, based on what it calls Bassphere technology, combining two facing dynamic drivers into a spherical module.
Genelec to Showcase Flagship 8381 Loudspeaker System at High End Munich
Genelec will be exhibiting at the 2025 High End Munich audio show, and showcasing its range of active loudspeaker systems, including the preview of a stunning new Piano Black version of the flagship 8381 floor-standing Adaptive Point Source model, complete with a complementary power amplifier unit specially optimized for floor-mounting. Genelec will also be demonstrating the 8341 and 8361 three-way coaxial point source models, and spotlighting its growing range of RAL color finishes.
LG and MediaTek Showcase Android-Based Concurrent Multi-User Framework Mobility Solution at Auto Shanghai 2025
LG Electronics (LG) and MediaTek showcased their Android-based Concurrent Multi-User (CMU) framework applied to In-Vehicle Infotainment (IVI) systems at the Auto Shanghai 2025 show, one of Asia's largest and most influential automotive exhibitions. The CMU framework is the first of its kind to be implemented on Google's Android Automotive OS (AAOS), and enables passengers to simultaneously use multiple displays on a single Android OS.
Dirac and MediaTek Partner to Advance In-Car Audio Experiences Through Integrated Automotive SoCs
Dirac and MediaTek announced a strategic collaboration to enhance in-car audio performance through the integration of Dirac's digital audio software into MediaTek's automotive-grade systems-on-chips (SoCs). Yes, software-defined vehicles benefit from a tighter integration at the chipset level, and the Swedish digital audio processing pioneer is determined to explore the possibilities with MediaTek's groundbreaking Dimensity Auto Cockpit chipsets.
Synaptics Unveils First Veros Triple Combo Family with Wi-Fi 7, Bluetooth 6.0 and Matter Support
Synaptics extended its Veros wireless portfolio with its first family of Wi-Fi 7 system-on-chips (SoCs) tailored for a broad category of connected devices. Comprising the SYN4390 and SYN4384, the scalable offering supports bandwidths up to 320MHz to deliver 5.8Gbps peak speed and low latency. The triple-combo SoCs integrate Wi-Fi 7 with Bluetooth 6.0 and Zigbee/Thread, support Matter, and are designed to minimize system cost and power consumption.
Arkamys Announces SoundStage Suite Integration with MediaTek's Dimensity Auto Cockpit Platform for In-Car Audio
Arkamys announced the compatibility of its SoundStage Suite with MediaTek's Dimensity Auto Cockpit platform. With this integration, original equipment manufacturers (OEMs) and Tier 1 suppliers can benefit from streamlined, premium sound solutions, allowing faster launches and scalable deployment in multiple vehicle segments, without compromising on cost or increasing complexity with additional hardware for in-car audio.