All items tagged with voice recognition and far-field voice pickup (52)

Development Kit for Amazon AVS Supports Far-field Voice Interaction with Multiple Microphone Array Options

January 10, 2019 by audioXpress Staff

Development Kit for Amazon AVS Supports Far-field Voice Interaction with Multiple Microphone Array Options

Microchip Technology, via its Microsemi Corporation subsidiary, announced that its AcuEdge ZLK38AVS Development Kit for Amazon Alexa Voice Service (AVS) now introduces far-field voice pick up and the flexibility to build devices with multiple mic array configurations. The audio front-end solution with one, two and three mic configurations reduces bill of materials costs while addressing the requirements of small-form-factor designs.

Creative Technology Introduces Nova Smart Multiroom Speaker with Amazon Alexa

November 15, 2018 by audioXpress Staff

Creative Technology Introduces Nova Smart Multiroom Speaker with Amazon Alexa

Creative Technology announced Creative Nova, a portable WiFi multiroom Smart Speaker with a light and sound mood-setting environment which the company calls "a Light & Sound Spa". The Nova features a powerful 5-driver design in a WiFi/Bluetooth high-performance speaker system with Amazon Alexa-enabled voice assistance, complete with far-field voice recognition. A design which the company believes will set it apart from other smart speakers, inspiring "a smarter lifestyle."

Sensory Improves Wake Word and Speech Recognition Accuracy with New High-Res Voice Front-End and Authentication

October 1, 2018 by audioXpress Staff

Sensory Improves Wake Word and Speech Recognition Accuracy with New High-Res Voice Front-End and Authentication

Sensory, the originator of wake words for personal assistants, raised the performance bar for always-listening wake word and speech recognition with significant upgrades to the embedded AI in its sixth generation of TrulyHandsfree, boosting the technology's already industry-leading wake word performance and accuracy by more than 65 percent. The new solution introduces upgraded turn-key voice interface solutions for devices of all shapes, sizes and power requirements.

Smart Speakers: Audio Design Rules for Voice-Enabled Devices

July 31, 2018 by Kevin Connor

Smart Speakers: Audio Design Rules for Voice-Enabled Devices

Because every R&D department in the planet is currently looking at implementing voice, and everyone's looking at audioXpress for guidance on how to design a smart speaker, in this edition Kevin Connor, shares his insider knowledge on the topic. Connor, a Cirrus Logic engineer, explains how to provide audio and voice solutions, and design products that sound great and respond reliably to voice commands, regardless of backend service. This article was originally published in audioXpress, January 2018.

Synaptics Teams up with Baidu in Launch of DuerOS Mobile Platform for Bluetooth Speakers, Headphones, and Wearables

July 25, 2018 by audioXpress Staff

Synaptics Teams up with Baidu in Launch of DuerOS Mobile Platform for Bluetooth Speakers, Headphones, and Wearables

Synaptics announced its AudioSmart far-field voice DSPs have been selected by Baidu, the leading Chinese language Internet search provider, for its new DuerOS Mobile Accessory (DMA) platform recently announced at the Baidu Create 2018 AI Developer Conference. Market applications enabled by combining Synaptics' low-power far-field voice DSP, with a Bluetooth connectivity IC and DuerOS, Baidu’s conversational AI system, includes a wide-variety of on-the-go products including Bluetooth speakers, headphones, wearables and automotive accessories.

Vesper Expands Engineering Team with Audio Expert Julian Aschieri

July 24, 2018 by audioXpress Staff

Vesper Expands Engineering Team with Audio Expert Julian Aschieri

Vesper, the developer of advanced piezoelectric sensors and piezoelectric MEMS pioneer, announced Julian Aschieri as VP, ASIC Engineering. Aschieri brings extensive experience designing audio and power management solutions as well as developing global engineering teams to the startup. Based in Boston, his new role will help expand Vesper's product line, creating new advanced ASIC designs. He is the startup's first hire since its Series B funding round in May 2018.

DSP Group Announces Ultra-Low-Power Development Kit with Far-Field Speech Accuracy for Amazon Alexa Voice Service

June 29, 2018 by audioXpress Staff

DSP Group Announces Ultra-Low-Power Development Kit with Far-Field Speech Accuracy for Amazon Alexa Voice Service

Wireless communications chipset solutions specialists DSP Group announced the availability of its HDClear 3-Microphone Development Kit for Amazon Alexa Voice Service (AVS). This Alexa certified solution features DBMD5, DSP Group’s advanced audio/voice processor, and its best-in-class HDClear voice enhancement processing technology, creating a complete development platform for low-power applications, including smart speakers, wearable computing devices, smart home devices and remote controls.

Aaware and Infineon Form Partnership to Develop Next-Generation Voice Solutions

June 27, 2018 by audioXpress Staff

Aaware and Infineon Form Partnership to Develop Next-Generation Voice Solutions

Infineon Technologies, and Aaware, Inc., an emerging supplier of sound capture technology for far-field, voice-enabled digital products, announced the formation of a partnership to launch a next-generation voice development platform to be released later this summer. Aaware’s Acoustically Aware technology is highly synergistic with Infineon’s digital MEMS microphone technology, combining to bring the best sound capture for extremely noisy environments in commercial and industrial applications.

Alango and Seeed Collaborate on Voice Interface Far-Field Technology

June 1, 2018 by audioXpress Staff

Alango and Seeed Collaborate on Voice Interface Far-Field Technology

Alango announced its collaboration with Seeed Technology providing far-field voice enhancement on the Seeed ReSpeaker Core v2.0. Seeed's ReSpeaker Core v2.0 is designed as a multifunctional development board for voice interface applications. The platform is based on the Rockchip RK3229, a quad-core ARM Cortex A7, running up to 1.5GHz, with 1GB RAM. The board features a six-microphone array with Alango's Voice Enhancement Package "VEP" and is able to be customized upon request.

Harman Implements DSP Group’s SmartVoice Technology for their Sonique Total Voice Solution

February 20, 2018 by Joao Martins

Harman Implements DSP Group’s SmartVoice Technology for their Sonique Total Voice Solution

Voice UI chipset specialist DSP Group, and Harman International, a wholly-owned subsidiary of Samsung Electronics, announced their cooperation implementing voice input technology, based on DSP Group’s SmartVoice Audio/voice SoC and HDClear far-field multi-mic algorithms. The cooperation will enable expanding Harman's Sonique Total Voice Solution platform into a new generation of voice-enabled products.

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