All items tagged with ultrasonic (7)

WiSA Technologies Acquires Select Technologies from Data Vault Holdings and Transforms Into Datavault Inc.

September 4, 2024 by Joao Martins

WiSA Technologies Acquires Select Technologies from Data Vault Holdings and Transforms Into Datavault Inc.

WiSA Technologies announced that it has executed a definitive asset purchase agreement of select intellectual property and information technology assets from Data Vault Holdings, a privately held company, for $210 million in shares of common stock of WiSA Technologies. WiSA Technologies acquires the High-Performance Computing (HPC) Software and Acoustic Technologies IP from Data Vault Holdings and intends to change its name to Datavault Inc.

Patent Review: Self-Bias Emitter Circuit

November 1, 2023 by James Croft

Patent Review: Self-Bias Emitter Circuit

This article reviews an intriguing new patent awarded to Turtle Beach Corp. addressing a new emitter circuit for providing a bias voltage, which is key for the development of electrostatic loudspeakers. Extremely aware of the techniques and historical perspective of the development in this area, Croft provides a complete overview of all the challenges, implications and merits of this patent and prior art. This article was originally published in Voice Coil, July 2018.

Patent Review: Parametric System for Generating a Sound Halo and Methods of Use Thereof

March 2, 2023 by James Croft

Patent Review: Parametric System for Generating a Sound Halo and Methods of Use Thereof

This review looks at a patent of parametric loudspeaker awarded in November 2016 to Luke Batchelder (Somers, NY), and J. Samuel Batchelder (Somers, NY) on behalf of Convey Technology, Inc. (Somers, NY). As James Croft (Croft Acoustical) comments in this patent review: "The parametric loudspeaker is one of those technologies that get rediscovered and “invented” about every 10 years." This article was originally published in Voice Coil, February 2017.

SonicEdge MEMS Ultrasound Speaker-In-Chip: Next Gen MEMS for TWS Earbuds and Hearing Aids

February 24, 2023 by Mike Klasco

SonicEdge MEMS Ultrasound Speaker-In-Chip: Next Gen MEMS for TWS Earbuds and Hearing Aids

Mike Klasco writes all about the cutting-edge SonicEdge MEMS Ultrasound Speaker-In-Chip. A next-gen MEMS solution for TWS earbuds, hearing aids, and hearables. Entering production in 2023, this unique ultrasonic shutter MEMS-based speaker system represents a decade's work in a unique topology. The core of the design is one or more apertures driven by the ultrasonic carrier signal and one or more movable and over-sized obstruction elements that are configured to modulate the ultrasonic carrier signal (think of a shutter) thereby generating audio.

Parso Wireless Wearable Unidirectional Speaker Delivers Personal Sound

December 15, 2021 by Joao Martins

Parso Wireless Wearable Unidirectional Speaker Delivers Personal Sound

Japanese company AFUR has announced the launch of Parso, a wireless, wearable, unidirectional speaker design that "only you can hear." The highly directional speaker uses ultrasonic elements to achieve its narrow directivity for personal listening. The new Wearable Parametric Speaker (Patent Pending) design is scheduled to enter production in mid 2022, but the company is promoting the concept to evaluate market interest in new application areas.

TDK Introduces Lowest Pulse Density Modulation Multi-Mode MEMS Microphone With Acoustic Activity Detect

January 13, 2021 by audioXpress Staff

TDK Introduces Lowest Pulse Density Modulation Multi-Mode MEMS Microphone With Acoustic Activity Detect

InvenSense, a TDK Group company, announced a comprehensive portfolio of new technology solutions during the 2021 Consumer Electronics Showcase. Among the expanded MEMS portfolio, the new T5838 SmartSound MEMS microphone offers a low power mode of just 130uAmps and a high-quality mode of 330uAmps, while supporting a dynamic range of 68dN SNR and 133dB AOP at 20kHz bandwidth. Optimized for smartphones, microphone arrays, smart speakers, and headsets, the T5838 supports configurable wake-on-sound at power levels as low as 20 µA.

Chirp and DSP Group Unveil Reference Design for Sound-Based Data Transmission

October 14, 2019 by audioXpress Staff

Chirp and DSP Group Unveil Reference Design for Sound-Based Data Transmission

Chirp, the pioneer of data-over-sound technology, and DSP Group, the specialist in wireless chipsets for smart-enabled devices, announced a turnkey solution leveraging embedded data-over-sound to improve user experiences with enhanced provisioning for consumer applications. The design kit combines Chirp’s ultrasonic signaling protocol for smart-enabled devices with DSP Group’s SmartVoice technology to allow connectivity between nearby devices without requiring any set up, pairing, or configuration.