All items tagged with sensor fusion (32)

CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection

June 10, 2022 by Cristina Costa

CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection

CEVA announced an expansion to its family of sensor fusion products with the introduction of the FSP201, a high-performance and low-power sensor hub MCU that delivers precise, accurate sensor fusion for motion tracking, heading and orientation detection. The FSP201 is ideal for consumer robotics and other emerging smart devices employing sensor fusion technologies, including XR glasses, 3D audio headsets and the wide range of 6-axis motion use cases across IoT and the metaverse.

xMEMS Announces Montara Pro MEMS Drivers with Integrated DynamicVent for Intelligent TWS Earbuds and Hearing Aids

January 3, 2022 by audioXpress Staff

xMEMS Announces Montara Pro MEMS Drivers with Integrated DynamicVent for Intelligent TWS Earbuds and Hearing Aids

xMEMS Labs introduced Montara Pro, a MEMS microspeaker with an integrated solution that opens or closes the vent by sensor fusion input from the system DSP. This approach enables smart TWS earbuds and hearing aids that create best-of-both-worlds user experiences, combining the benefits of closed-fit (occluded) and open-fit earbuds. xMEMS is providing first demonstrations of Montara Pro this week at the Consumer Electronics Show in Las Vegas at Venetian Suite 29-325.

AONDevices Announces Ultra-Low Power AON1100 Always-On Edge AI Processor and Development Kit

December 17, 2021 by audioXpress Staff

AONDevices Announces Ultra-Low Power AON1100 Always-On Edge AI Processor and Development Kit

AONDevices, a Californian startup provider of ultra-low power, high-performance processors for edge AI applications, announced that engineering samples of its new AON1100 processor are now available. The AON1100 enables sensing capabilities in battery-powered always-on devices that need to support local wake words, voice commands, sound recognition, context recognition, and sensor fusion at high accuracy.

Upgrade Sensing for Your True Wireless Stereo Designs. Why Buy Four Chips if You Only Need One?

October 1, 2021 by Special Content

Upgrade Sensing for Your True Wireless Stereo Designs. Why Buy Four Chips if You Only Need One?

Azoteq recently released its second-generation four-in-one chip for earbuds. The IQS7222A IC is a multifunctional capacitive, inductive, and Hall-effect sensor with additional temperature sensing for reference tracking. The 1.62 x 1.62 mm chip allows you to add a touch-and-swipe interface, wear detection, docking detection and your choice of an inductive waterproof button or the inductive force-sensing features.

Sondrel Unveils Edge Computing IP Platform for Smart Devices

September 8, 2021 by audioXpress Staff

Sondrel Unveils Edge Computing IP Platform for Smart Devices

Sondrel has created a powerful, quad core IP platform that is ideal for ASIC solutions for remote gathering and processing of video and data at the Edge with secure onwards transmission of the results. The SFA 200 reference design is targeted at battery powered applications in Smart Home, Sensor Fusion, voice-control, and other devices where a compact chip can add processing ‘smarts’ by providing local end-point data processing for data collection and analysis along with inference processing.

Cadence Announces New Tensilica FloatingPoint DSP Family for Low Power AI/ML

June 18, 2021 by audioXpress Staff

Cadence Announces New Tensilica FloatingPoint DSP Family for Low Power AI/ML

Cadence Design Systems unveiled the Cadence Tensilica FloatingPoint DSP family, optimized for power, performance and area (PPA). The new DSP IP cores extend from small, ultra-low power to very high performance and are well-suited for a broad array of applications, from energy-efficient solutions for battery powered devices to artificial intelligence/machine learning (AI/ML), sensor fusion, object tracking and augmented reality applications in the mobile, automotive, and consumer markets.

Elliptic Labs Optimizes Its Advanced Virtual Sensors for Cadence Tensilica HiFi DSPs

March 31, 2021 by audioXpress Staff

Elliptic Labs Optimizes Its Advanced Virtual Sensors for Cadence Tensilica HiFi DSPs

Elliptic Labs, the Norwegian software sensor technology company, announced a collaboration with Cadence Design Systems to optimize its machine learning algorithms on Cadence Tensilica HiFi DSPs. Enabling Elliptic Labs to expand its software sensor user interfaces to more embedded systems, while simultaneously reducing power consumption for energy-critical applications, this collaboration benefits manufacturers in a wide range of markets, including mobile consumer devices, and automotive.

Contextual Awareness: What Is It, and How Is It Being Used?

March 17, 2021 by Elia Shenberger

Contextual Awareness: What Is It, and How Is It Being Used?

Context-aware devices, such as the embedded smartphone keyboards, have been around for some time, though in a very limited form. By learning regularly used names, locations and phrases, they seem to know your next move, that is, predictive text. Similarly, but at a higher level, the next generation of smart audio devices will combine user-specific data, such as location, preferences and other device sensor data, including audio, to better serve the user.

DSP Concepts and CloudNav Partnership Brings Best-in-Class Sensor Fusion Technology to Audio Weaver

February 24, 2021 by audioXpress Staff

DSP Concepts and CloudNav Partnership Brings Best-in-Class Sensor Fusion Technology to Audio Weaver

DSP Concepts, the audio platform powering more than 50M devices for many of the world’s best consumer and automotive brands, announced a partnership with CloudNav to bring its sensor fusion technology to Audio Weaver. This means that developers can seamlessly deploy CloudNav’s Performance Fusion technology through Audio Weaver’s drag-and-drop graphical interface to integrate and automatically calibrate inertial sensors for optimal product performance.

CEVA Introduces Bluebud Turnkey IP Wireless Audio Platform for TWS Earbuds and Bluetooth Audio Devices

February 22, 2021 by Joao Martins

CEVA Introduces Bluebud Turnkey IP Wireless Audio Platform for TWS Earbuds and Bluetooth Audio Devices

CEVA unveiled Bluebud, a highly-integrated wireless audio platform aimed at standardizing DSP-enabled Bluetooth audio IP for fast-growing applications, including True Wireless Stereo (TWS) earbuds, hearables, gaming headsets, smartwatches and other wearable devices. The solution fully supports Bluetooth 5.2 and LE Audio design and is ready to support brands in the transition from Bluetooth Classic.

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