All items tagged with sensor fusion (37)

Syntiant Partners with Telink and Murata to Present New Edge AI Audio Solutions at CES 2023

December 26, 2022 by Joao Martins

Syntiant Partners with Telink and Murata to Present New Edge AI Audio Solutions at CES 2023

Syntiant is heading to CES 2023 with an exciting range of announcements and presentations of end-to-end edge AI solutions for always-on applications. The company will unveil a new reference design created in partnership with Telink that will enable ODMs and OEMs to easily and quickly deploy complete, ultra-low-power, deep learning voice processing applications in remote controls. Another major announcement is the launch of the Murata Type2DA neural decision processor module for edge AI audio and sensor applications.

Gaudio Lab Audio Technologies Recognized with Two CES 2023 Innovation Awards

December 2, 2022 by audioXpress Staff

Gaudio Lab Audio Technologies Recognized with Two CES 2023 Innovation Awards

Gaudio Lab, the innovative audio technology solutions company from Seoul, South Korea, received two CES 2023 Innovation Awards ahead of the company's presentation at the world's biggest consumer technology trade show, taking place in Las Vegas, Nevada, 5-8 January, 2023. Gaudio Lab was honored with two awards for its Loudness Management 1 (LM1) technology, and for the Gaudio Spatial Audio (GSA) audio software for wireless earbuds.

CEVA Celebrates 15 Billionth CEVA-powered Chip Shipped

August 9, 2022 by audioXpress Staff

CEVA Celebrates 15 Billionth CEVA-powered Chip Shipped

CEVA, Inc., the wireless connectivity and smart sensing technologies licensing company, announced that cumulative royalty-bearing chip shipments that include CEVA IP surpassed 15 billion units during the second quarter of 2022. This significant milestone has been achieved as CEVA approaches it’s 20-year anniversary of being a public company. While the first 10 billion CEVA-powered shipments spanned more than 15 years, the next 5 billion shipments took less than three and a half years.

Infineon Launches Industry’s First Battery-Powered AI/ML-Based Acoustic Event Detection and Sensor Fusion Alarm System

July 5, 2022 by Cristina Costa

Infineon Launches Industry’s First Battery-Powered AI/ML-Based Acoustic Event Detection and Sensor Fusion Alarm System

Infineon Technologies introduced its battery-powered Smart Alarm System (SAS), a technology platform that achieves high accuracy and very low-power operation using sensor fusion based on artificial intelligence/machine learning (AI/ML). This technology combined with low-power wake-on acoustic event detection allows compact designs that exceed the detection accuracy of acoustic-only alarm systems used today.

Synaptics’ Triple Combo Wireless System-on-Chip Wins "2022 Best of Sensors" Award

June 29, 2022 by audioXpress Staff

Synaptics’ Triple Combo Wireless System-on-Chip Wins "2022 Best of Sensors" Award

Synaptics received the "2022 Best of Sensors” Award for Connectivity with its SYN4381 Triple Combo, the industry’s first Matter-compliant SoC with integrated Wi-Fi 6/6E, Bluetooth 5.2, and 802.15.4/Thread. The award was presented at Sensors Converge 2022 in a ceremony that honors the best technologies in the large and growing ecosystem. Synaptics’ FlexSense 4-in-1 sensor fusion processor was also recognized as a Finalist in the “Best of Sensors” Awards’ for wearables.

CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection

June 10, 2022 by Cristina Costa

CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection

CEVA announced an expansion to its family of sensor fusion products with the introduction of the FSP201, a high-performance and low-power sensor hub MCU that delivers precise, accurate sensor fusion for motion tracking, heading and orientation detection. The FSP201 is ideal for consumer robotics and other emerging smart devices employing sensor fusion technologies, including XR glasses, 3D audio headsets and the wide range of 6-axis motion use cases across IoT and the metaverse.

xMEMS Announces Montara Pro MEMS Drivers with Integrated DynamicVent for Intelligent TWS Earbuds and Hearing Aids

January 3, 2022 by audioXpress Staff

xMEMS Announces Montara Pro MEMS Drivers with Integrated DynamicVent for Intelligent TWS Earbuds and Hearing Aids

xMEMS Labs introduced Montara Pro, a MEMS microspeaker with an integrated solution that opens or closes the vent by sensor fusion input from the system DSP. This approach enables smart TWS earbuds and hearing aids that create best-of-both-worlds user experiences, combining the benefits of closed-fit (occluded) and open-fit earbuds. xMEMS is providing first demonstrations of Montara Pro this week at the Consumer Electronics Show in Las Vegas at Venetian Suite 29-325.

AONDevices Announces Ultra-Low Power AON1100 Always-On Edge AI Processor and Development Kit

December 17, 2021 by audioXpress Staff

AONDevices Announces Ultra-Low Power AON1100 Always-On Edge AI Processor and Development Kit

AONDevices, a Californian startup provider of ultra-low power, high-performance processors for edge AI applications, announced that engineering samples of its new AON1100 processor are now available. The AON1100 enables sensing capabilities in battery-powered always-on devices that need to support local wake words, voice commands, sound recognition, context recognition, and sensor fusion at high accuracy.

Upgrade Sensing for Your True Wireless Stereo Designs. Why Buy Four Chips if You Only Need One?

October 1, 2021 by Special Content

Upgrade Sensing for Your True Wireless Stereo Designs. Why Buy Four Chips if You Only Need One?

Azoteq recently released its second-generation four-in-one chip for earbuds. The IQS7222A IC is a multifunctional capacitive, inductive, and Hall-effect sensor with additional temperature sensing for reference tracking. The 1.62 x 1.62 mm chip allows you to add a touch-and-swipe interface, wear detection, docking detection and your choice of an inductive waterproof button or the inductive force-sensing features.

Sondrel Unveils Edge Computing IP Platform for Smart Devices

September 8, 2021 by audioXpress Staff

Sondrel Unveils Edge Computing IP Platform for Smart Devices

Sondrel has created a powerful, quad core IP platform that is ideal for ASIC solutions for remote gathering and processing of video and data at the Edge with secure onwards transmission of the results. The SFA 200 reference design is targeted at battery powered applications in Smart Home, Sensor Fusion, voice-control, and other devices where a compact chip can add processing ‘smarts’ by providing local end-point data processing for data collection and analysis along with inference processing.

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