All items tagged with sensor fusion (37)

Cadence Announces New Tensilica FloatingPoint DSP Family for Low Power AI/ML

June 18, 2021 by audioXpress Staff

Cadence Announces New Tensilica FloatingPoint DSP Family for Low Power AI/ML

Cadence Design Systems unveiled the Cadence Tensilica FloatingPoint DSP family, optimized for power, performance and area (PPA). The new DSP IP cores extend from small, ultra-low power to very high performance and are well-suited for a broad array of applications, from energy-efficient solutions for battery powered devices to artificial intelligence/machine learning (AI/ML), sensor fusion, object tracking and augmented reality applications in the mobile, automotive, and consumer markets.

Elliptic Labs Optimizes Its Advanced Virtual Sensors for Cadence Tensilica HiFi DSPs

March 31, 2021 by audioXpress Staff

Elliptic Labs Optimizes Its Advanced Virtual Sensors for Cadence Tensilica HiFi DSPs

Elliptic Labs, the Norwegian software sensor technology company, announced a collaboration with Cadence Design Systems to optimize its machine learning algorithms on Cadence Tensilica HiFi DSPs. Enabling Elliptic Labs to expand its software sensor user interfaces to more embedded systems, while simultaneously reducing power consumption for energy-critical applications, this collaboration benefits manufacturers in a wide range of markets, including mobile consumer devices, and automotive.

Contextual Awareness: What Is It, and How Is It Being Used?

March 17, 2021 by Elia Shenberger

Contextual Awareness: What Is It, and How Is It Being Used?

Context-aware devices, such as the embedded smartphone keyboards, have been around for some time, though in a very limited form. By learning regularly used names, locations and phrases, they seem to know your next move, that is, predictive text. Similarly, but at a higher level, the next generation of smart audio devices will combine user-specific data, such as location, preferences and other device sensor data, including audio, to better serve the user.

DSP Concepts and CloudNav Partnership Brings Best-in-Class Sensor Fusion Technology to Audio Weaver

February 24, 2021 by audioXpress Staff

DSP Concepts and CloudNav Partnership Brings Best-in-Class Sensor Fusion Technology to Audio Weaver

DSP Concepts, the audio platform powering more than 50M devices for many of the world’s best consumer and automotive brands, announced a partnership with CloudNav to bring its sensor fusion technology to Audio Weaver. This means that developers can seamlessly deploy CloudNav’s Performance Fusion technology through Audio Weaver’s drag-and-drop graphical interface to integrate and automatically calibrate inertial sensors for optimal product performance.

CEVA Introduces Bluebud Turnkey IP Wireless Audio Platform for TWS Earbuds and Bluetooth Audio Devices

February 22, 2021 by Joao Martins

CEVA Introduces Bluebud Turnkey IP Wireless Audio Platform for TWS Earbuds and Bluetooth Audio Devices

CEVA unveiled Bluebud, a highly-integrated wireless audio platform aimed at standardizing DSP-enabled Bluetooth audio IP for fast-growing applications, including True Wireless Stereo (TWS) earbuds, hearables, gaming headsets, smartwatches and other wearable devices. The solution fully supports Bluetooth 5.2 and LE Audio design and is ready to support brands in the transition from Bluetooth Classic.

CEVA Expands Possibilities in Sensor Hub DSPs with 2nd Generation SensPro Family

January 13, 2021 by audioXpress Staff

CEVA Expands Possibilities in Sensor Hub DSPs with 2nd Generation SensPro Family

CEVA introduced its 2nd generation SensPro DSP family, a hub for AI and DSP processing workloads associated with a wide range of sensors including camera, Radar, LiDAR, Time-of-Flight, microphones and inertial measurement units (IMUs). The new, lower power, SensPro2 DSPs deliver up to 10X performance improvement versus CEVA-BX2 DSP for AI networks used for voice assistants, natural language processing and spatial audio. They are also automotive-ready with high-precision floating-point capability.

DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor

January 7, 2021 by audioXpress Staff

DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor

DSP Group announced the DBM10, a new low-power, cost-effective artificial intelligence (AI) and machine learning (ML) system-on-chip (SoC). This new open platform, with a cost- and power-optimized architecture, enables rapid development of AI and ML applications for mobile, wearables, hearables, and connected devices in general. It provides a complete platform in terms of voice and audio processing, without compromising the battery life of new designs, and allowing developers to implement their own differentiating algorithms.

CEVA Establishes Partnership with DARPA for Technology Innovation

January 5, 2021 by audioXpress Staff

CEVA Establishes Partnership with DARPA for Technology Innovation

CEVA announced an open licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation for DARPA programs. The commercial partnership, as part of the DARPA Toolbox initiative, establishes an access framework under which DARPA organizations can access all of CEVA’s commercially available IPs, tools and support to expedite their programs. This provides DARPA researchers with access to CEVA’s portfolio of wireless connectivity and smart sensing IPs.

Webinar December 8: Your Hearables and True Wireless Designs Need Sensor Fusion

December 7, 2020 by audioXpress Staff

Webinar December 8: Your Hearables and True Wireless Designs Need Sensor Fusion

Want to understand the complexities of context awareness and user interface for the hearables market? Attend a quick webinar December 8 to learn about sensor fusion solutions for TWS designs. OEMs and IC companies need to manage sensor fusion for the latest cutting edge wearables, hearables and true wireless designs. Product managers and design, system, and product engineers wanting to understand the complexities of context awareness and user interface for the hearables market should join CEVA's experts Seth Sternberg and Ken Walker to learn more.

Elliptic Labs Expands its Ultrasound Sensing Framework to More Devices and Mobile Platforms

November 19, 2020 by Joao Martins

Elliptic Labs Expands its Ultrasound Sensing Framework to More Devices and Mobile Platforms

Norwegian company Elliptic Labs has successfully introduced its ultrasound sensing technology to the market, leveraging early agreements with major chip suppliers to the IT and mobile industries. Following partnerships with Texas Instruments, Infineon, Knowles, Cirrus Logic and AAC Technologies, at the implementation level, Elliptic Labs this year expanded its support directly with chipset manufacturers ARM, Intel, Qualcomm and more recently MediaTek. And the company's efforts in ultrasound-based sensing are just in early stages.

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