All items tagged with sensor fusion (34)

DSP Concepts and CloudNav Partnership Brings Best-in-Class Sensor Fusion Technology to Audio Weaver

February 24, 2021 by audioXpress Staff

DSP Concepts and CloudNav Partnership Brings Best-in-Class Sensor Fusion Technology to Audio Weaver

DSP Concepts, the audio platform powering more than 50M devices for many of the world’s best consumer and automotive brands, announced a partnership with CloudNav to bring its sensor fusion technology to Audio Weaver. This means that developers can seamlessly deploy CloudNav’s Performance Fusion technology through Audio Weaver’s drag-and-drop graphical interface to integrate and automatically calibrate inertial sensors for optimal product performance.

CEVA Introduces Bluebud Turnkey IP Wireless Audio Platform for TWS Earbuds and Bluetooth Audio Devices

February 22, 2021 by Joao Martins

CEVA Introduces Bluebud Turnkey IP Wireless Audio Platform for TWS Earbuds and Bluetooth Audio Devices

CEVA unveiled Bluebud, a highly-integrated wireless audio platform aimed at standardizing DSP-enabled Bluetooth audio IP for fast-growing applications, including True Wireless Stereo (TWS) earbuds, hearables, gaming headsets, smartwatches and other wearable devices. The solution fully supports Bluetooth 5.2 and LE Audio design and is ready to support brands in the transition from Bluetooth Classic.

CEVA Expands Possibilities in Sensor Hub DSPs with 2nd Generation SensPro Family

January 13, 2021 by audioXpress Staff

CEVA Expands Possibilities in Sensor Hub DSPs with 2nd Generation SensPro Family

CEVA introduced its 2nd generation SensPro DSP family, a hub for AI and DSP processing workloads associated with a wide range of sensors including camera, Radar, LiDAR, Time-of-Flight, microphones and inertial measurement units (IMUs). The new, lower power, SensPro2 DSPs deliver up to 10X performance improvement versus CEVA-BX2 DSP for AI networks used for voice assistants, natural language processing and spatial audio. They are also automotive-ready with high-precision floating-point capability.

DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor

January 7, 2021 by audioXpress Staff

DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor

DSP Group announced the DBM10, a new low-power, cost-effective artificial intelligence (AI) and machine learning (ML) system-on-chip (SoC). This new open platform, with a cost- and power-optimized architecture, enables rapid development of AI and ML applications for mobile, wearables, hearables, and connected devices in general. It provides a complete platform in terms of voice and audio processing, without compromising the battery life of new designs, and allowing developers to implement their own differentiating algorithms.

CEVA Establishes Partnership with DARPA for Technology Innovation

January 5, 2021 by audioXpress Staff

CEVA Establishes Partnership with DARPA for Technology Innovation

CEVA announced an open licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation for DARPA programs. The commercial partnership, as part of the DARPA Toolbox initiative, establishes an access framework under which DARPA organizations can access all of CEVA’s commercially available IPs, tools and support to expedite their programs. This provides DARPA researchers with access to CEVA’s portfolio of wireless connectivity and smart sensing IPs.

Webinar December 8: Your Hearables and True Wireless Designs Need Sensor Fusion

December 7, 2020 by audioXpress Staff

Webinar December 8: Your Hearables and True Wireless Designs Need Sensor Fusion

Want to understand the complexities of context awareness and user interface for the hearables market? Attend a quick webinar December 8 to learn about sensor fusion solutions for TWS designs. OEMs and IC companies need to manage sensor fusion for the latest cutting edge wearables, hearables and true wireless designs. Product managers and design, system, and product engineers wanting to understand the complexities of context awareness and user interface for the hearables market should join CEVA's experts Seth Sternberg and Ken Walker to learn more.

Elliptic Labs Expands its Ultrasound Sensing Framework to More Devices and Mobile Platforms

November 19, 2020 by Joao Martins

Elliptic Labs Expands its Ultrasound Sensing Framework to More Devices and Mobile Platforms

Norwegian company Elliptic Labs has successfully introduced its ultrasound sensing technology to the market, leveraging early agreements with major chip suppliers to the IT and mobile industries. Following partnerships with Texas Instruments, Infineon, Knowles, Cirrus Logic and AAC Technologies, at the implementation level, Elliptic Labs this year expanded its support directly with chipset manufacturers ARM, Intel, Qualcomm and more recently MediaTek. And the company's efforts in ultrasound-based sensing are just in early stages.

CEVA and VisiSonics Offer 3D Spatial Audio Development for True Wireless Earbuds and Headphones

September 24, 2020 by audioXpress Staff

CEVA and VisiSonics Offer 3D Spatial Audio Development for True Wireless Earbuds and Headphones

CEVA and VisiSonics, a developer of patented 3D spatial audio technologies, announced that the companies have collaborated closely together to develop a comprehensive 3D spatial audio solution for embedded devices, including true wireless audio (TWS) earbuds, headphones and other hearables. The collaboration combines VisiSonics' RealSpace 3D audio software optimized for CEVA’s low power audio and sensor hub DSPs together with CEVA’s MotionEngine head tracking algorithms running on its BNO080 9-axis System in Package (SiP).

CEVA Extends Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software

September 22, 2020 by audioXpress Staff

CEVA Extends Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software

In the wake of the acquisition of the Hillcrest Laboratories (Hillcrest Labs) business from InterDigital in mid-2019, CEVA now introduced the Hillcrest Labs MotionEngine Hear, a sensor and processor agnostic embedded software solution for hearable devices. The new solution allows SoC vendors, OEMs and ODMs to take advantage of a configurable sensor fusion platform to add intuitive user interface, gesture control, activity tracking and spatial audio capabilities to hearable devices.

Our Future Car: Audio Bubbles, Sterile Cockpits, New Business Models

July 8, 2020 by Elia Shenberger

Our Future Car: Audio Bubbles, Sterile Cockpits, New Business Models

We probably listen to more music and podcasts in our cars than anywhere else. Which means this is where we’re pushing the boundaries of audio experience — less noise, personalized sound zones, and control. And we’re more aware of the safety implications, not distracting or tiring the driver. This article was published in audioXpress, June 2020.

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