All items tagged with product development (920)
XMOS VocalFusion 2-Mic Dev Kit for Alexa Voice Service Qualified by Amazon
October 29, 2019 by audioXpress Staff

XMOS VocalFusion 2-Mic Dev Kit for Alexa Voice Service Qualified by Amazon

Amazon has qualified the VocalFusion 2-mic dev kit for Alexa Voice Services launched by XMOS for smart TVs and set-top boxes in July 2019. The qualification highlights the opportunity for manufacturers to build Amazon Alexa voice capabilities into their products more easily and cost effectively than ever before. Amazon highlights the product’s engineering innovation, enabling lower cost voice capabilities with all the performance of a 4-mic solution, and paving the way for mass market implementation of far-field applications.
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Sonion Combines Voice Pick Up Bone Sensor With Qualcomm Bluetooth SoC to Improve Speech Intelligibility
October 21, 2019 by audioXpress Staff

Sonion Combines Voice Pick Up Bone Sensor With Qualcomm Bluetooth SoC to Improve Speech Intelligibility

Sonion, the manufacturer of components and solutions for hearing aids and in-ear headphones, announced that it is now a member of the Qualcomm Extension Program and will offer the Sonion Voice Pick Up Bone Sensor on the Qualcomm Ultra-Low Power QCC5100 Bluetooth SoC series in Q1 2020. The combination will allow other audio manufacturers to implement reliable voice quality and voice recognition applications that are not hindered by surrounding noise.
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Chirp and DSP Group Unveil Reference Design for Sound-Based Data Transmission
October 14, 2019 by audioXpress Staff

Chirp and DSP Group Unveil Reference Design for Sound-Based Data Transmission

Chirp, the pioneer of data-over-sound technology, and DSP Group, the specialist in wireless chipsets for smart-enabled devices, announced a turnkey solution leveraging embedded data-over-sound to improve user experiences with enhanced provisioning for consumer applications. The design kit combines Chirp’s ultrasonic signaling protocol for smart-enabled devices with DSP Group’s SmartVoice technology to allow connectivity between nearby devices without requiring any set up, pairing, or configuration.
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The NXP NXH3670 Enables Ideal Wireless Headset Experiences
October 10, 2019 by Special Content

The NXP NXH3670 Enables Ideal Wireless Headset Experiences

Inspired by a wish to enhance gaming audio, NXP Semiconductors designed a single-chip, high performance wireless audio streaming solution. The NxH3670 constitutes a highly integrated, single-chip ultra-low-power wireless transceiver with embedded MCU, targeted at wireless audio streaming for gaming headsets at very low latency. Check out NXP’s proprietary ultra-low power, 2.4 GHz wireless gaming headphone solution. Sponsored Content by NXP Semiconductors.
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Skyworks Connectivity Modules Powering Next Generation Wi-Fi 6 Applications
October 10, 2019 by audioXpress Staff

Skyworks Connectivity Modules Powering Next Generation Wi-Fi 6 Applications

Skyworks Solutions announced that its advanced connectivity solutions are powering next generation Wi-Fi 6 (802.11ax) devices from the world’s leading connected home and mesh network providers, including Arris, Asus, D-Link, Netgear, Ruckus and TP-Link. Specifically, Skyworks’ modules are being leveraged in all of the latest best-selling Wi-Fi 6 routers.
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Updating the Rules on Amplifier Metrics
October 9, 2019 by Jens Tybo Jensen

Updating the Rules on Amplifier Metrics

This article shares a new important insight on modern Class-D amplification from the experienced perspective of Jens Tybo Jensen - part of the founding team at Merus Audio, and now head of Class D Audio Marketing and Applications at Infineon. The author states that it may be time to rethink Class D audio design and measurement practices, and he details what multilevel Class D amplification can do for new product designs. This article was originally published in audioXpress, October 2019.
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Microchip Introduces New Bluetooth 5.0-Qualified, Dual-Mode Audio IC and Certified Module with LDAC Codec Support
October 8, 2019 by Joao Martins

Microchip Introduces New Bluetooth 5.0-Qualified, Dual-Mode Audio IC and Certified Module with LDAC Codec Support

Microchip introduced the new BM83 SoC, a Bluetooth 5.0 certified dual-mode audio module that contains an on-board Bluetooth stack and audio profiles and supports 24-bit/96kHz high-resolution audio formats to enable high-fidelity wireless audio, including support for Sony’s high fidelity LDAC codec. The combined solution is intended for both new speaker and headphone designs, offering differentiated features.
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NXP Announces New Dual-Core Arm Cortex-M Based GHz Crossover Microcontroller for Advanced Machine Learning Applications
October 4, 2019 by audioXpress Staff

NXP Announces New Dual-Core Arm Cortex-M Based GHz Crossover Microcontroller for Advanced Machine Learning Applications

NXP Semiconductors announced the i.MX RT1170 family of crossover MCUs that combines unprecedented levels of performance, reliability, and integration to propel industrial, automotive and consumer machine learning applications. The NXP i.MX RT1170 family reinforces NXP’s commitment to advance edge computing with its EdgeVerse portfolio of solutions and marks a technology breakthrough with MCUs that run up to 1GHz while maintaining low-power efficiency.
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TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors
October 4, 2019 by Cristina Costa

TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

Following its acquisition of Chirp Microsystems in February 2018, TDK Corporation now announced the immediate availability of the latest Chirp SmartSonic platform family of ultrasonic sensor time-of-flight (ToF) solutions. The SmartSonic platform is currently available with the Chirp CH-101, an ultra-low power ultrasonic ToF range sensor that provides millimeter-accurate range measurements up to 1.2m, independent of target color and transparency.
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Dirac and RHA Announce Commitment to Explore Next-Generation of Headphone Sound
September 26, 2019 by audioXpress Staff

Dirac and RHA Announce Commitment to Explore Next-Generation of Headphone Sound

Sound processing pioneer Dirac announced a commercial agreement with RHA to explore the integration of Dirac’s latest audio algorithms into the British manufacturer's headphones. According to the Swedish company, "the collaboration with RHA marks an important step for Dirac as it establishes itself as a global leader in digital sound optimization solutions for the headphone market – as it has for the luxury automotive, home theater, and mobile markets." RHA says this relationship with Dirac reinforces the company’s mission to deliver the best possible audio quality.
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