All items tagged with product development (903)
STMicroelectronics Unveils World’s First MCU Edge-AI Developer Cloud
February 2, 2023 by Cristina Costa

STMicroelectronics Unveils World’s First MCU Edge-AI Developer Cloud

STMicroelectronics continues to expand its solutions for embedded AI developers and data scientists with a new, industry-first set of tools and services to get edge AI technology on the market faster and with less complexity by aiding hardware and software decision-making. The STM32Cube.AI Developer Cloud opens access to an extensive suite of online development tools built around the industry-leading STM32 family of microcontrollers (MCUs). Benefits include access to online service to benchmark edge-AI models on STM32 boards.
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Sennheiser Group Introduces new Executive Management Board
January 24, 2023 by audioXpress Staff

Sennheiser Group Introduces new Executive Management Board

Following the realignment of the company with a focus on the professional audio business, Sennheiser now appointed a new management team. The new Executive Management Board includes representatives from the three business units Pro Audio, Business Communication and Neumann, as well as Supply Chain, Corporate Functions and Development. Together with Co-CEOs Daniel and Andreas Sennheiser, the Board members will implement the strategic goals of the Sennheiser Group.
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Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products
January 23, 2023 by audioXpress Staff

Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products

Fluent.ai announced an embedded voice recognition solution for True Wireless Stereo (TWS) and other hearable products running on the Cadence Tensilica HiFi 5 DSP in partnership with Airoha, a MediaTek subsidiary. The solution is part of an integration available on DSP Concepts’ Audio Weaver platform, which provides OEMs a rapid way to design and prototype audio features and capabilities.
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MPEG-H Decoder Implementation Now Available for Cirrus Logic DSPs
January 20, 2023 by Joao Martins

MPEG-H Decoder Implementation Now Available for Cirrus Logic DSPs

RT-RK, a leading embedded software development house, alongside Fraunhofer IIS, the primary developer of the MPEG-H Audio standard, announced the immediate availability of RT-RK's MPEG-H 3D Audio decoder implementation for Cirrus Logic DSPs commonly used in home theater products such as AV Receivers and Soundbars. The successful implementation will further accelerate the development of new products based on these low-cost embedded Cirrus Logic platforms.
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Practical Test & Measurement: The Benefits of Using Structure-Borne Sound in Headset Signal Processing
January 18, 2023 by Hans W. Gierlich

Practical Test & Measurement: The Benefits of Using Structure-Borne Sound in Headset Signal Processing

This article looks at the practical test and measurement of bone conduction technology, as used in product development for headsets and in-ear devices. It showcases new possibilities for manufacturers to better evaluate device performance, since no appropriate test equipment and methods were commercially available until now. The approach, complements a Head-and-Torso Simulator (HATS) with an actuator capable of generating structure-borne sound in the artificial ear. This way, a realistic simulation of the human structure-borne voice signal for in-ear headsets is possible.. This article was originally published in audioXpress, January 2023.
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Infineon Announces Partner Ecosystem for Latest MERUS Multilevel Class-D Audio Amplifier Technology
January 18, 2023 by audioXpress Staff

Infineon Announces Partner Ecosystem for Latest MERUS Multilevel Class-D Audio Amplifier Technology

Infineon Technologies recently introduced its latest generation of MERUS multilevel Class-D audio amplifiers, and now the company announced new ecosystem partners that are ready to support interested developers and manufacturers with their design-in efforts. Partnering with the experts, the company aims to boost the adoption of these new amplifiers with a unique Class D modulation of up to 5 different output voltage levels.
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TDK Introduces New SmartSound MEMS Microphones and Development Platform Plus VibeSense360 Solution Suite for TWS Designs
January 13, 2023 by Joao Martins

TDK Introduces New SmartSound MEMS Microphones and Development Platform Plus VibeSense360 Solution Suite for TWS Designs

At CES 2023, TDK InvenSense introduced the T5838 and T5837 PDM MEMS microphones that offer 68 dBA SNR consuming only 130 µA in always-on mode and 330 µA in high-performance mode. The company also announced the new SmartSound One development platform that provides a plug-and-play evaluation interface for its MEMS microphones, and the new VibeSense360 hardware and software solution suite for advanced true wireless stereo features.
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Knowles Debuts Trio of SiSonic MEMS Microphones for High-Performance TWS and Hearable Designs
January 13, 2023 by Joao Martins

Knowles Debuts Trio of SiSonic MEMS Microphones for High-Performance TWS and Hearable Designs

Knowles introduced its latest series of SiSonic MEMS microphones at CES 2023. The new Titan (Digital), Falcon (Differential Analog), and Robin (Single Ended Analog) are a new trio of microphones providing advanced performance capabilities for space constrained ear and wearable applications like True Wireless Stereo (TWS) earbuds, smart watches, Augmented Reality (AR) glasses and Virtual Reality (VR) headsets.
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xMEMS Announces World's First Solid-State MEMS DynamicVent, Enabling Active Ambient Control for Next-Generation TWS and Hearing Aids
January 9, 2023 by Joao Martins

xMEMS Announces World's First Solid-State MEMS DynamicVent, Enabling Active Ambient Control for Next-Generation TWS and Hearing Aids

Part of xMEMS Labs announcements at CES 2023, the innovative MEMS speaker company introduced Skyline, the world’s first discrete solid-state MEMS DynamicVent, a specific design with a valve that opens or closes by sensor fusion input from the earbud DSP and enables the benefits of both an open-fit (spatially aware) and closed-fit (occluded) earbud design. This enables smart TWS earbuds and hearing aids that create best-of-both-worlds user experiences in the same product.
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GaN Systems and Axign Unveil 1000W Class-D Heatsinkless Audio Amplifier Design
January 6, 2023 by Joao Martins

GaN Systems and Axign Unveil 1000W Class-D Heatsinkless Audio Amplifier Design

GaN power semiconductors pioneer GaN Systems has once again teamed up with Dutch company Axign to unveil an even more powerful, 1000W Class-D GaN audio amplifier board at CES 2023. The new reference design merges best-in-class technologies from GaN Systems and Axign to enable unique audio systems that are smaller, more efficient, and offer better audio quality. The design is ideal for automotive, professional, and prosumer audio applications.
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