All items tagged with product development and TWS (31)

SonicEdge Presents Integrated MEMS Speaker and Microphone Solution at CES 2025

December 23, 2024 by Joao Martins

SonicEdge Presents Integrated MEMS Speaker and Microphone Solution at CES 2025

To be unveiled at CES 2025 is a new example of a MEMS microspeaker company that now offers an integration with a MEMS microphone. SonicEdge, the startup that pioneered ultrasound MEMS drivers and has yet to enter the market, will present SonicTwin, an integrated speaker-microphone in a single package. Combining the company's patented modulated ultrasound technology that eliminates traditional mechanical vibrations, makes the integration with a microphone and sensors much easier with potential benefits also for ANC and lower-power in TWS earbuds and headphones.

Knowles Enhances Performance for Meizu LIVE AI Noise Cancelling Hi-Fi Earbuds

May 23, 2024 by Joao Martins

Knowles Enhances Performance for Meizu LIVE AI Noise Cancelling Hi-Fi Earbuds

Knowles Corporation announced that Meizu, a consumer audio brand from China, has selected Knowles balanced armature (BA) drivers and SiSonic high-performance MEMS microphones to produce premium sound for its new LIVE AI Noise Cancelling Hi-Fi Earbuds. Now available in China and other countries in the APAC region, the Meizu LIVE AI earbuds combine the BAs with a coaxial driver, tuned to the Knowles Preferred Listening Curve. Meizu also offers a first-of-its-kind capability that uses artificial intelligence to identify user listening preferences.

In-Ear Technology Meets Music Fidelity in audioXpress April 2024!

March 12, 2024 by audioXpress Staff

In-Ear Technology Meets Music Fidelity in audioXpress April 2024!

Read the latest Earbuds and Hearables market update. sensiBel experts explain everything about the advantages of Microphone Array Beamforming with Optical MEMS Microphones. GRAS' researchers share their findings about Ear Canal Geometry for In-Ear Headphone Testing. Learn how Hearing and Audio affects our perception of music fidelity. Jan Didden interviews Menno van der Veen. Andrew Russell shares his High-Performance 60-Watt Class A Amplifier project, and Tom Perazella explains how to build a Comprehensive AC Power Controller.

GreenWaves Showcases World's First AI-Based Audio Solutions for the GAP9 Application Processor at CES 2024

December 19, 2023 by Joao Martins

GreenWaves Showcases World's First AI-Based Audio Solutions for the GAP9 Application Processor at CES 2024

GreenWaves Technologies will be at CES 2024 with an interesting showcase of AI for audio applications. The company's GAP9 advanced AI processor is in volume production, and GreenWaves will be able to show several solutions that are enabling market leading hearable products. Demonstrations include audio advanced source separation models, and active noise cancellation with neural network based acoustic scene detection, as well as immersive 3D sound.

Audio Pioneer xMEMS Promotes Seminar Series: xMEMS Live – China 2023

September 12, 2023 by audioXpress Staff

Audio Pioneer xMEMS Promotes Seminar Series: xMEMS Live – China 2023

Semiconductor pioneer xMEMS Labs announced the launch of xMEMS Live – China 2023, a two-day seminar aimed at demonstrating the company's technology for Chinese consumer tech and audio brands through product demos, keynotes and in-depth tech-talk presentations. The seminars will take place September 18 at the Renaissance Caohejing Hotel in Shanghai, and on September 20 at the Westin Nanshan in Shenzhen. The seminar signal xMEMS significant expansion throughout Asia, North America, and Europe.

STMicroelectronics Announces All-in-One Motion and Bone-Conduction Sensor for Hearables

March 7, 2023 by audioXpress Staff

STMicroelectronics Announces All-in-One Motion and Bone-Conduction Sensor for Hearables

STMicroelectronics has announced the LSM6DSV16BX, a unique highly integrated sensor that delivers important space savings inside hearable devices or general-purpose TWS earbuds, including for sports. The new device delivers longer listening experiences and superior hearing by combining a 6-axis inertial measurement unit (IMU) for head tracking and activity detection with an audio accelerometer for detecting voice through bone conduction in a frequency range that exceeds 1KHz.

TDK Introduces New SmartSound MEMS Microphones and Development Platform Plus VibeSense360 Solution Suite for TWS Designs

January 13, 2023 by Joao Martins

TDK Introduces New SmartSound MEMS Microphones and Development Platform Plus VibeSense360 Solution Suite for TWS Designs

At CES 2023, TDK InvenSense introduced the T5838 and T5837 PDM MEMS microphones that offer 68 dBA SNR consuming only 130 µA in always-on mode and 330 µA in high-performance mode. The company also announced the new SmartSound One development platform that provides a plug-and-play evaluation interface for its MEMS microphones, and the new VibeSense360 hardware and software solution suite for advanced true wireless stereo features.

Knowles Debuts Trio of SiSonic MEMS Microphones for High-Performance TWS and Hearable Designs

January 13, 2023 by Joao Martins

Knowles Debuts Trio of SiSonic MEMS Microphones for High-Performance TWS and Hearable Designs

Knowles introduced its latest series of SiSonic MEMS microphones at CES 2023. The new Titan (Digital), Falcon (Differential Analog), and Robin (Single Ended Analog) are a new trio of microphones providing advanced performance capabilities for space constrained ear and wearable applications like True Wireless Stereo (TWS) earbuds, smart watches, Augmented Reality (AR) glasses and Virtual Reality (VR) headsets.

Why Buy Four Chips if You Only Need One?

November 1, 2022 by Special Content

Why Buy Four Chips if You Only Need One?

Azoteq recently expanded its offering to the TWS market with the release of the IQS323. The IQS323 offers capacitive and inductive sensing as user interface and in-ear-detection, whilst the IQS7222A IC is a multifunctional capacitive, inductive, and Hall-effect sensor with additional temperature sensing for reference tracking. The IQS7222A is offered in a 1.62 x 1.62mm WLCSP and allows you to add a touch-and-swipe interface, wear detection, docking detection and your choice of an inductive waterproof button or the inductive force-sensing features.

Airoha Confirms Bluetooth LE Audio Certification. Chips to Be Available H1 2023

September 19, 2022 by Joao Martins

Airoha Confirms Bluetooth LE Audio Certification. Chips to Be Available H1 2023

Taiwan-based Airoha Technology announced that its new series of Bluetooth audio chips have successfully completed the latest Bluetooth Low Energy Audio Qualification Process and will be "widely available" to manufacturers in the first half of 2023. Airoha is one of the most important suppliers of chips for true wireless earbuds and the LE Audio certification is also an important R&D achievement for its Bluetooth audio R&D team consisted of hundreds of engineers.

«
1
2
3
4
»