All items tagged with product development (903)

Challenges to Building Voice-Enabled Products

April 2, 2020 by Chin Beckmann

Challenges to Building Voice-Enabled Products

Voice-enabled devices are quickly becoming commonplace in nearly every region and for every consumer demographic. Whether making cloud-connected or offline products, OEMs need to understand what’s driving this demand for voice. Unlike some new product features, adding a voice interface requires product architects to make a number of highly-impactful, interconnected design decisions. Development teams don’t have it easy either, as integrating microphones in a product introduces another layer of complexity.

Micro Loudspeaker Innovator Arioso Systems GmbH Ready To Enter the Market

April 2, 2020 by audioXpress Staff

Micro Loudspeaker Innovator Arioso Systems GmbH Ready To Enter the Market

The Fraunhofer IPMS spin-off company Arioso Systems GmbH has successfully completed its first round of financing. The company is launching an innovative sound transducer principle for miniaturized headphones, in-ears and hearables to the market. The company's new micro loudspeaker technology made from 100% silicon, is based on the patented Nanoscopic Electrostatic Drive (NED) principle developed by Fraunhofer IPMS. The technology can considerably extend the functional scope for true wireless earbuds and revolutionize the industry, Arioso believes.

Qualcomm Offers New Ultra-Low Power Bluetooth Audio SoCs for Truly Wireless ANC Development

March 26, 2020 by audioXpress Staff

Qualcomm Offers New Ultra-Low Power Bluetooth Audio SoCs for Truly Wireless ANC Development

With its previous generation of QCC SoCs for Bluetooth true wireless earbuds development, Qualcomm enabled virtually every single mobile and CE brand to finally create products able to compete with Apple's massively successful AirPods, still the market leader by a wide margin. Then Apple introduced its AirPods Pro with ANC and its market share expanded even more. Now Qualcomm launched a new generation of SoCs combining hybrid ANC and other technologies to enable brands to design new competitive TWS products.

Efficient Power Conversion Releases New GaN IC Family for High Performance Class-D Designs

March 18, 2020 by audioXpress Staff

Efficient Power Conversion Releases New GaN IC Family for High Performance Class-D Designs

Efficient Power Conversion (EPC) introduced the first of a new integrated circuit (IC) product family offering higher performance and smaller solution size for high power density applications including DC-DC conversion, motor drive, and Class-D audio amplifiers. EPC announced an 80 V, 12.5 A power stage integrated circuit designed for 48 V DC-DC conversion. The EPC2152 is a single-chip driver plus eGaN FET half-bridge power stage using EPC’s proprietary GaN IC technology.

Bragi and CEVA Collaborate to Drive New Class of Hearable and Personal Audio Devices

March 17, 2020 by Joao Martins

Bragi and CEVA Collaborate to Drive New Class of Hearable and Personal Audio Devices

CEVA, the leading licensor of wireless connectivity and smart sensing technologies, and Bragi GmbH, the hearables pioneer from Munich, Germany, announced a strategic collaboration to drive a new class of hearable devices where the user experience is customizable via the industry’s first hearable app store and the new Bragi 4 operating system. Target devices include headsets, hearing aids, True Wireless Stereo (TWS) earbuds and a host of other smart audio devices for the consumer and the smart home.

AKM Proposes Two-Chip D/A Solution for High-End Audio Product Development

March 11, 2020 by audioXpress Staff

AKM Proposes Two-Chip D/A Solution for High-End Audio Product Development

Asahi Kasei Microdevices Corporation (AKM) has expanded its lineup of premium audio Digital-to-Analog converters (DACs) with the development of a two-chip solution that separates the digital aspect from the analog. While conventional DACs use a single chip to convert signals from digital to analog, the new AKM approach splits the conversion process between the AK4191 delta-sigma modulator and the AK4498 DAC. This results in an improvement in sound quality that is easily perceptible while listening to music, the company states.

Ambiq Micro Licenses CEVA’s Bluetooth Low Energy IP for Next-Generation SPOT Platforms

March 11, 2020 by audioXpress Staff

Ambiq Micro Licenses CEVA’s Bluetooth Low Energy IP for Next-Generation SPOT Platforms

CEVA announced that Ambiq Micro has licensed CEVA’s RivieraWaves Bluetooth low energy IP for use in its next-generation Subthreshold Power-Optimized Technology (SPOT) platforms integrating Bluetooth connectivity. CEVA’s Bluetooth low energy (BLE) IP is already powering Ambiq Micro’s Apollo3 Blue Family Wireless System-on-Chip (SoC), used in applications requiring intelligence everywhere, from wearables to animal trackers to smart home devices.

Waves Expands Collaboration With Qualcomm to Enhance Audio on Next Generation Mobile Devices

March 9, 2020 by audioXpress Staff

Waves Expands Collaboration With Qualcomm to Enhance Audio on Next Generation Mobile Devices

Waves MaxxAudio and Nx 3D audio processing technologies are now compatible with the new Qualcomm Snapdragon 865, 765 and 765G mobile processors targeting the latest smartphones and powering augmented experiences, gaming, and more. These Waves technologies have been until now mainly available on Intel and ARM processor-based platforms. This new combination will allow manufacturers implementing Snapdragon processors in premium smartphones and smart peripherals to also support expanded audio experiences.

FTDI Launches Dual & Quad Channel USB-to-UART/MPSSE Bridge ICs with Built-in Type-C/PD Controllers

March 5, 2020 by Cristina Costa

FTDI Launches Dual & Quad Channel USB-to-UART/MPSSE Bridge ICs with Built-in Type-C/PD Controllers

At the forefront of embedded connectivity innovations, FTDI Chip’s latest series of multi-channel USB interface ICs have the capacity to deal with next generation power requirements, as larger items of hardware start to make use of the protocol. Available in both 2-channel (FT2233HP) and 4-channel (FT4233HP) versions, the new Hi-Speed (480Mbits/s) devices have serial UART (RS232, RS422 or RS485) and MPSSE (JTAG, I2C, SPI or Bit-Bang) interfacing capabilities.

ESS Expands its USB DAC Portfolio with New ES9260 Low-Power Solution

March 4, 2020 by audioXpress Staff

ESS Expands its USB DAC Portfolio with New ES9260 Low-Power Solution

ESS Technology announced the ES9260, a new USB DAC solution with integrated PLL and regulator, optimized for low-power consumption. Intended for use in USB-C headsets and audio adaptors that demand high-quality sound and long play times, the new SoC offers lower power consumption than existing solutions while still delivering the highest-quality sound in its class.

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