All items tagged with product development (903)

Next-Generation AVR DA Microcontroller Family From Microchip Enables Real-Time Control, Connectivity and HMI Applications

May 7, 2020 by audioXpress Staff

Next-Generation AVR DA Microcontroller Family From Microchip Enables Real-Time Control, Connectivity and HMI Applications

As the Internet of Things (IoT) delivers greater connectivity for industrial and home applications and as connected vehicles enhance cabin and operational features, higher-performance microcontrollers are required for better real-time control as well as to enable enhanced human machine interface applications. Microchip Technology announced its next generation AVR DA family of microcontrollers (MCUs) – its first Functional Safety Ready AVR MCU family with Peripheral Touch Controller (PTC).

Electrocomponents Introduces OKdo E1 Single Board Computer for Low-Cost Development of Connected Devices

May 5, 2020 by audioXpress Staff

Electrocomponents Introduces OKdo E1 Single Board Computer for Low-Cost Development of Connected Devices

OKdo, the new brand that is now part of the Electrocomponents Group (RS, Allied, DesignSpark), introduced its first own-branded single board computer (SBC), the E1. The E1 board features an NXP LPC55S69 microcontroller, which offers a high-performance, secure low-cost entry to the development of connected devices, and represents the start of the next phase in the company's evolution towards providing an accessible range of software, hardware, services and solutions.

Diodes Launches Active Switch with ReDriver to Support HDMI 2.1 Standard

April 30, 2020 by Cristina Costa

Diodes Launches Active Switch with ReDriver to Support HDMI 2.1 Standard

Diodes announced the PI3HDX12221, an HDMI 2.1 active switch with linear ReDriver that enables manufacturers of TVs, PCs, gaming consoles, and set-top boxes to adopt the latest 12Gbps HDMI standard. The device supports dual inputs with a signal cleaning function that enables extending channel lengths. Optimizing function integration into a single package reduces system BOM and power consumption, particularly when compared to an equivalent discrete solution.

Waves Maxx Audio Sound Enhancement Technology Now Available On Knowles Advanced Audio Processors

April 28, 2020 by audioXpress Staff

Waves Maxx Audio Sound Enhancement Technology Now Available On Knowles Advanced Audio Processors

Waves confirmed that its MaxxAudio Sound enhancement technology is now available on the newest Knowles AISonic Audio Edge Processor, the IA8201. The joint solution makes it easy for design engineers to integrate studio-quality sound into consumer electronics products. Knowles joins an expanding list of chip partners for Waves, supporting developers working to enhance sound on mobile devices, premium smartphones and smart peripherals featuring augmented reality (AR) and gaming.

Libre Wireless Technologies Single Chip MAVID Solution is Now Amazon AWS IoT Core Certified

April 28, 2020 by audioXpress Staff

Libre Wireless Technologies Single Chip MAVID Solution is Now Amazon AWS IoT Core Certified

Libre Wireless Technologies, the embedded wireless audio and voice/AI development platform company, announced that its MAVID low power mic-to-cloud edge computing solution expanded its unique RTOS platform to include new SDK releases. The company's flexible SDK for connected devices now features Amazon AWS IoT Core certification and leverages the responsive Free RTOS OS, combined in a scalable feature rich platform. The new development environment offers unique connectivity and libraries for manufacturers and ODMs developing on Libre Wireless's MAVID platform.

LoudSoft Updates FINECone 2020 Simulation Software

April 17, 2020 by audioXpress Staff

LoudSoft Updates FINECone 2020 Simulation Software

The new release of LoudSoft's FINECone 2020 software is a welcome and important update for the loudspeaker industry. LoudSoft seems to have listened to its customers and added a new Geometry Modeler, which makes simulating cone frequency response much easier for engineers using FINECone. FINECone is an acoustic Finite Element dome/cone simulation application to assist on the design of new drivers, calculating frequency responses and detecting problems in existing designs.

Qualcomm Announces New Ultra-Efficient NB2 IoT Chipset for Connected Applications

April 16, 2020 by audioXpress Staff

Qualcomm Announces New Ultra-Efficient NB2 IoT Chipset for Connected Applications

According to data from the GSMA, the world will see 3.2 billion cellular Internet-of-Things (IoT) connections in 2024. That is, billions of connected devices of all types in homes, companies, and cities. Qualcomm Technologies is already a leading supplier of wireless connectivity chipsets and they now announced a breakthrough new product to drive the growth of cellular IoT: the Qualcomm 212 LTE IoT Modem, introduced as the world’s most power-efficient single-mode NB2 (NB-IoT) chipset.

Next-Generation SIMO Power Management IC from Maxim Integrated Extends Battery Life for Wearables and Hearables

April 7, 2020 by audioXpress Staff

Next-Generation SIMO Power Management IC from Maxim Integrated Extends Battery Life for Wearables and Hearables

Designers of compact consumer devices like hearables can now slash solution size by half and extend battery life by 20 percent with the MAX77654 single inductor, multiple output (SIMO) power management IC (PMIC) from Maxim Integrated Products. The breakthrough new SIMO technology replaces traditional power management architectures for the most demanding designs in wearables and personal audio devices, reducing BOM count by up to 40 percent, with 23 percent lower BOM cost compared to discrete solutions.

CEVA Announces SensPro High Performance Sensor Hub DSP Architecture for Smart Devices

April 7, 2020 by audioXpress Staff

CEVA Announces SensPro High Performance Sensor Hub DSP Architecture for Smart Devices

CEVA announced a new high performance sensor hub DSP architecture designed to handle the broad range of sensor processing and sensor fusion workloads for contextually-aware devices. The new SensPro device family serves as a hub for processing and fusing of data from multiple sensors including camera, Radar, LiDAR, Time-of-Flight, microphones and inertial measurement units. This highly-configurable and self-contained architecture brings together scalar and parallel processing for floating point and integer data types, as well as deep learning training and inferencing.

USB Type-C Linear Mux/DeMux ReDriver with Integrated USB-C Detector from Diodes Restores Signal Integrity and Reduces Latency

April 3, 2020 by audioXpress Staff

USB Type-C Linear Mux/DeMux ReDriver with Integrated USB-C Detector from Diodes Restores Signal Integrity and Reduces Latency

Diodes announced the PI3EQX10612/PI3EQX10312 2-port 10Gbps linear ReDriver devices with integrated USB-C detection for equipment implementing a USB Type-C interface. Offering 1:2/2:1 mux/demux functionality, the ReDrivers can be used to extend the reach of USB signals running across rigid or flexible PCBs in gaming consoles, laptops, desktop computers, tablets, and other consumer applications.

«
1
2
...
44
45
46
47
48
49
50
...
90
91
»