All items tagged with product development (903)
Qualcomm Announces Snapdragon Sound S5 and S3 Gen 2 Chipsets for Bluetooth LE Audio Products
November 17, 2022 by Joao Martins

Qualcomm Announces Snapdragon Sound S5 and S3 Gen 2 Chipsets for Bluetooth LE Audio Products

During its Snapdragon Summit 2022, Qualcomm unveiled the latest generation of Snapdragon processors and chips that will power mobile devices, wearables and countless consumer electronics and audio devices to be introduced in 2023. The Snapdragon S5 Gen 2, and the Snapdragon S3 Gen 2 Bluetooth audio chipsets are the evolution from the devices announced in 2022, designed to support Bluetooth LE Audio.
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CEVA Introduces Voice User Interface Solution for TI SimpleLink Wi-Fi Wireless MCUs
November 15, 2022 by audioXpress Staff

CEVA Introduces Voice User Interface Solution for TI SimpleLink Wi-Fi Wireless MCUs

CEVA announced the availability of its WhisPro speech recognition and control software to support designs using the Texas Instruments (TI) SimpleLink Wi-Fi CC3235x wireless MCU family, bringing ultra-low power, robust voice user interface to connected devices. The WhisPro Software Development Kit (SDK) allows full project customization, including choice of wake words and voice commands, and runs entirely on-device, without the need for a network connection.
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Highly Anticipated Return for electronica 2022, November 15 to 18
November 8, 2022 by audioXpress Staff

Highly Anticipated Return for electronica 2022, November 15 to 18

electronica, the world’s leading trade fair and conference for electronics, will take place in 14 halls on the Munich exhibition grounds from November 15 to 18, 2022. This is a highly-anticipated return for a show that promises to reengage multiple critical sectors in development and manufacturing, after four years of absence. This year’s highlights in the electronica Conference will deal with Automotive, Embedded Platforms, Sensors, and Wireless Systems and Applications.
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Voice Control for Low Power Microcontrollers
November 3, 2022 by Ido Gus

Voice Control for Low Power Microcontrollers

Ido Gus, Deep Learning Senior Team Leader at CEVA’s Sensor and Audio Business Unit, writes about voice control deployment on low power and resource constrained microcontroller-units (MCUs). The article discusses what to consider for the development of products using voice as a primary human interface, and how speech recognition models using AI technology can support a wide variety of use cases and languages, without compromising on power requirements.
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Why Buy Four Chips if You Only Need One?
November 1, 2022 by Special Content

Why Buy Four Chips if You Only Need One?

Azoteq recently expanded its offering to the TWS market with the release of the IQS323. The IQS323 offers capacitive and inductive sensing as user interface and in-ear-detection, whilst the IQS7222A IC is a multifunctional capacitive, inductive, and Hall-effect sensor with additional temperature sensing for reference tracking. The IQS7222A is offered in a 1.62 x 1.62mm WLCSP and allows you to add a touch-and-swipe interface, wear detection, docking detection and your choice of an inductive waterproof button or the inductive force-sensing features.
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Realtek Announces New 5th Generation Ameba E Series Solutions
October 27, 2022 by Joao Martins

Realtek Announces New 5th Generation Ameba E Series Solutions

Redefining smart connectivity, Realtek launched its new 5th generation Ameba E series solutions that allow smart products to have the ability to perceive, interact, and determine actions to take. The new SoCs and modules support powerful edge computing, allowing home appliances to be converted into multifunctional smart systems, according to various time or scene settings. Apart from introducing a boost in computation and DSP, the new Ameba E series supports Bluetooth LE Audio, Wi-Fi 6 and Matter.
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CUI Devices Offers New MEMS Microphones for Active Noise Canceling Applications
October 26, 2022 by audioXpress Staff

CUI Devices Offers New MEMS Microphones for Active Noise Canceling Applications

CUI Devices announced the addition of two MEMS microphone models purposely designed for active noise cancellation applications. With the industry increasingly requiring array configurations to enable processing of the audio signals captured by MEMS microphones in true wireless earbuds, headphones and headsets, the Audio Group of CUI Devices designed new models with high signal-to-noise ratios (SNR) and high acoustic overload points (AOP).
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GaN Systems Extends Class D Audio Solutions With New Amplifier Modules and Boost Converters
October 25, 2022 by audioXpress Staff

GaN Systems Extends Class D Audio Solutions With New Amplifier Modules and Boost Converters

GaN Systems extended its lead in Class D GaN-powered audio with the release of two complete Class-D high-performance GaN FET amplifier boards and two complete audio boost converter solutions for marine, auto, and battery-powered vehicles. GaN Systems now provides a comprehensive solution of turnkey amplifier designs, power supplies, and boost converters — allowing audio systems designers across automotive, home, and professional markets to mix and match designs to maximize performance for specific applications.
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Audinate Now Shipping Dante Brooklyn 3 Audio Networking Module
October 24, 2022 by Joao Martins

Audinate Now Shipping Dante Brooklyn 3 Audio Networking Module

Audinate, the developer of the Dante audio-over-IP networking solution that now also carries video, announced that its Dante Brooklyn 3 audio networking module is now shipping. Announced in June at InfoComm 22, the new module is a pin-compatible replacement for one of Audinate’s most popular products, the Dante Brooklyn 2, which has been redesigned to ensure continuous availability while delivering support for current and future Dante features.
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Microchip Announces New Arm-Based PIC with Built-in Bluetooth Low Energy Connectivity
October 19, 2022 by Cristina Costa

Microchip Announces New Arm-Based PIC with Built-in Bluetooth Low Energy Connectivity

Microchip Technology introduced its first Arm Cortex-M4F-based PIC microcontroller (MCU) family that solves basic wireless connectivity design challenges by integrating Bluetooth Low Energy functionality directly into one of a system’s most basic components, supported by one of the industry’s most comprehensive developer ecosystems. Microchip's new PIC32CX-BZ2 MCU family is available in SoCs QFN packages and complete PCB modules and antenna.
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