All items tagged with product development (903)
Fraunhofer Cingo Immersive Listening Now Available in Audio Weaver
July 11, 2022 by Joao Martins

Fraunhofer Cingo Immersive Listening Now Available in Audio Weaver

DSP Concepts announced that its Audio Weaver development platform for audio products now also offers access to the Fraunhofer Cingo family of immersive processing tools. The agreement with Fraunhofer IIS allows audio product developers to enhance headphones, earbuds and speakers with binaural audio processing for immersive 3D sound with head tracking, as well as enhance existing stereo content, including loudness optimization and equalization. Cingo supports all channel-based formats and direct rendering of audio objects with associated position metadata, which can be transmitted as MPEG-H Audio.
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Laird Connectivity Launches New SOM that Delivers Powerful NXP Edge Processing with Wi-Fi and Bluetooth
July 7, 2022 by audioXpress Staff

Laird Connectivity Launches New SOM that Delivers Powerful NXP Edge Processing with Wi-Fi and Bluetooth

Laird Connectivity announced the new Summit SOM 8M Plus, a highly-integrated and comprehensive hardware and software solution that combines NXP multi-core applications processing with dual-band 2x2 Wi-Fi 5 and Bluetooth 5.3 connectivity. The new system-on-module (SOM) is Laird's most versatile, feature-rich, and secure wireless solution to date, truly perfect for serving as the core platform for advanced connected applications and audio/voice systems.
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AES Audio Product Education Institute Webinar Helps Demystify Beamforming for Voice Applications
July 6, 2022 by Audio Engineering_Society

AES Audio Product Education Institute Webinar Helps Demystify Beamforming for Voice Applications

The Audio Product Education Institute (APEI), an Audio Engineering Society initiative, is promoting a webinar exploring application and optimization of microphone beamforming techniques, and the latest optimizations for voice recognition platforms. The knowledge-sharing online session features presentations from DSP Concepts, Soundskrit, and Fluent.ai, with presentation by Dave Lindberg from DB Enterprises in Hong Kong.
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Microchip Announces New Solution for Knob on Display Touchscreen Designs
July 1, 2022 by Joao Martins

Microchip Announces New Solution for Knob on Display Touchscreen Designs

Microchip Technology launched a new maXTouch Knob on Display (KoD) controller, the first automotive-grade touchscreen controller family to natively support the detection and reporting of capacitive rotary encoders, as well as mechanical switches on top of a touch panel. Unlike traditional mechanical rotary encoders, this new technology enables the mounting of the knob directly onto the display without an opening in the panel or any customization of the touch pattern, increasing design flexibility.
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Keysight Updates PathWave ADS Design and Simulation Software for Radio Frequency and Microwave Designers
June 30, 2022 by audioXpress Staff

Keysight Updates PathWave ADS Design and Simulation Software for Radio Frequency and Microwave Designers

Keysight Technologies has introduced the new PathWave Advanced Design System (ADS) 2023, an integrated design and simulation software that rapidly addresses increasing design complexity and higher frequencies in radio frequency (RF) and microwave applications. The updated design and simulation environment includes enhancements to electromagnetic (EM) simulation for circuit designers and streamlines integration of multi-technology circuit assembly and simulation into enterprise electronic design automation (EDA) design workflows.
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Renesas and Cyberon Partner to Deliver Integrated Voice User Interface Solutions Supporting Over 40 Global Languages
June 30, 2022 by Joao Martins

Renesas and Cyberon Partner to Deliver Integrated Voice User Interface Solutions Supporting Over 40 Global Languages

Renesas Electronics, the advanced semiconductor solutions supplier, and Cyberon, a leading embedded speech solution provider, have partnered to deliver voice user interface (VUI) solutions using Renesas’ entire RA MCU line. Renesas RA customers will now have complimentary access to Cyberon’s industry-leading continuous command-based VUI toolchain, enabling them to add voice-recognition to a variety of endpoint applications, including home appliances and wearables.
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ArkX Laboratories and Sensory Launch Custom Wake-Word and Command Sets for Brand Voice Experiences
June 28, 2022 by audioXpress Staff

ArkX Laboratories and Sensory Launch Custom Wake-Word and Command Sets for Brand Voice Experiences

ArkX Laboratories announced the launch of EveryWord Voice Control featuring the Sensory TrulyHandsfree SDK technology suite. The combination of the two companies' advanced far-field voice capture and speech recognition technologies, enable OEMs to create custom wake-words, small to medium command sets (21 dialects), and speaker verification models for voice interfaces when integrated with the production-ready EveryWord Audio Front End (AFE) or Voice Module.
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The Acoustical Challenges of Designing True Wireless Earphones
June 28, 2022 by Andrew Bellavia

The Acoustical Challenges of Designing True Wireless Earphones

Expanding the perspective on the evolution toward hearables, this article explores the current trends as well as the acoustical challenges and solutions for designing true wireless earphones. The article explains the enabling technologies currently converging as the TWS market continues to grow and use cases multiply, with more consumers using wireless earbuds for a diverse and varied set of applications, from listening to podcasts and audiobooks to Internet meetings and interacting with voice assistants. This article was originally published in audioXpress, April 2022.
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Nordic Semiconductor Showcases Bluetooth LE Audio with Auracast Development Solutions
June 27, 2022 by Joao Martins

Nordic Semiconductor Showcases Bluetooth LE Audio with Auracast Development Solutions

Nordic Semiconductor has used the latest trade shows globally to showcase its latest low power wireless solutions, and introduced a series of new development solutions targeting Bluetooth LE Audio. At the Embedded World Exhibition that took place in Nuremberg, Germany, Nordic offered demonstrations of its new nRF5340 Audio Development Kit (DK), a design platform for rapid development of LE Audio products, and the Nordic Thingy:53 a rapid prototyping solution, both based on Nordic’s nRF5340 SoC.
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Texas Instruments Announces Affordable CC2340 Bluetooth LE Wireless MCUs
June 22, 2022 by audioXpress Staff

Texas Instruments Announces Affordable CC2340 Bluetooth LE Wireless MCUs

Texas Instruments expanded its connectivity portfolio with a new family of wireless microcontrollers (MCU) that enable high-quality Bluetooth Low Energy (LE) at half the price of typical competing devices. Featuring best-in-class standby current and radio-frequency (RF) performance, the SimpleLink Bluetooth LE CC2340 family is priced to start as low as $0.79, making it affordable for engineers to add Bluetooth LE connectivity to more products.
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