New 3D Sound One Module Provides Immersive Audio for Headphones

French company 3D Sound Labs announced that its 3D smart audio technology is now available for all headphones thanks to the new 3D Sound One Module. 3D Sound Labs is a pioneer startup in 3D sound and its new 3D Sound One Module is the first accessory that can be simply fixed to any headphone to allow immersive 3D audio experiences. The connected module connects via Bluetooth to a smartphone running the iOPS 3D Sound Labs app or a PC with the Windows 3D Sound Labs driver.

Conexant’s new I2S audio Codec and AudioSmart software offers noise cancellation and full-duplex acoustic echo cancellation for tablets, allowing better voice quality even in noisy environments. Conexant also introduced a Linux software solution for voice control and communication in smart home products and unveiled its new Smart Voice Pickup (SVP) technology for headsets, based on its proprietary SSP noise suppression algorithm.

While standards for immersive object-based sound are still being discussed by the SMPTE, DTS decided not to wait any longer and to go after the Dolby Atmos immersive audio format, by announcing its own object-based codec technology, DTS:X. During the CES 2015 multiple audio companies are confirming support for the new DTS:X technology.