All items tagged with edge AI (110)

Syntiant Introduces Small Language Model Assistant Generative AI Solution at IBC 2024

September 16, 2024 by Joao Martins

Syntiant Introduces Small Language Model Assistant Generative AI Solution at IBC 2024

Syntiant showcased the possibilities of its low power edge AI solutions during the 2024 IBC show in Amsterdam in partnership with Synaptics. Ideal for service providers and device manufacturers, Syntiant's proprietary small language model assistant (SLMA) was used to implement an AI voice assistant running exclusively on-device, ready for integration in low-cost designs such as set-top boxes. Syntiant showcased its SLMA solution on a set-top box reference design powered by Synaptics Astra SL1680 embedded processors.

Developers and Manufacturers Return to Munich for electronica 2024

September 2, 2024 by Joao Martins

Developers and Manufacturers Return to Munich for electronica 2024

Every two years, the world of electronics meets at electronica in Munich, Germany. As the world's leading trade fair in the sector - with a massive exhibition area and attendance numbers - it presents the industry's entire range of technologies, products and solutions for electronics development and manufacturing. For electronica 2024, November 12-15, 2024, the entire diversity of the electronics industry will be in 18 exhibition halls, with a strong increase in international exhibitors.

Dolphin Design Announces Partnership with Fraunhofer IIS to Enhance Power Management in Edge AI

August 27, 2024 by audioXpress Staff

Dolphin Design Announces Partnership with Fraunhofer IIS to Enhance Power Management in Edge AI

Dolphin Design announced a new strategic partnership with the Fraunhofer Institute for Integrated Circuits IIS, a research Institute and member of the European Union's PREVAIL project consortium. This collaboration aims to push the boundaries of power management in next-generation edge AI (Artificial Intelligence) technologies. Dolphin's Power Management IP platform accelerates and secures the design of energy-efficient SoCs.

xMEMS Introduces 1mm-Thin Active Micro-Cooling "Fan on a Chip"

August 20, 2024 by Joao Martins

xMEMS Introduces 1mm-Thin Active Micro-Cooling "Fan on a Chip"

xMEMS Labs announced an innovation in a completely new direction for the company. The new xMEMS XMC-2400 µCooling chip is the first-ever all-silicon, active micro-cooling fan for ultramobile devices and next-generation AI solutions. xMEMS recently revamped its website to reflect the new strategic directions for the company, now with piezoMEMS microspeakers and the actively controlled acoustic vent transducers DynamicVent segments complemented by the new cooling products category.

Sensory Releases TrulyNatural Embedded Speech-to-Text 2.0

August 9, 2024 by Joao Martins

Sensory Releases TrulyNatural Embedded Speech-to-Text 2.0

Sensory announced the availability of its second-generation TrulyNatural Embedded Speech-to-Text (STT) solution, which the company believes delivers the highest accuracy to size ratio compared to any other Speech-to-Text technology. According to the voice AI and speech recognition technology pioneer, in benchmark comparisons, TrulyNatural STT is an order of magnitude smaller yet more accurate than industry leading and public domain speech engines.

SoundHound AI Rolls Out Voice Assistant with Generative AI to Stellantis Vehicles Across Europe

August 1, 2024 by Joao Martins

SoundHound AI Rolls Out Voice Assistant with Generative AI to Stellantis Vehicles Across Europe

SoundHound AI, one of the pioneers on speech-to-meaning voice interfaces continues to double down on its use of Generative AI to expand the possibilities of its voice assistants in automotive environments. The Silicon Valley company just confirmed that its SoundHound Chat AI voice assistant with integrated ChatGPT will be live in Alfa Romeo and Citroën vehicles across multiple European markets, adding to previous announcements with other Stellantis' brands.

Particle Unveils Tachyon, a Qualcomm Snapdragon-Powered, 5G, AI-Enabled Single-Board Computer

July 31, 2024 by Joao Martins

Particle Unveils Tachyon, a Qualcomm Snapdragon-Powered, 5G, AI-Enabled Single-Board Computer

Particle, a company from San Francisco focused on edge-to-cloud connectivity and platforms, has launched Tachyon, its first Qualcomm Snapdragon-powered single-board computer (SBC), comprising a powerful NPU for AI/ML workloads, built-in high-bandwidth cellular 5G and Wi-Fi 6E connectivity, and a Linux-powered Ubuntu operating system. The board is now available for pre-order on Kickstarter starting at $149.

Sparse Artificial Intelligence MCU from Femtosense and ABOV Semiconductor Delivers AI-Based Voice Processing On-Device

July 17, 2024 by Joao Martins

Sparse Artificial Intelligence MCU from Femtosense and ABOV Semiconductor Delivers AI-Based Voice Processing On-Device

Femtosense, in partnership with ABOV Semiconductor in South Korea, has launched the AI-ADAM-100, an artificial intelligence microcontroller unit (AI MCU) built on sparse AI technology to enable on-device AI features such as voice-based control in home appliances and other products. According to the Silicon Valley startup, the new AI-ADAM-100 AI MCU is a low-power, low-cost option for on-device language processing and voice-cleanup capabilities.

Microchip Technology Launches RISC-V Multi-Core 64-Bit Microprocessors

July 10, 2024 by Cristina Costa

Microchip Technology Launches RISC-V Multi-Core 64-Bit Microprocessors

Real-time, compute intensive applications such as fully adaptive noise cancellation, voice separation and Machine Learning (ML) are pushing the boundaries of embedded processing requirements, demanding more power-efficiency, hardware-level security and high reliability at the edge. With the launch of its PIC64 portfolio, Microchip Technology expanded its computing range to meet this rising demands.

TDK Makes InvenSense SmartSound T5848 I²S MEMS Microphone Available in Distribution Channels

June 28, 2024 by Joao Martins

TDK Makes InvenSense SmartSound T5848 I²S MEMS Microphone Available in Distribution Channels

Following a very successful presence at Sensors Converge 2024 in Santa Clara, CA (June 25-26), where TDK promoted its range of MEMS microphones and sensors, the company announced worldwide distribution of its InvenSense SmartSound T5848 bottom port I²S MEMS microphone. This device is ideal to enable intelligent keyword, voice command and sound detection applications in ultra-low power designs, such has hearables and wearables. Originally announced at CES 2022, this MEMS microphone only now is available for general distribution.

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