All items tagged with edge AI (89)

Syntiant Launches NDP115 Neural Decision Processor for Always-On Speech and Sensor-Fusion

February 14, 2023 by Joao Martins

Syntiant Launches NDP115 Neural Decision Processor for Always-On Speech and Sensor-Fusion

It was one of the key audio-related demonstrations at the Syntiant suite during CES 2023, and the new NDP115 Neural Decision Processor is now positioned as a key strategic platform for new compact, ultra-low-power designs with always-on voice and sensor fusion applications. The newest addition to Syntiant's family of special purpose silicon is built using the company’s Syntiant Core 2 inference engine that can run multiple neural network loads at under 1mW.

STMicroelectronics Unveils World’s First MCU Edge-AI Developer Cloud

February 2, 2023 by Cristina Costa

STMicroelectronics Unveils World’s First MCU Edge-AI Developer Cloud

STMicroelectronics continues to expand its solutions for embedded AI developers and data scientists with a new, industry-first set of tools and services to get edge AI technology on the market faster and with less complexity by aiding hardware and software decision-making. The STM32Cube.AI Developer Cloud opens access to an extensive suite of online development tools built around the industry-leading STM32 family of microcontrollers (MCUs). Benefits include access to online service to benchmark edge-AI models on STM32 boards.

audioXpress February 2023 Now Available! What Do You Want to Hear?

January 12, 2023 by audioXpress Staff

audioXpress February 2023 Now Available! What Do You Want to Hear?

audioXpress February 2023 focuses on the small devices in the increasingly larger market of MEMS Microphones and Voice Pickup Sensors. The Market Update on this topic is complemented by Erica Yorga's article on the principles of Nureva's Unified Coverage Map. Ethan Winer offers the first of a primer on modern PC board design, there's a review of the Arylic Audio Up2Stream Amp V4 board, an inside story on how Crestron adopted AES67, and a High-Performance Tube Hybrid Preamp DIY project.

Syntiant Partners with Telink and Murata to Present New Edge AI Audio Solutions at CES 2023

December 26, 2022 by Joao Martins

Syntiant Partners with Telink and Murata to Present New Edge AI Audio Solutions at CES 2023

Syntiant is heading to CES 2023 with an exciting range of announcements and presentations of end-to-end edge AI solutions for always-on applications. The company will unveil a new reference design created in partnership with Telink that will enable ODMs and OEMs to easily and quickly deploy complete, ultra-low-power, deep learning voice processing applications in remote controls. Another major announcement is the launch of the Murata Type2DA neural decision processor module for edge AI audio and sensor applications.

Femtosense Brings Affordable First Silicon for Audio Applications to CES 2023

December 21, 2022 by audioXpress Staff

Femtosense Brings Affordable First Silicon for Audio Applications to CES 2023

Femtosense announced the arrival and successful testing of its first silicon, substantiating the startup’s assertions that it will deliver significantly more efficient, lower cost and real-time AI processing for valuable and affordable consumer electronics. At CES 2023, the Edge AI company will demonstrate compelling audio applications with highly efficient, real-time artificial intelligence (AI) processing with low power, low cost requirements.

Synaptics Launches KatanaConnect Miniature Wireless AI Vision and Audio Module

November 25, 2022 by audioXpress Staff

Synaptics Launches KatanaConnect Miniature Wireless AI Vision and Audio Module

Synaptics launched an interesting new AI System on Module (SoM) at electronica 2022. KatanaConnect combines the Katana low-power Edge AI SoC with Wi-Fi / Bluetooth wireless connectivity in an ultra-small-form-factor package to deliver AI-enabled computer vision and audio sensing capabilities. The SoM, developed with leading module vendor AMPAK, is a ready-to-use solution that enables rapid implementation of AI sensing features for connected designs targeting a range of applications, including smart home and security, and many others.

Voice Control for Low Power Microcontrollers

November 3, 2022 by Ido Gus

Voice Control for Low Power Microcontrollers

Ido Gus, Deep Learning Senior Team Leader at CEVA’s Sensor and Audio Business Unit, writes about voice control deployment on low power and resource constrained microcontroller-units (MCUs). The article discusses what to consider for the development of products using voice as a primary human interface, and how speech recognition models using AI technology can support a wide variety of use cases and languages, without compromising on power requirements.

A Look at the Future of Audio in audioXpress November 2022

October 11, 2022 by audioXpress Staff

A Look at the Future of Audio in audioXpress November 2022

audioXpress' November 2022 cover highlights this year's Speaker Design Competition, an extensive Market Update on Wireless Audio technology and two articles addressing Digital Signal Processing techniques. Frans de Wit explains the real improvements that can be achieved on power supply design for high-end audio systems, and Chuck Hansen opens up a valuable series on Power Transformers for audio electronics. Finally, Scott Dorsey visits the Lundahl Transformers factory in Sweden, while Richard Honeycutt revisits Voltage Regulator (VR) Tubes used in Audio Amplifiers.

Airoha Confirms Bluetooth LE Audio Certification. Chips to Be Available H1 2023

September 19, 2022 by Joao Martins

Airoha Confirms Bluetooth LE Audio Certification. Chips to Be Available H1 2023

Taiwan-based Airoha Technology announced that its new series of Bluetooth audio chips have successfully completed the latest Bluetooth Low Energy Audio Qualification Process and will be "widely available" to manufacturers in the first half of 2023. Airoha is one of the most important suppliers of chips for true wireless earbuds and the LE Audio certification is also an important R&D achievement for its Bluetooth audio R&D team consisted of hundreds of engineers.

A Computer in Every Ear. The Rise of Headphone 3.0

September 1, 2022 by Joao Martins

A Computer in Every Ear. The Rise of Headphone 3.0

Enter Sonical Headphone 3.0. A fully integrated approach for the product development of headphones and earbuds that allows consumers to load their own apps. audioXpress talked to Gary Spittle, the CEO and founder of Sonical, a young company that developed a chip and a real-time operating system for headphones and hearables. "Hearables should not be defined by the functions of a chip or the Bluetooth profiles, there is a lot more that product makers want to do," says Gary Spittle, the CEO and founder of Sonical.

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