All items tagged with Bluetooth LE Audio (144)
Qualcomm Introduces Mobile Wireless Connectivity Chips with 6 GHz Wi-Fi 6E and Bluetooth 5.2
May 29, 2020 by audioXpress Staff

Qualcomm Introduces Mobile Wireless Connectivity Chips with 6 GHz Wi-Fi 6E and Bluetooth 5.2

Qualcomm Technologies, launched a flagship portfolio of mobile connectivity systems that represent the most advanced Wi-Fi 6E offerings of their kind. Building upon the company's existing Wi-Fi 6 and Bluetooth audio solutions, the new Qualcomm FastConnect 6900 and Qualcomm FastConnect 6700 systems feature the fastest available Wi-Fi speeds in the industry (up to 3.6 Gbps) on a mobile Wi-Fi offering, low latency and the latest Bluetooth 5.2 advancements delivering improved audio experiences for classic and emerging LE Audio use cases.
Read more...
CEVA to Host Online Seminar Series for Wireless Connectivity, Bluetooth LE Audio, and Voice User Interfaces
May 27, 2020 by audioXpress Staff

CEVA to Host Online Seminar Series for Wireless Connectivity, Bluetooth LE Audio, and Voice User Interfaces

CEVA, a leading licensor of cutting-edge wireless connectivity and smart sensing technologies, announced that it will host a series of online seminars in June, exploring the benefits of including smart sensing and AI at the Edge in embedded designs, and the latest IoT and 5G cellular connectivity solutions. The “CEVA Technology Virtual Seminar 2020: Spring Edition” will be held over four dates, with each educational seminar focused on the challenges and trends in a specific technology domain, and hosted by CEVA product specialists and engineering experts.
Read more...
Bluetooth LE Audio and LC3: Market Overview, Technology Trends and Forecast from SAR Insight & Consulting
March 19, 2020 by audioXpress Staff

Bluetooth LE Audio and LC3: Market Overview, Technology Trends and Forecast from SAR Insight & Consulting

Cinemas, gamers and the hard of hearing could all benefit from Bluetooth 5.2, according to the latest "Bluetooth LE Audio and LC3: Market Overview, Technology Trends and Forecast" report from SAR Insight & Consulting. Bluetooth will continue to be a popular and flexible way to connect devices, thanks in part to the technology being refreshed to remain relevant to component manufacturers and consumers, says SAR Insight & Consulting.
Read more...
Ambiq Micro Licenses CEVA’s Bluetooth Low Energy IP for Next-Generation SPOT Platforms
March 11, 2020 by audioXpress Staff

Ambiq Micro Licenses CEVA’s Bluetooth Low Energy IP for Next-Generation SPOT Platforms

CEVA announced that Ambiq Micro has licensed CEVA’s RivieraWaves Bluetooth low energy IP for use in its next-generation Subthreshold Power-Optimized Technology (SPOT) platforms integrating Bluetooth connectivity. CEVA’s Bluetooth low energy (BLE) IP is already powering Ambiq Micro’s Apollo3 Blue Family Wireless System-on-Chip (SoC), used in applications requiring intelligence everywhere, from wearables to animal trackers to smart home devices.
Read more...
Essential Updates on Headphones, TWS, Hearables, Voice and More in audioXpress April 2020
March 9, 2020 by audioXpress Staff

Essential Updates on Headphones, TWS, Hearables, Voice and More in audioXpress April 2020

The April 2020 edition of audioXpress is now available and features two essential Market Updates, one focusing on the industry transition to active headphone and earphone designs, and another on how to leverage the latest voice capture and processing technologies. The issue also explains how to evaluate listening effort, and Stuart Yaniger puts the Linear Audio Autoranger Mk II Interface to the test, while Ed Simon writes about AC Power Rectification. Another issue to read and use as reference.
Read more...
Goodix Licenses and Deploys CEVA Bluetooth Low Energy IP in SoCs Targeting Connected Devices
February 24, 2020 by Joao Martins

Goodix Licenses and Deploys CEVA Bluetooth Low Energy IP in SoCs Targeting Connected Devices

CEVA announced that Goodix Technology has licensed and deployed CEVA’s RivieraWaves Bluetooth low energy IP in its GR551x series of Bluetooth low energy System-on-Chip (SoCs). The GR551x series is designed to help users develop low-power Bluetooth-based products including smart mobile devices, wearables, and connected applications. Goodix just acquired NXP’s Voice and Audio Solutions (VAS) business.
Read more...
Rohde & Schwarz Presents Next Generation Test Solutions for Bluetooth Low Energy Up to Version 5.2
February 19, 2020 by audioXpress Staff

Rohde & Schwarz Presents Next Generation Test Solutions for Bluetooth Low Energy Up to Version 5.2

The Rohde & Schwarz CMW platform of Bluetooth testers already support the new Bluetooth Low Energy (LE) version 5.2 power control test routines. At the moment of release, these are the only T&M instruments that measure all specified RF tests up to Bluetooth LE 5.0 over the air, and are ready to support also the new LE Audio specification. This unique solution has already been submitted to the Bluetooth SIG for the specification of a new Bluetooth LE test mode.
Read more...
The True Potential of True Wireless Earbuds
January 30, 2020 by Vincent Nallatamby

The True Potential of True Wireless Earbuds

This article from Vincent Nallatamby, CEO of Tempow, a Paris-based startup discusses the potential of Bluetooth LE Audio to improve true wireless stereo applications. Tempow is a research and design lab focused on pushing the limits of Bluetooth technology. The company's first product, the Tempow Audio Profile (TAP) is an updated Bluetooth protocol allowing any Bluetooth chip to stream audio on multiple Bluetooth audio outputs simultaneously. The company also released a Bluetooth Software Stack for LE Audio, the next generation of Bluetooth audio.
Read more...
Tempow Launches Partnership Program for Chipset Manufacturers to Accelerate Adoption of Bluetooth LE Audio
January 14, 2020 by audioXpress Staff

Tempow Launches Partnership Program for Chipset Manufacturers to Accelerate Adoption of Bluetooth LE Audio

Tempow, the company that specializes in software-only solutions to enhance the core Bluetooth protocol, announced the release of a new Bluetooth Software Stack for hearables and speakers, with an early prototype of the freshly revealed LE Audio, the next generation of Bluetooth audio. The company also announced a partnership program for chipset manufacturers to use Tempow’s implementation. Telink Semiconductor was the first to join the program.
Read more...
Cadence Confirms Bluetooth LE Audio LC3 Codec Support for Tensilica HiFi DSPs
January 10, 2020 by audioXpress Staff

Cadence Confirms Bluetooth LE Audio LC3 Codec Support for Tensilica HiFi DSPs

Cadence Design Systems announced that an implementation of the Low Complexity Communications Codec (LC3) that is part of the next generation Bluetooth LE Audio specification, is available now for Cadence Tensilica HiFi DSPs and has even been delivered to a lead customer. LC3 provides higher audio quality at lower bandwidth and affords developers greater flexibility in making tradeoffs between audio quality, power consumption and other features for a more optimal user experience.
Read more...