All items tagged with Bluetooth LE Audio (144)
Infineon Introduces New AIROC Wi-Fi 6/6E and Bluetooth 5.2 Combo Devices for High-Quality Video and Audio Streaming
April 9, 2021 by Cristina Costa

Infineon Introduces New AIROC Wi-Fi 6/6E and Bluetooth 5.2 Combo Devices for High-Quality Video and Audio Streaming

Infineon Technologies expanded its wireless portfolio with new high-performance, reliable and secure devices. The newly developed AIROC brand now includes the industry’s first 1x1 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for enterprise and industrial applications, and its first 2x2 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for multimedia, consumer and automotive applications. The new wireless connectivity combo devices deliver robust performance and minimal latency, making them ideal for high-quality video and audio streaming applications.
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Ellisys Rolls Out Advanced Bluetooth 5.2 LE Audio Capture and Analysis Features
March 25, 2021 by audioXpress Staff

Ellisys Rolls Out Advanced Bluetooth 5.2 LE Audio Capture and Analysis Features

Ellisys released a broad complement of innovative features to support development of emerging Bluetooth LE Audio products, including controllers, stacks, and devices. These features, available on the company's Bluetooth protocol analysis systems, broaden support for the latest Bluetooth LE Audio specifications and deliver unique technical innovations that solve complex issues for developers.
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Feeling The Audio Industry's Pulse
March 11, 2021 by Joao Martins

Feeling The Audio Industry's Pulse

It's been precisely a year since the global COVID-19 pandemic was declared and we all had to refrain from our normal routines and shelter in place, being restricted to working from home until now. At least for the audioXpress team. A year past, and we are glad to be able to signal that during that year we've kept our publications and even grown our online audiences and achieved extremely positive results. Mainly, because we continued to offer the best content for anyone interested in following the audio industry, audio product development, audio innovations, and DIY audio.
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CEVA Introduces Bluebud Turnkey IP Wireless Audio Platform for TWS Earbuds and Bluetooth Audio Devices
February 22, 2021 by Joao Martins

CEVA Introduces Bluebud Turnkey IP Wireless Audio Platform for TWS Earbuds and Bluetooth Audio Devices

CEVA unveiled Bluebud, a highly-integrated wireless audio platform aimed at standardizing DSP-enabled Bluetooth audio IP for fast-growing applications, including True Wireless Stereo (TWS) earbuds, hearables, gaming headsets, smartwatches and other wearable devices. The solution fully supports Bluetooth 5.2 and LE Audio design and is ready to support brands in the transition from Bluetooth Classic.
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Qualcomm Announces QCC305x SoC Series for True Wireless Earbud Designs with Bluetooth LE Audio Support
December 16, 2020 by audioXpress Staff

Qualcomm Announces QCC305x SoC Series for True Wireless Earbud Designs with Bluetooth LE Audio Support

Qualcomm Technologies International, unveiled the Qualcomm QCC305x SoCs, designed specifically to help brands differentiate across a range of tiers in the very fast-moving truly wireless earbud category. The new SoCs are designed to meet demand for advanced wireless audio use cases, and enable end-to-end support for the new Bluetooth LE Audio standard. The QCC305x series also adds support for ultra-low-power digital ANC technology, Qualcomm Adaptive ANC, Qualcomm TrueWireless Mirroring, and wake word activated voice assistants.
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CEVA Receives Bluetooth SIG Qualification for Its RivieraWaves Bluetooth Low Energy 5.2 Platform
November 23, 2020 by audioXpress Staff

CEVA Receives Bluetooth SIG Qualification for Its RivieraWaves Bluetooth Low Energy 5.2 Platform

CEVA announced that its RivieraWaves Bluetooth Low Energy (LE) 5.2 Platform has achieved Bluetooth SIG Qualification. As the first IP company to receive Bluetooth LE 5.2 qualification, CEVA enables its licensees to reduce their product development risk and so benefit with expedited time-to-market and end-product qualification process. Since September 2020, the Bluetooth Special Interest Group (SIG) started qualifying products using the new LE Audio Specification, announced in January 2020.
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NXP Unveils New IW62X Family of 2x2 Wi-Fi 6 + Bluetooth Devices for Advanced Audio Applications and Connected Designs
October 9, 2020 by audioXpress Staff

NXP Unveils New IW62X Family of 2x2 Wi-Fi 6 + Bluetooth Devices for Advanced Audio Applications and Connected Designs

NXP Semiconductors announced its latest family of 2x2 Wi-Fi 6 (802.11ax) Dual Band + Bluetooth/BLE-Audio devices, designed to drive a new phase of connectivity innovation for all sorts of advanced audio, gaming and connected devices. Enabling the world’s first Wi-Fi 6 enabled gaming console (the new PlayStation 5), NXP’s optimized IW62X family of products will provide increased capacity, efficiency and performance for next-generation connectivity solutions including wireless speakers and all sorts of smart devices.
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Bluetooth SIG to Begin Qualifying Products Using LC3 Codec
September 24, 2020 by Joao Martins

Bluetooth SIG to Begin Qualifying Products Using LC3 Codec

The Bluetooth Special Interest Group (SIG) announced it will start qualifying products using the LC3 Low Complexity Communication Codec, part of the new LE Audio Specification announced at CES 2020, back in January. Even though the organization doesn't expect the rest of the specifications that define all the use cases for LE Audio to be released before mid-year 2021, manufacturers are officially encouraged to start implementing the new Fraunhofer/Ericsson codec.
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Apollo4 SoC Family from Ambiq Redefines Ultra-low Power in Wearables, Connected Devices and Always-on Voice-Processing
September 14, 2020 by audioXpress Staff

Apollo4 SoC Family from Ambiq Redefines Ultra-low Power in Wearables, Connected Devices and Always-on Voice-Processing

Ambiq unveiled its latest Apollo4 SoC family, enabling next generation endpoint devices with record-setting energy efficiency - running as low as 3µA/MHz - and new levels of performance. The new Apollo4 systems enable manufacturers to create leading-edge endpoint devices leveraging the unique SPOT platform with Ambiq’s easy-to-use, rich peripheral set. The Apollo4 is available now with CSP and BGA package offerings, as well as an Apollo4 Blue SoC with Bluetooth LE.
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Fraunhofer IIS Licenses LC3 Audio Codec Software to Microsoft
July 10, 2020 by audioXpress Staff

Fraunhofer IIS Licenses LC3 Audio Codec Software to Microsoft

The Fraunhofer Institute for Integrated Circuits IIS announced the licensing of its LC3 software implementation to Microsoft Corp. LC3 (Low Complexity Communication Codec) is the audio codec adopted for Bluetooth LE Audio, a new audio architecture designed to boost the performance of Bluetooth Audio – for voice calls as well as for media playback including music. Following the news that Microsoft had licensed the xHE-AAC codec and MPEG-D DRC software implementation from Fraunhofer IIS, the addition of LC3 is a logic step.
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