All items tagged with Bluetooth LE Audio (118)
Rohde & Schwarz Presents Next Generation Test Solutions for Bluetooth Low Energy Up to Version 5.2
February 19, 2020 by audioXpress Staff

Rohde & Schwarz Presents Next Generation Test Solutions for Bluetooth Low Energy Up to Version 5.2

The Rohde & Schwarz CMW platform of Bluetooth testers already support the new Bluetooth Low Energy (LE) version 5.2 power control test routines. At the moment of release, these are the only T&M instruments that measure all specified RF tests up to Bluetooth LE 5.0 over the air, and are ready to support also the new LE Audio specification. This unique solution has already been submitted to the Bluetooth SIG for the specification of a new Bluetooth LE test mode.
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The True Potential of True Wireless Earbuds
January 30, 2020 by Vincent Nallatamby

The True Potential of True Wireless Earbuds

This article from Vincent Nallatamby, CEO of Tempow, a Paris-based startup discusses the potential of Bluetooth LE Audio to improve true wireless stereo applications. Tempow is a research and design lab focused on pushing the limits of Bluetooth technology. The company's first product, the Tempow Audio Profile (TAP) is an updated Bluetooth protocol allowing any Bluetooth chip to stream audio on multiple Bluetooth audio outputs simultaneously. The company also released a Bluetooth Software Stack for LE Audio, the next generation of Bluetooth audio.
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Tempow Launches Partnership Program for Chipset Manufacturers to Accelerate Adoption of Bluetooth LE Audio
January 14, 2020 by audioXpress Staff

Tempow Launches Partnership Program for Chipset Manufacturers to Accelerate Adoption of Bluetooth LE Audio

Tempow, the company that specializes in software-only solutions to enhance the core Bluetooth protocol, announced the release of a new Bluetooth Software Stack for hearables and speakers, with an early prototype of the freshly revealed LE Audio, the next generation of Bluetooth audio. The company also announced a partnership program for chipset manufacturers to use Tempow’s implementation. Telink Semiconductor was the first to join the program.
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Cadence Confirms Bluetooth LE Audio LC3 Codec Support for Tensilica HiFi DSPs
January 10, 2020 by audioXpress Staff

Cadence Confirms Bluetooth LE Audio LC3 Codec Support for Tensilica HiFi DSPs

Cadence Design Systems announced that an implementation of the Low Complexity Communications Codec (LC3) that is part of the next generation Bluetooth LE Audio specification, is available now for Cadence Tensilica HiFi DSPs and has even been delivered to a lead customer. LC3 provides higher audio quality at lower bandwidth and affords developers greater flexibility in making tradeoffs between audio quality, power consumption and other features for a more optimal user experience.
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Synopsys Announces Bluetooth LE Audio LC3 Codec for ARC Processor
January 10, 2020 by audioXpress Staff

Synopsys Announces Bluetooth LE Audio LC3 Codec for ARC Processor

Synopsys collaborated with Fraunhofer IIS to release an implementation of the LC3 codec, part of the next-generation Bluetooth LE Audio specification. The new LC3 codec is optimized to deliver high-quality audio and voice playback in battery-powered devices incorporating ARC EM and HS DSP processors, and expands Synopsys' DesignWare Bluetooth Low Energy IP offerings and the portfolio of DesignWare ARC audio codecs and post-processing software.
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CEVA Speeds the Development of True Wireless Stereo Earbuds with Support of Bluetooth LE Audio
January 8, 2020 by audioXpress Staff

CEVA Speeds the Development of True Wireless Stereo Earbuds with Support of Bluetooth LE Audio

CEVA, the wireless connectivity specialist, announced that it has enhanced its offerings for developers of true wireless stereo (TWS) earbuds and other wireless audio devices with the general release of the RivieraWaves Bluetooth Low Energy and Dual Mode IPs with support for LE Audio, the next generation of Bluetooth audio. The CEVA solution introduces new features that enhance audio quality and link robustness as well as enabling new audio sharing use cases.
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Nordic Semiconductor Launches Bluetooth LE Audio Evaluation Platform
January 8, 2020 by audioXpress Staff

Nordic Semiconductor Launches Bluetooth LE Audio Evaluation Platform

Nordic Semiconductor announced it has launched an LE Audio Evaluation Platform in partnership with San Diego, CA-based Bluetooth Low Energy (Bluetooth LE) stack developer, Packetcraft. The LE Audio solution demonstrates the benefits of High-Quality Wireless LE Audio and is designed to support the new LE Audio specifications that are expected to be released by the Bluetooth Special Interest Group (SIG) during the first half of 2020.
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Bluetooth SIG Unveils LE Audio, the Next Generation of Bluetooth Audio
January 7, 2020 by audioXpress Staff

Bluetooth SIG Unveils LE Audio, the Next Generation of Bluetooth Audio

At CES 2020, the Bluetooth Special Interest Group (SIG) announced the upcoming release of LE Audio, the next generation of Bluetooth audio. Two years on the making, Bluetooth LE Audio will enhance the performance of wireless audio, add support for hearing aids, and introduce Audio Sharing, a new use case with the potential to once again change the way we experience audio and connect with the world around us as Bluetooth did when it cut the cord 20 years ago to create the wireless audio market.
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