All items tagged with Bluetooth 5 (227)
Nordic Semiconductor Releases Bluetooth 5 Pre-Qualified, Production-Ready Development Solution
August 3, 2017 by audioXpress Staff

Nordic Semiconductor Releases Bluetooth 5 Pre-Qualified, Production-Ready Development Solution

Nordic Semiconductor released its Bluetooth 5 pre-qualified, production-ready development solution for building Bluetooth 5 qualified products using the company's nRF52832 SoC. The solution combines production-ready Bluetooth 5 software - S132 v5.0 SoftDevice and nRF5 SDK v14.0 - enabling developers to design high performance Bluetooth 5-ready products, taking advantage of increased throughput, longer range, advertising extensions and increased broadcast capacity and co-existence.
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STMicroelectronics Introduces BlueNRG-2 Next-Generation Bluetooth Low Energy Chip for Wireless Connected Smart Devices
June 29, 2017 by audioXpress Staff

STMicroelectronics Introduces BlueNRG-2 Next-Generation Bluetooth Low Energy Chip for Wireless Connected Smart Devices

STMicroelectronics announced its new BlueNRG-2 Bluetooth Low Energy Chip, combining small size, and high performance, as currently required by the widespread deployment of energy-conscious, space-constrained applications with BLE connectivity. According to the company, the new solution provides state-of-the-art security and is Bluetooth 5.0-certified to ensure interoperability with the latest mobiles and tablets.
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MediaTek Launches 4x4 802.11n/Bluetooth 5.0 System-on-Chip with Dedicated Wi-Fi Accelerator
June 1, 2017 by Cristina Costa

MediaTek Launches 4x4 802.11n/Bluetooth 5.0 System-on-Chip with Dedicated Wi-Fi Accelerator

MediaTek announced the world's first 4x4 802.11n and Bluetooth 5.0 system-on-chip featuring a dedicated Wi-Fi network accelerator. The MediaTek MT7622 was created for premium networking devices including routers and repeaters, whole home Wi-Fi, and home automation gateways that pre-integrates audio and storage features. MediaTek also announced its next generation Wi-Fi low power chipset portfolio for connected smart home devices.
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Nordic Semiconductor Shows Development Kit and Other Solutions for Bluetooth 5 Implementation
March 28, 2017 by audioXpress Staff

Nordic Semiconductor Shows Development Kit and Other Solutions for Bluetooth 5 Implementation

Following the announcement at CES 2017 of its Bluetooth 5-compatible nRF52 Series SoCs (nRF52832 and nRF52840 devices), Nordic Semiconductor is showing new development tools for Bluetooth 5 at Bluetooth World, the official event of Bluetooth SIG, taking place at Santa Clara Convention Center, 28-29 March, 2017. Demonstrations include the new Preview Development Kit (nRF52840-PDK) and its first Thread networking SDK.
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Dialog Semiconductor Introduces Bluetooth 5 Low Power SoC with Integrated Microphone Interface
March 27, 2017 by audioXpress Staff

Dialog Semiconductor Introduces Bluetooth 5 Low Power SoC with Integrated Microphone Interface

As the connected devices market enters a new era of connectivity with Bluetooth 5.0, Dialog Semiconductor announced the next generation in its SmartBond family – DA14586. The all-new System-on-Chip (SoC) is the company’s first standalone device that is qualified to support the latest Bluetooth 5.0 specification, delivering the lowest power consumption and unrivalled functionality for advanced use cases.
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Bluetooth 5 Audio Update - An Interview with Mark Powell, Executive Director, Bluetooth SIG
March 23, 2017 by Joao Martins

Bluetooth 5 Audio Update - An Interview with Mark Powell, Executive Director, Bluetooth SIG

Ahead of the Bluetooth World 2017 meeting (March 28-29 2017), which will bring together more than 1,000 developers, executives, and start-ups on a busy exhibition floor to promote Bluetooth development and applications, we thought it would be appropriate to share part of the interview we had with Mark Powell, Executive Director, Bluetooth SIG, at CES 2017, where we discussed the Bluetooth 5 roadmap.
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Teledyne LeCroy Announces New Bluetooth 5 Development and Conformance Solutions
March 23, 2017 by audioXpress Staff

Teledyne LeCroy Announces New Bluetooth 5 Development and Conformance Solutions

Teledyne LeCroy, a leading company in Bluetooth protocol analysis and testing services, announced the development of a Bluetooth Conformance Tester for verifying conformance of Bluetooth low energy link layer and HCI implementations and also announced availability of the Frontline Sodera LE Analyzer supporting Bluetooth 5. Both solutions complement Teledyne's Audio Expert System audio quality tool set for resolving audio issues related to the Bluetooth protocol.
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New Wireless Gecko Bluetooth 5-Compliant SoCs Help Developers Tackle Multiprotocol Design Challenges
March 16, 2017 by audioXpress Staff

New Wireless Gecko Bluetooth 5-Compliant SoCs Help Developers Tackle Multiprotocol Design Challenges

Silicon Labs announced a major expansion of its Wireless Gecko system-on-chip (SoC) portfolio, making it easier for developers of all skill levels to add versatile multiprotocol switching capabilities to increasingly complex applications. The new EFR32xG12 SoCs support a broader range of multiprotocol, multiband use cases for home automation, connected lighting, wearables and industrial applications.
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Swiss Companies Introduce the World Smallest Bluetooth Chip
March 14, 2017 by audioXpress Staff

Swiss Companies Introduce the World Smallest Bluetooth Chip

Integrated in the “Swiss Silicon Valley”, the Swatch Group introduced a new Bluetooth integrated circuit, designed 100% by EM Microelectronic, Swatch Group R & D and the Swiss Center for Electronics and Microtechnology (CSEM). The EM9304 Bluetooth chip is already qualified against the new Bluetooth Version 5.0 standard. MSC Technologies, a company of Avnet, is already distributing the solution.
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Cypress Unveils Low Power MCU Architecture for Secure Devices
March 14, 2017 by Cristina Costa

Cypress Unveils Low Power MCU Architecture for Secure Devices

Cypress Semiconductor announced its newest microcontroller (MCU) PSoC 6 architecture that is purpose-built for the Internet of Things (IoT). The architecture is built on ultra-low-power 40-nm process technology, with integrated security features required for next-generation IoT devices. Featuring dual-core processing, the architecture fills a gap in the IoT solution space between power-hungry and higher-cost application processors and performance-challenged, single-core MCUs.
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