Tempow Launches Partnership Program for Chipset Manufacturers to Accelerate Adoption of Bluetooth LE Audio

Tempow, the company that specializes in software-only solutions to enhance the core Bluetooth protocol, announced the release of a new Bluetooth Software Stack for hearables and speakers, with an early prototype of the freshly revealed LE Audio, the next generation of Bluetooth audio. The company also announced a partnership program for chipset manufacturers to use Tempow’s implementation. Telink Semiconductor was the first to join the program.

CEVA, the wireless connectivity specialist, announced that it has enhanced its offerings for developers of true wireless stereo (TWS) earbuds and other wireless audio devices with the general release of the RivieraWaves Bluetooth Low Energy and Dual Mode IPs with support for LE Audio, the next generation of Bluetooth audio. The CEVA solution introduces new features that enhance audio quality and link robustness as well as enabling new audio sharing use cases.

At CES 2020, the Bluetooth Special Interest Group (SIG) announced the upcoming release of LE Audio, the next generation of Bluetooth audio. Two years on the making, Bluetooth LE Audio will enhance the performance of wireless audio, add support for hearing aids, and introduce Audio Sharing, a new use case with the potential to once again change the way we experience audio and connect with the world around us as Bluetooth did when it cut the cord 20 years ago to create the wireless audio market.