All items tagged with Bluetooth 5.2 (83)

Qualcomm Announces QCC305x SoC Series for True Wireless Earbud Designs with Bluetooth LE Audio Support

December 16, 2020 by audioXpress Staff

Qualcomm Announces QCC305x SoC Series for True Wireless Earbud Designs with Bluetooth LE Audio Support

Qualcomm Technologies International, unveiled the Qualcomm QCC305x SoCs, designed specifically to help brands differentiate across a range of tiers in the very fast-moving truly wireless earbud category. The new SoCs are designed to meet demand for advanced wireless audio use cases, and enable end-to-end support for the new Bluetooth LE Audio standard. The QCC305x series also adds support for ultra-low-power digital ANC technology, Qualcomm Adaptive ANC, Qualcomm TrueWireless Mirroring, and wake word activated voice assistants.

EarFun Sets Record for Lightest ANC Wireless Earbuds with New EarFun Free Pro

December 7, 2020 by Joao Martins

EarFun Sets Record for Lightest ANC Wireless Earbuds with New EarFun Free Pro

EarFun is one of those consumer brands, established in 2018 by an experienced group of industrial designers and acoustic engineers, focused on next-generation wireless audio devices and leveraging their manufacturing network in Shenzhen, China. Committed to deliver solutions that use the latest technology and improve sound quality, the EarFun engineering team has been pushing the envelope on how affordable and sophisticated true wireless earbuds can be. With the new EarFun Free Pro, the brand seems to have come full circle.

Nordic Semiconductor nRF5340 for Bluetooth 5.2 and LE Audio Applications Now Available

December 4, 2020 by audioXpress Staff

Nordic Semiconductor nRF5340 for Bluetooth 5.2 and LE Audio Applications Now Available

Nordic Semiconductor has announced that its nRF5340 high-end multiprotocol Bluetooth 5.2 System-on-Chip (SoC) has entered volume production. The world’s first dual Arm Cortex-M33 wireless SoC is now available and offers all the advanced features and security required for the next-generation of connected audio applications including LE Audio and advanced wearables. The new SoC is now widely commercially available through Nordic’s distribution network.

Qualcomm Unveils Snapdragon 888 Mobile Processing Platform

December 3, 2020 by Joao Martins

Qualcomm Unveils Snapdragon 888 Mobile Processing Platform

During the annual Snapdragon Tech Summit Digital 2020, Qualcomm introduced its latest flagship Qualcomm Snapdragon 888 5G Mobile Platform, which will set the benchmark for flagship Android smartphones in 2021. This new platform packs industry-leading mobile innovations in 5G, artificial intelligence (AI), gaming, and camera technologies, while offering all the processing and connectivity power to enable next-generation immersive audio experiences, including support for Bluetooth 5.2 with LE Audio features.

CEVA Receives Bluetooth SIG Qualification for Its RivieraWaves Bluetooth Low Energy 5.2 Platform

November 23, 2020 by audioXpress Staff

CEVA Receives Bluetooth SIG Qualification for Its RivieraWaves Bluetooth Low Energy 5.2 Platform

CEVA announced that its RivieraWaves Bluetooth Low Energy (LE) 5.2 Platform has achieved Bluetooth SIG Qualification. As the first IP company to receive Bluetooth LE 5.2 qualification, CEVA enables its licensees to reduce their product development risk and so benefit with expedited time-to-market and end-product qualification process. Since September 2020, the Bluetooth Special Interest Group (SIG) started qualifying products using the new LE Audio Specification, announced in January 2020.

Bluetooth SIG to Begin Qualifying Products Using LC3 Codec

September 24, 2020 by Joao Martins

Bluetooth SIG to Begin Qualifying Products Using LC3 Codec

The Bluetooth Special Interest Group (SIG) announced it will start qualifying products using the LC3 Low Complexity Communication Codec, part of the new LE Audio Specification announced at CES 2020, back in January. Even though the organization doesn't expect the rest of the specifications that define all the use cases for LE Audio to be released before mid-year 2021, manufacturers are officially encouraged to start implementing the new Fraunhofer/Ericsson codec.

Nordic Unveils New Bluetooth 5.2 SoC Optimized for Compact, Two-Layer PCB Wireless Products

June 19, 2020 by audioXpress Staff

Nordic Unveils New Bluetooth 5.2 SoC Optimized for Compact, Two-Layer PCB Wireless Products

Nordic Semiconductor announced the nRF52805 Bluetooth 5.2 System-on-Chip (SoC), the seventh addition to its popular and proven nRF52 Series. The new nRF52805 SoC offers Bluetooth LE high-throughput 2 Mbps and enhanced Channel Selection Algorithm #2 for improved coexistence, and 2.4 GHz proprietary protocols for cost-constrained applications. This SoC is an ideal Bluetooth LE solution for high-volume, compact wireless applications.

Qualcomm Introduces Mobile Wireless Connectivity Chips with 6 GHz Wi-Fi 6E and Bluetooth 5.2

May 29, 2020 by audioXpress Staff

Qualcomm Introduces Mobile Wireless Connectivity Chips with 6 GHz Wi-Fi 6E and Bluetooth 5.2

Qualcomm Technologies, launched a flagship portfolio of mobile connectivity systems that represent the most advanced Wi-Fi 6E offerings of their kind. Building upon the company's existing Wi-Fi 6 and Bluetooth audio solutions, the new Qualcomm FastConnect 6900 and Qualcomm FastConnect 6700 systems feature the fastest available Wi-Fi speeds in the industry (up to 3.6 Gbps) on a mobile Wi-Fi offering, low latency and the latest Bluetooth 5.2 advancements delivering improved audio experiences for classic and emerging LE Audio use cases.

Bluetooth LE Audio and LC3: Market Overview, Technology Trends and Forecast from SAR Insight & Consulting

March 19, 2020 by audioXpress Staff

Bluetooth LE Audio and LC3: Market Overview, Technology Trends and Forecast from SAR Insight & Consulting

Cinemas, gamers and the hard of hearing could all benefit from Bluetooth 5.2, according to the latest "Bluetooth LE Audio and LC3: Market Overview, Technology Trends and Forecast" report from SAR Insight & Consulting. Bluetooth will continue to be a popular and flexible way to connect devices, thanks in part to the technology being refreshed to remain relevant to component manufacturers and consumers, says SAR Insight & Consulting.

Rohde & Schwarz Presents Next Generation Test Solutions for Bluetooth Low Energy Up to Version 5.2

February 19, 2020 by audioXpress Staff

Rohde & Schwarz Presents Next Generation Test Solutions for Bluetooth Low Energy Up to Version 5.2

The Rohde & Schwarz CMW platform of Bluetooth testers already support the new Bluetooth Low Energy (LE) version 5.2 power control test routines. At the moment of release, these are the only T&M instruments that measure all specified RF tests up to Bluetooth LE 5.0 over the air, and are ready to support also the new LE Audio specification. This unique solution has already been submitted to the Bluetooth SIG for the specification of a new Bluetooth LE test mode.

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