All items tagged with audio development (29)

Audio Developers Come Together for ADC22, November 14-16, 2022

November 2, 2022 by audioXpress Staff

Audio Developers Come Together for ADC22, November 14-16, 2022

The producers of the 8th Annual Audio Developer Conference (ADC22 - London, UK) announced that the in-person portion of their hybrid event has sold out due to high demand from the audio developer community. Yet, tickets are still available to attend this one-of-a-kind online experience using the on Gather.town virtual venue platform from November 14-16, 2022 at www.audio.dev.

Fraunhofer Cingo Immersive Listening Now Available in Audio Weaver

July 11, 2022 by Joao Martins

Fraunhofer Cingo Immersive Listening Now Available in Audio Weaver

DSP Concepts announced that its Audio Weaver development platform for audio products now also offers access to the Fraunhofer Cingo family of immersive processing tools. The agreement with Fraunhofer IIS allows audio product developers to enhance headphones, earbuds and speakers with binaural audio processing for immersive 3D sound with head tracking, as well as enhance existing stereo content, including loudness optimization and equalization. Cingo supports all channel-based formats and direct rendering of audio objects with associated position metadata, which can be transmitted as MPEG-H Audio.

Nordic Semiconductor Showcases Bluetooth LE Audio with Auracast Development Solutions

June 27, 2022 by Joao Martins

Nordic Semiconductor Showcases Bluetooth LE Audio with Auracast Development Solutions

Nordic Semiconductor has used the latest trade shows globally to showcase its latest low power wireless solutions, and introduced a series of new development solutions targeting Bluetooth LE Audio. At the Embedded World Exhibition that took place in Nuremberg, Germany, Nordic offered demonstrations of its new nRF5340 Audio Development Kit (DK), a design platform for rapid development of LE Audio products, and the Nordic Thingy:53 a rapid prototyping solution, both based on Nordic’s nRF5340 SoC.

HEM Unveils Serce Digital Audio System on a Module

May 30, 2022 by Joao Martins

HEM Unveils Serce Digital Audio System on a Module

Following the launch of three Ferrum products, HEM now announces Serce, a completely new digital audio platform that contains everything needed for a wide range of new hi-fi product developments. HEM is the audio manufacturing company from Poland that recently launched its own brand, Ferrum, with products aimed at high end audio enthusiasts. With Serce, HEM reinforces its position as a one-stop-shop solution for ODM/OEM audio electronics.

Nordic Semiconductor nRF5340 Audio DK Accelerates Bluetooth LE Audio Developments

May 20, 2022 by Cristina Costa

Nordic Semiconductor nRF5340 Audio DK Accelerates Bluetooth LE Audio Developments

The next generation of wireless audio projects is now getting on the bench, as developers get access to the first Bluetooth LE Audio evaluation platforms. Nordic Semiconductor has long been a reference in Bluetooth development platforms and has now released its nRF5340 Bluetooth LE Audio DK board, which includes everything required for developers to take advantage of the latest Bluetooth standard, including LC3 codec, low power consumption, and wireless stereo enhancements.

Sound Hub Denmark Establishes Partnership Agreement with Product Development Specialists Develco

March 24, 2022 by audioXpress Staff

Sound Hub Denmark Establishes Partnership Agreement with Product Development Specialists Develco

In the building that once was Bang & Olufsen's R&D department and acoustic test facilities, in Struer, Denmark, an ever-increasing number companies, entrepreneurs and researchers, are now working in all types of projects related to audio, sound and acoustics. Development house Develco was the latest company to join the vibrant hub that is now Sound Hub Denmark, expanding the already impressive partner network.

Second Modeling and Measurement Webinar on Designing Audio Devices With Digital Twins Scheduled for October 27

October 21, 2021 by Audio Engineering_Society

Second Modeling and Measurement Webinar on Designing Audio Devices With Digital Twins Scheduled for October 27

The AES Audio Product Education Institute (APEI) continues to explore the practice and benefits of simulation-driven audio architecture design. In the second Modeling and Measurement webinar in this series (October 27, 12pm EDT), experts from COMSOL, JJR Acoustic and Facebook, will describe and detail a real virtual architectural design story. Registration for this webinar is now available.

Be The First To Learn About Exciting New Developments from Tectonic!

August 16, 2021 by Special Content

Be The First To Learn About Exciting New Developments from Tectonic!

Tectonic is looking forward to engage with speaker designers and audio developers and share all the details about our next-generation BMR technology and product announcements. We are inviting you to sign-up now to get exclusive and earlier access to our preliminary datasheets, receive an invitation to an exclusive online event - promoted in partnership with audioXpress - and for the opportunity to receive exclusive giveaways! After you sign-up, you can immediately download more information about Tectonic and BMR technology.

AES Audio Product Education Institute Invites Design Houses to Discuss How to Quickly Bring Audio Products to Market

March 12, 2021 by Audio Engineering_Society

AES Audio Product Education Institute Invites Design Houses to Discuss How to Quickly Bring Audio Products to Market

The AES Audio Product Education Institute (APEI), will host its sixth online event addressing Supply Chain & Sourcing on Wednesday, March 17 (12:00pm EDT). The online session will feature top executives from Cardinal Peak and One Point Zero discussing the role and contributions of design houses as a critical support option in bringing new products to market.

Syntiant Introduces Second Generation NDP120 Deep Learning Processor for Audio and Sensor Applications

January 7, 2021 by audioXpress Staff

Syntiant Introduces Second Generation NDP120 Deep Learning Processor for Audio and Sensor Applications

Syntiant Corp., the AI for edge devices chip technology company from Irvine, California, announced the availability of its latest Syntiant NDP120 Neural Decision Processor (NDP), a new generation of special purpose chips for audio and sensor processing for always-on applications in battery-powered devices. The low-power Syntiant Core 2 technology in the NDP120 processor delivers 25x the tensor throughput of the core technology found in earlier Syntiant NDP devices that are currently shipping in high volumes.

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