All items tagged with artificial intelligence (223)

Klipsch Unveils T5 II True Wireless ANC Earphones with Bragi OS and Dirac Sound Optimization

January 15, 2021 by Joao Martins

Klipsch Unveils T5 II True Wireless ANC Earphones with Bragi OS and Dirac Sound Optimization

The results of an extended collaboration between Klipsch, Dirac and Bragi were finally unveiled at CES 2021. The famous consumer audio brand (a VOXX International company), teamed up with Dirac's digital audio processing experts, and the pioneers in hearables and creators of the Bragi Software Suite with embedded AI, to create the new Klipsch T5 II True Wireless ANC Earphones, which will be launched later in 2021.

Cardinal Peak and Syntiant Announce Collaboration to Provide Voice-Enabled Audio Product Design Services

January 15, 2021 by audioXpress Staff

Cardinal Peak and Syntiant Announce Collaboration to Provide Voice-Enabled Audio Product Design Services

Cardinal Peak, a leading provider of product engineering services, and Syntiant, the fast-growing developer of deep learning AI chips for edge devices, announced a design collaboration focused on providing brands with a turnkey solution to build innovative end-to-end audio and voice-enabled products. The product engineering services firm from Boulder, CO, will expand Syntiant's efforts to offer customized AI hardware and software solutions to the consumer electronics industry.

CEVA Expands Possibilities in Sensor Hub DSPs with 2nd Generation SensPro Family

January 13, 2021 by audioXpress Staff

CEVA Expands Possibilities in Sensor Hub DSPs with 2nd Generation SensPro Family

CEVA introduced its 2nd generation SensPro DSP family, a hub for AI and DSP processing workloads associated with a wide range of sensors including camera, Radar, LiDAR, Time-of-Flight, microphones and inertial measurement units (IMUs). The new, lower power, SensPro2 DSPs deliver up to 10X performance improvement versus CEVA-BX2 DSP for AI networks used for voice assistants, natural language processing and spatial audio. They are also automotive-ready with high-precision floating-point capability.

DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor

January 7, 2021 by audioXpress Staff

DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor

DSP Group announced the DBM10, a new low-power, cost-effective artificial intelligence (AI) and machine learning (ML) system-on-chip (SoC). This new open platform, with a cost- and power-optimized architecture, enables rapid development of AI and ML applications for mobile, wearables, hearables, and connected devices in general. It provides a complete platform in terms of voice and audio processing, without compromising the battery life of new designs, and allowing developers to implement their own differentiating algorithms.

Syntiant Introduces Second Generation NDP120 Deep Learning Processor for Audio and Sensor Applications

January 7, 2021 by audioXpress Staff

Syntiant Introduces Second Generation NDP120 Deep Learning Processor for Audio and Sensor Applications

Syntiant Corp., the AI for edge devices chip technology company from Irvine, California, announced the availability of its latest Syntiant NDP120 Neural Decision Processor (NDP), a new generation of special purpose chips for audio and sensor processing for always-on applications in battery-powered devices. The low-power Syntiant Core 2 technology in the NDP120 processor delivers 25x the tensor throughput of the core technology found in earlier Syntiant NDP devices that are currently shipping in high volumes.

CEVA Establishes Partnership with DARPA for Technology Innovation

January 5, 2021 by audioXpress Staff

CEVA Establishes Partnership with DARPA for Technology Innovation

CEVA announced an open licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation for DARPA programs. The commercial partnership, as part of the DARPA Toolbox initiative, establishes an access framework under which DARPA organizations can access all of CEVA’s commercially available IPs, tools and support to expedite their programs. This provides DARPA researchers with access to CEVA’s portfolio of wireless connectivity and smart sensing IPs.

Acon Digital Releases Noise Reduction for Dialogue Plug-in

December 14, 2020 by audioXpress Staff

Acon Digital Releases Noise Reduction for Dialogue Plug-in

Acon Digital has released Extract:Dialogue, a plug-in that separates dialogue from common types of background noise such as wind, rustle, traffic, hum, clicks and pops. The algorithm works in real time and is based on deep learning, using thousands of high-quality voice recordings and an equally extensive set of common noise sources. This extensive training enables the software to automatically distinguish speech and dialogue from noise, without any user interaction.

Simon Says Assemble Uses Audio-to-Text Transcription For Video Editing

December 9, 2020 by audioXpress Staff

Simon Says Assemble Uses Audio-to-Text Transcription For Video Editing

Simon Says is a company from San Francisco, specializing in timecode-based AI transcription, which now announced the launch of Simon Says Assemble, a new product and significant expansion to the Simon Says platform that makes video editing as simple as copying and pasting text. According to the company, the new application, which is directly supported by popular NLE and MAM applications, brings the story forward with modern tools and narrative-driven editing capabilities that enable collaboration and speed up video workflows.

Elliptic Labs Expands its Ultrasound Sensing Framework to More Devices and Mobile Platforms

November 19, 2020 by Joao Martins

Elliptic Labs Expands its Ultrasound Sensing Framework to More Devices and Mobile Platforms

Norwegian company Elliptic Labs has successfully introduced its ultrasound sensing technology to the market, leveraging early agreements with major chip suppliers to the IT and mobile industries. Following partnerships with Texas Instruments, Infineon, Knowles, Cirrus Logic and AAC Technologies, at the implementation level, Elliptic Labs this year expanded its support directly with chipset manufacturers ARM, Intel, Qualcomm and more recently MediaTek. And the company's efforts in ultrasound-based sensing are just in early stages.

ABI Research Projects Transformational Smart Home Trends

November 9, 2020 by audioXpress Staff

ABI Research Projects Transformational Smart Home Trends

Homes will change more over the next 20 years than they did during the past hundred says ABI Research. The next generation home, the Transformational Smart Home, is emerging and will transform life inside homes and reshape the world of consumer services and citizen interactions. In its latest research, now available, the tech market advisory firm outlines six major smart home concepts that will drive Smart Home investment and adoption.

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