TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

Following its acquisition of Chirp Microsystems in February 2018, TDK Corporation now announced the immediate availability of the latest Chirp SmartSonic platform family of ultrasonic sensor time-of-flight (ToF) solutions. The SmartSonic platform is currently available with the Chirp CH-101, an ultra-low power ultrasonic ToF range sensor that provides millimeter-accurate range measurements up to 1.2m, independent of target color and transparency.

TDK announced an expansion to its range of noise suppression filters for audio lines. The MAF1005G series now features low DC resistance and high rated current of up to 1.25 A, offering noise suppression at cellular frequencies from 600 MHz to 2.7 GHz. Due to their high rated current and compact dimensions, the components are ideally suited for the audio lines of external smartphone speakers and other compact communication devices such as headphones and microphones.

TDK Corporation announced that it has reached an agreement with Chirp Microsystems, a pioneer in high-performance ultrasonic sensing, headquartered in Berkeley, California. With the acquisition, Chirp becomes a wholly owned subsidiary of TDK, enhancing its existing technology in fingerprint sensors, MEMS sensors, and Piezoelectric transducer product lines. “TDK aims to be the leader in the ultrasonic MEMS sensors and solutions market,” says Shigenao Ishiguro, TDK’s President and CEO.

TDK Corporation showcased a Synaptics AudioSmart solution for voice recognition, using InvenSense high performance MEMS microphones. The ICS-40212 and ICS-40720 analog output and the ICS-41350 PDM digital output MEMS microphones are approved for use with Synaptics AudioSmart Amazon Voice Services (AVS) solution. TDK also announced the worldwide availability of its SmartMotion Platform encompassing 4 unique development kits with multiple sensors.

TDK Corporation announced the release of an ultra-thin, high-energy capacitor suitable for powering devices such as electronic paper displays, advanced biometric authentication or, simple displays in wireless headphones. The 5 mF electric double-layer capacitor has a maximum thickness of just 0.45 mm and, when fully charged, provides around 50 mJ of energy to power a load.