All items tagged with TDK (29)

iFi Announces New Hip-DAC Portable USB DAC/Headphone Amp

February 4, 2020 by audioXpress Staff

iFi Announces New Hip-DAC Portable USB DAC/Headphone Amp

iFi announced a new model to its already extensive range of portable DAC/headphone amps with an all-new design – the Hip-DAC. Looking conveniently like a pocket flask, the new portable device features an extruded aluminum enclosure with a distinct petrol blue finish and a touch of copper, offering an extensive set of specifications to support high resolution audio (HRA) sources, while keeping an affordable price tag at just $149 USD or €159 Euros.

TDK Introduces New Varistors with ESD and EMI Combined Protection for Audio Equipment

January 31, 2020 by audioXpress Staff

TDK Introduces New Varistors with ESD and EMI Combined Protection for Audio Equipment

TDK Corporation has expanded its lineup of chip varistors with the new AVRF101U6R8KT242 for audio equipment, which offers both ESD and EMI protection. This new product is intended for audio equipment that uses wireless communications in the 2.4 GHz band. Thanks to optimization of its capacitance of 6.8 pF, the multilayer component features high attenuation at this frequency and is able to effectively suppress the generated TDMA noise and thus improve receiver sensitivity.

TDK Announces First MIPI Standard SoundWire MEMS Microphone

January 21, 2020 by audioXpress Staff

TDK Announces First MIPI Standard SoundWire MEMS Microphone

Among the many interesting demonstrations of new audio solutions for developers presented by TDK at CES 2020, the T5808 MIPI standard SoundWire microphone stands out as a "world's first," using the MIPI Alliance SoundWire compliant digital interface which allows bi-directional data flow. The T5808 is a multi-mode, low noise digital MEMS microphone in a small package, consisting of a MEMS microphone element and an impedance converter amplifier followed by a fourth-order Σ-Δ modulator.

TDK Expands PiezoListen Lineup of Ultra-Thin Piezo Speakers with a Wider Dynamic Range

October 29, 2019 by audioXpress Staff

TDK Expands PiezoListen Lineup of Ultra-Thin Piezo Speakers with a Wider Dynamic Range

TDK Corporation has expanded its lineup of ultra-thin PiezoListen speakers with new types featuring a wider dynamic range and higher sound pressure level (SPL) in the low frequency range, even at voltages up to 24 VP-P. The PiezoListen series of piezo speakers now includes the PHUA6630 wide dynamic range speaker with an operating frequency range of 400 Hz to 20 kHz. Also new in the series are two new sound positioning speakers with an operating frequency range of 1000 Hz to 20 kHz.

TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

October 4, 2019 by Cristina Costa

TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

Following its acquisition of Chirp Microsystems in February 2018, TDK Corporation now announced the immediate availability of the latest Chirp SmartSonic platform family of ultrasonic sensor time-of-flight (ToF) solutions. The SmartSonic platform is currently available with the Chirp CH-101, an ultra-low power ultrasonic ToF range sensor that provides millimeter-accurate range measurements up to 1.2m, independent of target color and transparency.

TDK Announces New EMC Components with High-Current Noise Suppression Filters for Audio Lines

September 6, 2018 by audioXpress Staff

TDK Announces New EMC Components with High-Current Noise Suppression Filters for Audio Lines

TDK announced an expansion to its range of noise suppression filters for audio lines. The MAF1005G series now features low DC resistance and high rated current of up to 1.25 A, offering noise suppression at cellular frequencies from 600 MHz to 2.7 GHz. Due to their high rated current and compact dimensions, the components are ideally suited for the audio lines of external smartphone speakers and other compact communication devices such as headphones and microphones.

TDK Acquires Ultrasonic MEMS Sensing Solutions Developer Chirp Microsystems

February 28, 2018 by audioXpress Staff

TDK Acquires Ultrasonic MEMS Sensing Solutions Developer Chirp Microsystems

TDK Corporation announced that it has reached an agreement with Chirp Microsystems, a pioneer in high-performance ultrasonic sensing, headquartered in Berkeley, California. With the acquisition, Chirp becomes a wholly owned subsidiary of TDK, enhancing its existing technology in fingerprint sensors, MEMS sensors, and Piezoelectric transducer product lines. “TDK aims to be the leader in the ultrasonic MEMS sensors and solutions market,” says Shigenao Ishiguro, TDK’s President and CEO.

TDK InvenSense MEMS Microphones Available with Synaptics AudioSmart Solution

November 1, 2017 by audioXpress Staff

TDK InvenSense MEMS Microphones Available with Synaptics AudioSmart Solution

TDK Corporation showcased a Synaptics AudioSmart solution for voice recognition, using InvenSense high performance MEMS microphones. The ICS-40212 and ICS-40720 analog output and the ICS-41350 PDM digital output MEMS microphones are approved for use with Synaptics AudioSmart Amazon Voice Services (AVS) solution. TDK also announced the worldwide availability of its SmartMotion Platform encompassing 4 unique development kits with multiple sensors.

TDK Introduces Electric Double-Layer Capacitor so thin it fits in a Smart Card

November 27, 2015 by audioXpress Staff

TDK Introduces Electric Double-Layer Capacitor so thin it fits in a Smart Card

TDK Corporation announced the release of an ultra-thin, high-energy capacitor suitable for powering devices such as electronic paper displays, advanced biometric authentication or, simple displays in wireless headphones. The 5 mF electric double-layer capacitor has a maximum thickness of just 0.45 mm and, when fully charged, provides around 50 mJ of energy to power a load.

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