All items tagged with TDK (25)

TDK Launches Inductors for Small Power Systems in True Wireless Stereo Devices

March 29, 2021 by audioXpress Staff

TDK Launches Inductors for Small Power Systems in True Wireless Stereo Devices

TDK Corporation has developed the PLEA67 Series of inductors for use in true wireless stereo (TWS) devices. TDK’s original structure design and newly developed materials in the new thin-film power inductors achieve a rated current of 500mA in a small-sized component with an inductance of 2.2μH. The unique magnetic shield structure reduces magnetic flux leakage, while the low-loss magnetic material provides a highly efficient power supply circuit, ideal for small power supply and low power consumption Bluetooth LE modules.

MEMS and Other Leading-Edge Devices for Wearables - 2021 Update

March 23, 2021 by Mike Klasco

MEMS and Other Leading-Edge Devices for Wearables - 2021 Update

In this article for Voice Coil, Mike Klasco (Menlo Scientific) recaps MEMS Drivers and related hot technologies for 2021, providing an update about products and companies that stood out in 2020. The article, which summarizes the more extensive reports published by audioXpress in January 2020 and 2021, looks at the impact of microelectromechanical systems (MEMS) for audio and discusses the implications for other game-changing technologies that reduce size, increase performance, extend battery life, and enhance features and functionality in headphones, wearables and compact speakers.

CEVA Extends Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software

September 22, 2020 by audioXpress Staff

CEVA Extends Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software

In the wake of the acquisition of the Hillcrest Laboratories (Hillcrest Labs) business from InterDigital in mid-2019, CEVA now introduced the Hillcrest Labs MotionEngine Hear, a sensor and processor agnostic embedded software solution for hearable devices. The new solution allows SoC vendors, OEMs and ODMs to take advantage of a configurable sensor fusion platform to add intuitive user interface, gesture control, activity tracking and spatial audio capabilities to hearable devices.

TDK Unveils New Ultra-High AOP Analog MEMS Microphone Ideal for Noisy Environments

August 6, 2020 by audioXpress Staff

TDK Unveils New Ultra-High AOP Analog MEMS Microphone Ideal for Noisy Environments

TDK Corporation introduced the InvenSense ICS-40638 MEMS analog microphone, a new high-performance solution enabling clear audio capture in loud and noisy conditions, with an extended frequency response from 35 Hz to 20kHz. The ICS-40638 microphone offers an ultra-high Acoustic Overload Point (AOP) of 138 dB Sound Pressure Level (SPL), exceptionally efficient 170 µA low power operation and high Signal to Noise Ratio (SNR) of 63 dB in a small 3.5 mm x 2.65 mm x 0.98 mm bottom port surface‐mount package.

TDK Announces T3902 Lowest-Power PDM MEMS Microphone

June 29, 2020 by audioXpress Staff

TDK Announces T3902 Lowest-Power PDM MEMS Microphone

TDK Corporation introduced the InvenSense T3902, which the company touts as the world’s lowest power Pulse Density Modulation (PDM) microphone for consumer devices. The new T3902 offers a high SNR of 64.5 dB, and high Acoustic Overload Point (AOP) of 120 dB in a very small package, optimized for mobile devices, wearables, headsets, TV remotes and more, supporting far-field communications, enabling clear audio capture in loud conditions, and ideal for voice recognition.

The Impact of MEMS Speakers in Audio

February 4, 2020 by Mike Klasco

The Impact of MEMS Speakers in Audio

In this article for Voice Coil focused on MEMS loudspeakers, Mike Klasco reviews a bit of the history of the technology and previews the evolution and impact on the audio industry in general. The article examines MEMS devices in general, provides a basic explanation of how the various types of MEMS speakers work, and what commercialization challenges are ahead. This article was originally published in Voice Coil, December 2019.

iFi Announces New Hip-DAC Portable USB DAC/Headphone Amp

February 4, 2020 by audioXpress Staff

iFi Announces New Hip-DAC Portable USB DAC/Headphone Amp

iFi announced a new model to its already extensive range of portable DAC/headphone amps with an all-new design – the Hip-DAC. Looking conveniently like a pocket flask, the new portable device features an extruded aluminum enclosure with a distinct petrol blue finish and a touch of copper, offering an extensive set of specifications to support high resolution audio (HRA) sources, while keeping an affordable price tag at just $149 USD or €159 Euros.

TDK Introduces New Varistors with ESD and EMI Combined Protection for Audio Equipment

January 31, 2020 by audioXpress Staff

TDK Introduces New Varistors with ESD and EMI Combined Protection for Audio Equipment

TDK Corporation has expanded its lineup of chip varistors with the new AVRF101U6R8KT242 for audio equipment, which offers both ESD and EMI protection. This new product is intended for audio equipment that uses wireless communications in the 2.4 GHz band. Thanks to optimization of its capacitance of 6.8 pF, the multilayer component features high attenuation at this frequency and is able to effectively suppress the generated TDMA noise and thus improve receiver sensitivity.

TDK Announces First MIPI Standard SoundWire MEMS Microphone

January 21, 2020 by audioXpress Staff

TDK Announces First MIPI Standard SoundWire MEMS Microphone

Among the many interesting demonstrations of new audio solutions for developers presented by TDK at CES 2020, the T5808 MIPI standard SoundWire microphone stands out as a "world's first," using the MIPI Alliance SoundWire compliant digital interface which allows bi-directional data flow. The T5808 is a multi-mode, low noise digital MEMS microphone in a small package, consisting of a MEMS microphone element and an impedance converter amplifier followed by a fourth-order Σ-Δ modulator.

TDK Expands PiezoListen Lineup of Ultra-Thin Piezo Speakers with a Wider Dynamic Range

October 29, 2019 by audioXpress Staff

TDK Expands PiezoListen Lineup of Ultra-Thin Piezo Speakers with a Wider Dynamic Range

TDK Corporation has expanded its lineup of ultra-thin PiezoListen speakers with new types featuring a wider dynamic range and higher sound pressure level (SPL) in the low frequency range, even at voltages up to 24 VP-P. The PiezoListen series of piezo speakers now includes the PHUA6630 wide dynamic range speaker with an operating frequency range of 400 Hz to 20 kHz. Also new in the series are two new sound positioning speakers with an operating frequency range of 1000 Hz to 20 kHz.

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