All items tagged with SDK (66)

Google Releases Do-It-Yourself Voice Recognition AIY Project

July 5, 2017 by audioXpress Staff

Google Releases Do-It-Yourself Voice Recognition AIY Project

With many audio manufacturers and consumer electronic companies experimenting development with voice recognition applications, Google naturally wants to make it easy as possible for anyone to get familiarized with the company's Google Assistant SDK, to implement voice interaction. Billy Rutledge, Director of AIY Projects at Google, recently revealed a new voice recognition DIY kit and voice HAT for the Raspberry Pi.

JBL Announces new Wireless Everest 2.0 Headphones and new Everest Elite 750NC Flasghip Model

June 16, 2017 by audioXpress Staff

JBL Announces new Wireless Everest 2.0 Headphones and new Everest Elite 750NC Flasghip Model

Harman International, now a wholly-owned subsidiary of Samsung Electronics, announced the second generation JBL Everest series, a line of four wireless, state-of-the-art in-ear, on-ear and around-ear Bluetooth headphones. According to Harman, the new line features a freshly updated comfort-driven smart design, with the flagship model Elite 750NC combining Adaptive Noise-Cancelling and the freedom of wireless connectivity in a supposedly programable platform.

Microchip Introduces Fully-Certified Wi-Fi SDK with Apple HomeKit Support

May 23, 2017 by audioXpress Staff

Microchip Introduces Fully-Certified Wi-Fi SDK with Apple HomeKit Support

Microchip's new Wi-Fi SDK with Apple HomeKit support enables MFi licensees to create fast, low-power designs on the industry’s first hardware cryptography-enabled Wi-Fi-based development kit for HomeKit. The SDK leverages hardware-based calculations to create fast, low-power solutions, providing an optimized customer experience that dramatically reduces execution time for HomeKit commands and provides pairing speeds of less than one tenth of a second.

Texas Instruments Announces New SimpleLink MCU Platform with Security-Enhanced Wi-Fi Solutions

March 17, 2017 by Cristina Costa

Texas Instruments Announces New SimpleLink MCU Platform with Security-Enhanced Wi-Fi Solutions

Texas Instruments (TI) has announced availability of its new SimpleLink microcontroller (MCU) platform, combining hardware, software and tools under a single development environment. Sharing drivers, frameworks and libraries, SimpleLink MCU platform's new software development kits (SDKs) support development with TI's complete portfolio of 32-bit wired and wireless ARM-based MCUs, which now also include security-enhanced Wi-Fi chips and modules.

Propellerhead Releases Free Reason 9.2 Update with New Plug-In SDK

January 25, 2017 by audioXpress Staff

Propellerhead Releases Free Reason 9.2 Update with New Plug-In SDK

Propellerhead Software released Reason 9.2, the newest update to the award-winning Reason music production software. Reason 9.2 is a free update for Reason 9 owners that supports further development for the Rack Extension plug-in platform, and introduces Software Development Kit (SDK) 2.5 to developers. The new comprehensive SDK, provided by Propellerhead, allows third-party developers to create instrument and effect units to be used inside Reason.

Silicon Labs Introduces New Bluetooth Solution and SDK for Apple HomeKit Development

November 30, 2016 by Cristina Costa

Silicon Labs Introduces New Bluetooth Solution and SDK for Apple HomeKit Development

Silicon Labs has introduced a Bluetooth software solution that enables developers to efficiently create Apple HomeKit-enabled accessories. Silicon Labs’ Bluetooth solution with HomeKit support is pre-tested by Apple. Available as a library with clean, easy-to-use APIs, the Bluetooth 4.2-compliant software is pre-tested and certified by Apple to provide accessory developers with a low-risk solution that accelerates time-to-market.

Dialog Semiconductor Simplifies Smart Home Device Creation with New Apple HomeKit Bluetooth Development Kit

November 25, 2016 by audioXpress Staff

Dialog Semiconductor Simplifies Smart Home Device Creation with New Apple HomeKit Bluetooth Development Kit

Dialog Semiconductor announced the availability of its latest Apple HomeKit development kit, to reduce the time-to-market and increase functionality of smart home and other Internet of Things (IoT) devices. Dialog’s second-generation kit supports all current HomeKit Accessory Profiles within Apple’s updated IoT platform. The kit itself is built on Dialog’s SmartBond DA14681 System-on-Chip (SoC), the most integrated single chip solution that is purpose-built for IoT development, providing connectivity to a variety of battery-powered devices.

Cypress Streamlines Connected Designs with New Turnkey Development Platform

November 10, 2016 by Cristina Costa

Cypress Streamlines Connected Designs with New Turnkey Development Platform

Cypress Semiconductor announced a new version of its development platform for the Internet of Things (IoT) and consumer electronics that enables wireless connectivity in minutes. The Wireless Internet Connectivity for Embedded Devices (WICED) Studio 4 platform provides a single development environment for multiple wireless technologies, including Cypress's Wi-Fi, Bluetooth and combo solutions, with an easy-to-use application programming interface.

3D Sound Labs Launches Spatial Audio SDK High-Order-Ambisonics Solution for Mobile 360° VR Player

October 28, 2016 by audioXpress Staff

3D Sound Labs Launches Spatial Audio SDK High-Order-Ambisonics Solution for Mobile 360° VR Player

3D/VR audio specialists, 3D Sound Labs, announced the availability of the latest version of its VR Audio Kit, an Ambisonics SDK optimized for 360° mobile players. This technology has been jointly presented in September at IBC 2016 in Amsterdam together with solution provider for content delivery Viaccess Orca. The demo of a 360° VR mobile video player with High-Order Ambisonics (HOA) audio, running on a smartphone, was playing a 4K 360° video along with a compressed 3rd order Ambisonics audio stream.

New 3D Sound One Module Provides Immersive Audio for Headphones

June 3, 2016 by audioXpress Staff

New 3D Sound One Module Provides Immersive Audio for Headphones

French company 3D Sound Labs announced that its 3D smart audio technology is now available for all headphones thanks to the new 3D Sound One Module. 3D Sound Labs is a pioneer startup in 3D sound and its new 3D Sound One Module is the first accessory that can be simply fixed to any headphone to allow immersive 3D audio experiences. The connected module connects via Bluetooth to a smartphone running the iOPS 3D Sound Labs app or a PC with the Windows 3D Sound Labs driver.

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