All items tagged with SDK (67)

Nordic Semiconductor nRF5340 for Bluetooth 5.2 and LE Audio Applications Now Available

December 4, 2020 by audioXpress Staff

Nordic Semiconductor nRF5340 for Bluetooth 5.2 and LE Audio Applications Now Available

Nordic Semiconductor has announced that its nRF5340 high-end multiprotocol Bluetooth 5.2 System-on-Chip (SoC) has entered volume production. The world’s first dual Arm Cortex-M33 wireless SoC is now available and offers all the advanced features and security required for the next-generation of connected audio applications including LE Audio and advanced wearables. The new SoC is now widely commercially available through Nordic’s distribution network.

DSP Group Announces Support of TensorFlow Lite for Microcontrollers on its DBMD7 AI/ML SoC

October 22, 2020 by audioXpress Staff

DSP Group Announces Support of TensorFlow Lite for Microcontrollers on its DBMD7 AI/ML SoC

DSP Group announced TensorFlow Lite for Microcontrollers SDK support for its DBMD7 family of low-cost, high-performance, multicore AI and DSP processors. The SDK for the DBMD7 allows developers of AI and high-performance machine learning applications on edge devices to avoid latencies and ensure end-user privacy devices to cost-effectively deploy high-performance machine learning (ML) inference at the edge to avoid network latencies, minimize power consumption, ensure end-user privacy, and free up scarce network bandwidth.

XMOS Announces All-New Software Development Kit for Artificial Intelligence Development

October 7, 2020 by audioXpress Staff

XMOS Announces All-New Software Development Kit for Artificial Intelligence Development

XMOS announced its all-new software development kit (SDK) for the artificial intelligence of things (AIoT). Designed to harness xcore.ai, the company's latest crossover processor, combining high performance AI, DSP, I/O and control in a single economical device, the new AIoT SDK makes it easier for engineers to develop connected products that can sense, think, decide and act. The XMOS SDK incorporates TensorFlowLite for Microcontroller development tools.

Steinberg Releases New VST 3.7 Software Development Kit

August 7, 2020 by audioXpress Staff

Steinberg Releases New VST 3.7 Software Development Kit

Steinberg released the company's newest iteration of the Virtual Studio Technology (VST) Software Developer Kit (SDK), offering new capabilities to developers of host applications, audio plug-ins and virtual instruments. VST 3.7 introduces several enhancements of the SDK interface that allow new levels of integrations between VST 3 hosts and plug-ins, including the new VST 3 Project Generator, improved documentation as well as support for MIDI 2.0 and the development of plug-ins compatible with the new ARM-based Apple Silicon chips.

Pico Technology Extends Range of PC-Based Mixed Signal Oscilloscopes

May 28, 2020 by audioXpress Staff

Pico Technology Extends Range of PC-Based Mixed Signal Oscilloscopes

Pico Technology announced the further development of its PicoScope 6000E Series oscilloscopes with the launch of three new 4-channel models, each of which can be configured with 16 optional digital channels. With bandwidths of 300 or 500 MHz, 8-bit or 8/10/12-bit Flexible Resolution and up to 4 GS deep capture memory, these products enhance the existing PicoScope 6000E portfolio, adding to the 8-channel models that were introduced earlier in the year.

Microchip Reveals Software Development Kit and Neural Network IP for Easily Creating Low-Power FPGA Smart Embedded Solutions

May 18, 2020 by audioXpress Staff

Microchip Reveals Software Development Kit and Neural Network IP for Easily Creating Low-Power FPGA Smart Embedded Solutions

Microchip Technology is determined to meet the growing need for power-efficient inferencing in edge applications by making it easier for software developers to implement their algorithms in PolarFire field-programmable gate arrays (FPGAs). As a significant addition to its solutions portfolio in this segment, Microchip’s VectorBlox Accelerator Software Development Kit (SDK) helps developers take advantage of Microchip’s PolarFire FPGAs for creating low-power, flexible overlay-based neural network applications without learning an FPGA tool flow.

Dolby Laboratories Introduces Dolby.io Platform for Developers

May 14, 2020 by audioXpress Staff

Dolby Laboratories Introduces Dolby.io Platform for Developers

Dolby Laboratories announced Dolby.io, an API platform that gives developers access to APIs designed to improve the quality of the media and communications within their applications. According to Dolby, the platform offers tools to enhance every interaction and quality of content in new apps and services. The interactivity APIs focus on real-time voice and video collaboration, and the Media Processing APIs focus on audio/video content enhancement and analysis.

Libre Wireless Technologies Single Chip MAVID Solution is Now Amazon AWS IoT Core Certified

April 28, 2020 by audioXpress Staff

Libre Wireless Technologies Single Chip MAVID Solution is Now Amazon AWS IoT Core Certified

Libre Wireless Technologies, the embedded wireless audio and voice/AI development platform company, announced that its MAVID low power mic-to-cloud edge computing solution expanded its unique RTOS platform to include new SDK releases. The company's flexible SDK for connected devices now features Amazon AWS IoT Core certification and leverages the responsive Free RTOS OS, combined in a scalable feature rich platform. The new development environment offers unique connectivity and libraries for manufacturers and ODMs developing on Libre Wireless's MAVID platform.

Synopsys Announces Bluetooth LE Audio LC3 Codec for ARC Processor

January 10, 2020 by audioXpress Staff

Synopsys Announces Bluetooth LE Audio LC3 Codec for ARC Processor

Synopsys collaborated with Fraunhofer IIS to release an implementation of the LC3 codec, part of the next-generation Bluetooth LE Audio specification. The new LC3 codec is optimized to deliver high-quality audio and voice playback in battery-powered devices incorporating ARC EM and HS DSP processors, and expands Synopsys' DesignWare Bluetooth Low Energy IP offerings and the portfolio of DesignWare ARC audio codecs and post-processing software.

R&D Stories: Achieving Frictionless Lower-Power Application Connectivity with Data-Over-Sound

December 5, 2019 by Adib Mehrabi

R&D Stories: Achieving Frictionless Lower-Power Application Connectivity with Data-Over-Sound

Anytime we need to login to the local Wi-Fi or pair with another Bluetooth device, we think, "There must be a better way to do this!" That's precisely one of the exciting possibilities for data-over-sound technology. This article explains what else we can do with it, and how it works. It also explores how data-over-sound can be realized in embedded scenarios, and how Chirp’s new technology, using the Arm Cortex-M4 and Cortex-M7 processors, can be implemented in connected products. This article was originally published in audioXpress, November 2019.

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