TDK Acquires Ultrasonic MEMS Sensing Solutions Developer Chirp Microsystems

TDK Corporation announced that it has reached an agreement with Chirp Microsystems, a pioneer in high-performance ultrasonic sensing, headquartered in Berkeley, California. With the acquisition, Chirp becomes a wholly owned subsidiary of TDK, enhancing its existing technology in fingerprint sensors, MEMS sensors, and Piezoelectric transducer product lines. “TDK aims to be the leader in the ultrasonic MEMS sensors and solutions market,” says Shigenao Ishiguro, TDK’s President and CEO.

TDK Corporation showcased a Synaptics AudioSmart solution for voice recognition, using InvenSense high performance MEMS microphones. The ICS-40212 and ICS-40720 analog output and the ICS-41350 PDM digital output MEMS microphones are approved for use with Synaptics AudioSmart Amazon Voice Services (AVS) solution. TDK also announced the worldwide availability of its SmartMotion Platform encompassing 4 unique development kits with multiple sensors.

InvenSense, a leading provider of micro electrical mechanical systems (MEMS) sensor platforms, and Sonion, manufacturer of micro acoustic and micro mechanical solutions for hearing instruments, in-ear earphones and specialty headsets, announced the release of the O-series MEMS microphone in 2 very small form factors: O8 (8mm³) and O11 (11mm³). The O-series products offer hearing aid manufacturers greater flexibility in hearing aid design.

This VC Spotlight article, from Mike Klasco includes some really great insight on upcoming developments and new companies active in the MEMS field. Microelectromechanical systems (MEMS) loudspeakers are just now appearing. As Mike explains “this is a really new technology, so new that only recently were functional lab prototypes operational.” Article originally published in Voice Coil, May 2015.