All items tagged with Invensense (21)

TDK Introduces Lowest Pulse Density Modulation Multi-Mode MEMS Microphone With Acoustic Activity Detect

January 13, 2021 by audioXpress Staff

TDK Introduces Lowest Pulse Density Modulation Multi-Mode MEMS Microphone With Acoustic Activity Detect

InvenSense, a TDK Group company, announced a comprehensive portfolio of new technology solutions during the 2021 Consumer Electronics Showcase. Among the expanded MEMS portfolio, the new T5838 SmartSound MEMS microphone offers a low power mode of just 130uAmps and a high-quality mode of 330uAmps, while supporting a dynamic range of 68dN SNR and 133dB AOP at 20kHz bandwidth. Optimized for smartphones, microphone arrays, smart speakers, and headsets, the T5838 supports configurable wake-on-sound at power levels as low as 20 µA.

CEVA Extends Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software

September 22, 2020 by audioXpress Staff

CEVA Extends Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software

In the wake of the acquisition of the Hillcrest Laboratories (Hillcrest Labs) business from InterDigital in mid-2019, CEVA now introduced the Hillcrest Labs MotionEngine Hear, a sensor and processor agnostic embedded software solution for hearable devices. The new solution allows SoC vendors, OEMs and ODMs to take advantage of a configurable sensor fusion platform to add intuitive user interface, gesture control, activity tracking and spatial audio capabilities to hearable devices.

TDK Unveils New Ultra-High AOP Analog MEMS Microphone Ideal for Noisy Environments

August 6, 2020 by audioXpress Staff

TDK Unveils New Ultra-High AOP Analog MEMS Microphone Ideal for Noisy Environments

TDK Corporation introduced the InvenSense ICS-40638 MEMS analog microphone, a new high-performance solution enabling clear audio capture in loud and noisy conditions, with an extended frequency response from 35 Hz to 20kHz. The ICS-40638 microphone offers an ultra-high Acoustic Overload Point (AOP) of 138 dB Sound Pressure Level (SPL), exceptionally efficient 170 µA low power operation and high Signal to Noise Ratio (SNR) of 63 dB in a small 3.5 mm x 2.65 mm x 0.98 mm bottom port surface‐mount package.

TDK Announces T3902 Lowest-Power PDM MEMS Microphone

June 29, 2020 by audioXpress Staff

TDK Announces T3902 Lowest-Power PDM MEMS Microphone

TDK Corporation introduced the InvenSense T3902, which the company touts as the world’s lowest power Pulse Density Modulation (PDM) microphone for consumer devices. The new T3902 offers a high SNR of 64.5 dB, and high Acoustic Overload Point (AOP) of 120 dB in a very small package, optimized for mobile devices, wearables, headsets, TV remotes and more, supporting far-field communications, enabling clear audio capture in loud conditions, and ideal for voice recognition.

TDK Announces First MIPI Standard SoundWire MEMS Microphone

January 21, 2020 by audioXpress Staff

TDK Announces First MIPI Standard SoundWire MEMS Microphone

Among the many interesting demonstrations of new audio solutions for developers presented by TDK at CES 2020, the T5808 MIPI standard SoundWire microphone stands out as a "world's first," using the MIPI Alliance SoundWire compliant digital interface which allows bi-directional data flow. The T5808 is a multi-mode, low noise digital MEMS microphone in a small package, consisting of a MEMS microphone element and an impedance converter amplifier followed by a fourth-order Σ-Δ modulator.

TDK Announces InvenSense CTO as Inductee to MSIG Hall of Fame

October 25, 2019 by audioXpress Staff

TDK Announces InvenSense CTO as Inductee to MSIG Hall of Fame

Dr. Peter G. Hartwell, Chief Technology Officer at InvenSense, a TDK group company, has been named a 2019 inductee into the SEMI-MEMS & Sensors Industry Group (MSIG) Hall of Fame for his outstanding contributions to MSIG and well-known industry activity.. The recognition honors those who inspire a sense of mission, purpose and dedication that drives the MEMS and sensors industry forward.

TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

October 4, 2019 by Cristina Costa

TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

Following its acquisition of Chirp Microsystems in February 2018, TDK Corporation now announced the immediate availability of the latest Chirp SmartSonic platform family of ultrasonic sensor time-of-flight (ToF) solutions. The SmartSonic platform is currently available with the Chirp CH-101, an ultra-low power ultrasonic ToF range sensor that provides millimeter-accurate range measurements up to 1.2m, independent of target color and transparency.

TDK Acquires Ultrasonic MEMS Sensing Solutions Developer Chirp Microsystems

February 28, 2018 by audioXpress Staff

TDK Acquires Ultrasonic MEMS Sensing Solutions Developer Chirp Microsystems

TDK Corporation announced that it has reached an agreement with Chirp Microsystems, a pioneer in high-performance ultrasonic sensing, headquartered in Berkeley, California. With the acquisition, Chirp becomes a wholly owned subsidiary of TDK, enhancing its existing technology in fingerprint sensors, MEMS sensors, and Piezoelectric transducer product lines. “TDK aims to be the leader in the ultrasonic MEMS sensors and solutions market,” says Shigenao Ishiguro, TDK’s President and CEO.

TDK InvenSense MEMS Microphones Available with Synaptics AudioSmart Solution

November 1, 2017 by audioXpress Staff

TDK InvenSense MEMS Microphones Available with Synaptics AudioSmart Solution

TDK Corporation showcased a Synaptics AudioSmart solution for voice recognition, using InvenSense high performance MEMS microphones. The ICS-40212 and ICS-40720 analog output and the ICS-41350 PDM digital output MEMS microphones are approved for use with Synaptics AudioSmart Amazon Voice Services (AVS) solution. TDK also announced the worldwide availability of its SmartMotion Platform encompassing 4 unique development kits with multiple sensors.

InvenSense And Sonion Announce Ultra Low-Noise, Low-Power, Miniature O-Series MEMS Microphones for Hearing Aid Applications

December 9, 2016 by audioXpress Staff

InvenSense And Sonion Announce Ultra Low-Noise, Low-Power, Miniature O-Series MEMS Microphones for Hearing Aid Applications

InvenSense, a leading provider of micro electrical mechanical systems (MEMS) sensor platforms, and Sonion, manufacturer of micro acoustic and micro mechanical solutions for hearing instruments, in-ear earphones and specialty headsets, announced the release of the O-series MEMS microphone in 2 very small form factors: O8 (8mm³) and O11 (11mm³). The O-series products offer hearing aid manufacturers greater flexibility in hearing aid design.

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