Searched for: IoT
New Series of STM32 Microcontrollers from STMicroelectronics for Even Smaller, More Capable, and Power-Efficient Devices
by Cristina Costa

New Series of STM32 Microcontrollers from STMicroelectronics for Even Smaller, More Capable, and Power-Efficient Devices

STMicroelectronics announced its new series of STM32G0 microcontrollers (MCUs) targeted at powering the simplest of connected devices, offering lower power consumption and large memory density in low-pin-count packages, with enhancements to peripherals, plus support for USB Type-C and Power Delivery. The robust new Arm Cortex-M0+ series also features a simplified power connection, superior EMS protection, and class-leading hardware-based security.
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Vesper Launches VM1001 Piezoelectric MEMS Microphone Specific for Array Applications and Outdoor Environments
by audioXpress Staff

Vesper Launches VM1001 Piezoelectric MEMS Microphone Specific for Array Applications and Outdoor Environments

Vesper introduced the VM1001, the latest piezoelectric MEMS microphone in its product line, designed to ensure accurate voice assistant performance with extreme environmental robustness. The VM1001 is the first microphone in Vesper's portfolio specifically built for array applications and is ideal for voice user interface, beamforming arrays, outdoor devices, industrial sensors, smart home devices and other applications where low noise, high stability and durability are desired.
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Western Digital Announces Plans to Open Source New RISC-V SweRV Core to Accelerate RISC-V Processor Development
by Cristina Costa

Western Digital Announces Plans to Open Source New RISC-V SweRV Core to Accelerate RISC-V Processor Development

During the RISC-V Summit, in Santa Clara, CA, Western Digital announced three new open-source innovations designed to support Western Digital’s internal RISC-V development efforts and those of the growing RISC-V ecosystem. In his keynote address, Western Digital’s Chief Technology Officer Martin Fink unveiled plans to release a new open source RISC-V core, an open standard initiative for cache coherent memory over a network and an open source RISC-V instruction set simulator.
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New RISC-V SoC FPGA Architecture Supports Real-Time Linux Development
by audioXpress Staff

New RISC-V SoC FPGA Architecture Supports Real-Time Linux Development

Microchip Technology, via its Microsemi Corporation subsidiary, extended its Mi-V ecosystem by unveiling the architecture for a new class of SoC FPGAs that combine the industry's lowest power mid-range PolarFire FPGA family with a complete microprocessor subsystem based on the open, royalty-free RISC-V instruction set architecture (ISA). Demonstrations took place during RISC-V Summit (Dec. 4-5) to show size, power and performance benefits of integrating PolarFire SoC's Hard CPU Subsystem with Programmable Logic.
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Expanded Program and Registration Options for AES@NAMM Pro Sound Symposium: Live & Studio 2019 Revealed
by Audio Engineering_Society

Expanded Program and Registration Options for AES@NAMM Pro Sound Symposium: Live & Studio 2019 Revealed

AES@NAMM once again brings high-end, professional education for live sound, recording and audio for the performing arts to Anaheim. The Audio Engineering Society has opened registration for AES@NAMM Pro Sound Symposium: Live & Studio 2019. The AES returns to Anaheim, CA, for its four-day international symposium, January 24 – 27, in conjunction with The 2019 NAMM Show at the NAMM U Education Center on the 4th floor of the Anaheim Hilton.
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Tectonic Audio Labs and Tectonic Elements Combine Assets to Accelerate Release of Next-Generation Audio Products
by audioXpress Staff

Tectonic Audio Labs and Tectonic Elements Combine Assets to Accelerate Release of Next-Generation Audio Products

Tectonic Audio Labs announced the consolidation of their assets with Tectonic Elements and launched a new website to highlight the company's consolidated portfolio of patented flat speaker technologies. Following the recent appointment of a new President and CEO, this is the final step in the merger of the two companies and will streamline the three primary areas of focus: smart speaker technology, professional audio products, and OEM audio component sales for IoT devices, automotive and other high-fidelity solutions.
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Tempow and CEVA Partner to Deliver Low Power, Low Latency True Wireless Stereo Technology for Bluetooth Earbuds
by audioXpress Staff

Tempow and CEVA Partner to Deliver Low Power, Low Latency True Wireless Stereo Technology for Bluetooth Earbuds

CEVA, the leading licensor of signal processing platforms for connected devices, along with French wireless audio pioneer Tempow, unveiled a collaboration to bring next-generation True Wireless Stereo (TWS) to the Bluetooth earbud mass market. As mentioned in a recent article by CEVA's Marketing Director, Franz Dugand, the resulting joint IP solution delivers synchronized left/right audio over standard Bluetooth dual mode connected links with short latency and without the power consumption penalty associated with many of today’s TWS implementations.
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Sonova Announces SWORD 3.0 Wireless Chip for Hearing Aids with CEVA Bluetooth IP
by audioXpress Staff

Sonova Announces SWORD 3.0 Wireless Chip for Hearing Aids with CEVA Bluetooth IP

CEVA announced that Sonova Holding AG, a leading provider of hearing solutions, has licensed and deployed CEVA’s RivieraWaves Bluetooth IP in its latest SWORD 3.0 wireless chip for hearing aids and other smart hearing devices. The latest generation wireless chip leverages RivieraWaves’ Bluetooth dual mode IP and Sonova’s ultra-low power communication technology to enable true stereo audio streaming to hearing aids.
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Voting for the 34th Annual NAMM TEC Awards Is Now Open!
by audioXpress Staff

Voting for the 34th Annual NAMM TEC Awards Is Now Open!

During the Summer NAMM show in Nashville, pro audio professionals and leading industry brands gathered to recognize and celebrate the announcement of the 34th annual NAMM TEC Award nominees at a special pro audio reception held in the Music City Center. Voting is now open, and winners will be announced during the annual awards ceremony, to honor best in pro audio products at the 2019 NAMM Show, January 26, 2019, at the Anaheim Hilton Pacific Ballroom. Vote now!
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146th Audio Engineering Society AES Dublin 2019 Convention
by Audio Engineering_Society

146th Audio Engineering Society AES Dublin 2019 Convention

The Audio Engineering Society (AES) has announced the organizing committee and keynote address for the upcoming AES Dublin Convention, taking place March 20 – 23, 2019, at the Convention Centre in Dublin, Ireland. For its 146th International Convention, the association makes its first trip to Dublin, Ireland, set to “Excite Your Ears” as the preeminent European pro audio event of the year. Details for the Technical Program of the convention are now available online at the convention site.
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