Rayson Technology Launches Nordic-Powered Bluetooth LE Audio Module for Headphones, Speakers, and Audio Systems

Wireless communications company Rayson Technology has released a multiprotocol module based on Nordic Semiconductor’s nRF5340 System-on-Chip (SoC). The solution is designed for advanced Bluetooth LE Audio applications in consumer electronics as well as smart home. Measuring just 16.5 by 13.0 by 2.5mm, the BTM-N340X module supports LE Audio and its Low Complexity Communication Codec (LC3) for lower power wireless audio streaming applications. 
  The Rayson BTM-N340X module and development board were designed to fully explore the possibilities of Nordic Semi's nRF5340 SoC for LE Audio and wireless audio applications. The module employs the nRF5340 SoC's dual Arm Cortex-M33 processors, providing a high performance application processor capable of DSP and Floating Point (FP) alongside a fully programmable, ultra low power network processor. The application core manages the LC3 codec, while the Bluetooth LE protocol is supervised by the network processor.  

"In addition to the technical capabilities of the nRF5340 chip, the high level of support from Nordic was a key factor when making our selection," explains Bob Wu, CTO at Rayson Technology. "The BTM-N340X module has been designed for a wide range of applications, aiming in particular to provide enhanced audio experiences via Bluetooth LE Audio. It enables one device to stream audio to multiple pairs of wireless headphones, and can facilitate audio broadcasts through public address systems, such as in airports and museums. This module is also compatible with smart speakers and home audio systems," he details.

The module's ultra-low power consumption is made possible due to the nRF5340's power-optimized multiprotocol radio, which offers a TX current of 3.4mA (0dBm TX power, 3V, DC/DC) and RX current of 2.7mA (3V, DC/DC). The sleep current is as low as 0.9µA. Additionally, because the cores can operate independently, developers have the flexibility to optimize performance for power consumption, throughput, and low latency response.  Depending on the product application, two flexible antenna options are available for the module: a pre-certified U.F.L Connector and a PCB pin out. The module is designed to operate within a temperature range of -40 to +85°C.

"The dual processors made the nRF5340 SoC an excellent choice for this module's LE Audio applications," adds Wu. "The large memory capacity, radio sensitivity, and low power consumption were also major factors".

Rayson Technology specializes in wired and wireless communications since its establishment in 1990 and offers a broad range of solutions for consumer or industrial applications. Rayson is headquartered in the Hsin Chu Science-Based Industrial Park of Taiwan where its facilities combine research & development, product engineering, manufacturing and logistics management. Rayson also established state-of-the-art manufacturing facilities in Shenzhen, China, and a logistics organization in Hong Kong. 
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