Nordic Semiconductor announced the launch of a Wafer-Level Chip Scale Package (WLCSP) version of its nRF7002 Wi-Fi 6 Companion IC. The new package option offers the same functionality as the nRF7002 QFN variant but with a footprint reduction of over 60 percent - making the WLCSP the ideal choice for efficient, size-constrained designs for next-generation wireless devices.
The Nordic nRF7002 WLCSP supports advanced Wi-Fi 6 capabilities including OFDMA and Target Wake Time (TWT), providing robust and efficient wireless connectivity. The IC is optimized for ultra low power operation, ensuring longer battery life for connected devices. Its smaller form factor provides developers with a Wi-Fi solution suitable for space-constrained applications such as smart home modules and wearables.
The nRF7002 Wi-Fi 6 companion IC seamlessly integrates with Nordic's nRF91 Series Systems in Package (SiPs), nRF52 and nRF53 Series multiprotocol Systems-on-Chip (SoCs), and the upcoming nRF54L and nRF54H Series SoCs. This integration ensures developers can access the full potential of Wi-Fi 6 — including higher data rates, increased capacity, and improved power efficiency — alongside Nordic's best-in-class LTE-M/NB-IoT and Bluetooth LE solutions, simplifying development and accelerating time-to-market. These Wi-Fi 6 solutions support all wireless protocols used in Matter, Bluetooth LE for commissioning, Thread for low power mesh, and Wi-Fi for high-throughput.
"We are excited to offer the nRF7002 in a WLCSP package. Adding the package to the nRF7002 family provides our customers with a versatile and compact solution that meets the growing demands for smaller, more power-efficient IoT devices," says Joakim Ferm, SVP Wi-Fi BU, Nordic Semiconductor. "This new option underscores our commitment to Wi-Fi and to delivering innovative connectivity solutions that enable our customers to push the boundaries of what’s possible in wireless design."
The WLCSP version of the nRF7002 (nRF7002 CEAA) is now in volume production and available from distributors. The nRF7002 DK is the development kit for the nRF7002, and nRF7001 Wi-Fi 6 Companion ICs, and contains everything needed to get started developing on a single board. The DK features an nRF5340 multiprotocol System-on-Chip (SoC) as a host processor for the nRF7002.
www.nordicsemi.com
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Nordic Semiconductor Introduces Smaller nRF7002 Wi-Fi 6 Companion IC for Compact Designs
August 14 2024, 00:45
Nordic Semiconductor announced the launch of a Wafer-Level Chip Scale Package (WLCSP) version of its nRF7002 Wi-Fi 6 Companion IC. The new package option offers the same functionality as the nRF7002 QFN variant but with a footprint reduction of over 60 percent - making the WLCSP the ideal choice for efficient, size-constrained designs for next-generation wireless devices.