Nordic Semiconductor Introduces Smaller nRF7002 Wi-Fi 6 Companion IC for Compact Designs

Nordic Semiconductor announced the launch of a Wafer-Level Chip Scale Package (WLCSP) version of its nRF7002 Wi-Fi 6 Companion IC. The new package option offers the same functionality as the nRF7002 QFN variant but with a footprint reduction of over 60 percent - making the WLCSP the ideal choice for efficient, size-constrained designs for next-generation wireless devices.

Ceva announced Ceva-Waves Links, a new family of multiprotocol wireless platform IPs that delivers fully integrated connectivity solutions with Wi-Fi, Bluetooth, UWB, Thread, Zigbee, and Matter, simplifying development and accelerating time to market for next generation, connectivity-rich, MCUs and SoCs. Ceva-Waves Links100, a connectivity platform IP with RF implemented on TSMC 22nm is currently being deployed by a leading OEM in connected devices.

Enabling smarter connections to the world around us, Texas Instruments (TI) introduced new Matter-enabled software development kits for Wi-Fi and Thread SimpleLink wireless microcontrollers (MCUs) that will streamline adoption of the Matter protocol in connected applications (also named sometimes as Internet of Things or IoT). The software builds on TI’s close involvement with the Connectivity Standards Alliance and innovation in the 2.4-GHz connectivity space.

Silicon Labs announced a slate of new multiprotocol connectivity products that are driven by interoperability, advancing innovations in the Internet of Things and Smart Home, including Matter and Wi-Fi 6. Standing out among the announcements is the new low power SiWx917 Wi-Fi 6 and Bluetooth LE combination SoC that Silicon Labs says is Matter-ready. The SoC includes an integrated applications processor, and is ideal for battery-powered or energy-efficient connected devices with always-on cloud connectivity.