The Audio Voice Newsletter Sign up « BackShare Android Bluetooth SoC OEM/ODM wireless earbuds true wireless TWS Tempow LE Audio chipsets Jieli Technology TempowOS dual-A2DP Show more (13) Show less by audioXpress Staff on Industry News News « BackShare related items CEVA, Beken and VisiSonics Announce Reference Design for 3D Spatial Audio in Headsets and TWS Earbuds Read more... Knowles Offers AI-Enabled True Wireless Development Kit with Advanced Features Read more... CEVA Receives Bluetooth SIG Qualification for RivieraWaves Bluetooth Dual Mode 5.2 Platform Read more... Qualcomm Unveils Snapdragon Sound End-To-End Audio System Read more...
