Daniel F. Bodine Joins Radian Audio Engineering as VP of Business Development

December 13 2023, 03:10
Radian Audio Engineering announced Daniel F. Bodine as the company's newly-appointed VP of Business Development. As Radian Audio Engineering continues to expand its research and development efforts, which have already resulted in a new-generation of groundbreaking products, many of which yet to be revealed, Bodine will expand significantly the company's abilities to interact and respond to the needs of its customers and the overall audio industry.
 

The appointment of an experienced Business Development Manager with a demonstrated history of success in the speaker industry is an important announcement for the Californian speaker manufacturer, leveraging his extensive 25-year executive experience to grow the company.

Bodine's previously role was as VP of Business Development at Resonado Labs where he supported the successful introduction of the novel Res-Core transducer architecture under challenging market conditions. His experience with the Chicago-based startup   was essential to lock essential sourcing partnerships with GGEC, Zylux Acoustic, and Soundlab, as well as expand its licensing efforts.

Previously, Bodine worked with some of the biggest audio OEMs and brands in the industry, successfully managing key accounts including Samsung, Sonos, Klipsch, Dolby Labs, Amazon Labs126, and Zylux, to name just a few.

"I am excited to start my new position at Radian Audio Engineering and I look forward to supporting current and new customers with innovative, incredible-sounding hifi, pro-audio, and cinema audio systems. Radian's significant R&D capabilities and vertical integration in America and in Asia makes it uniquely suited for the most challenging projects. I cannot wait to begin work with Radian's management and engineering team. Please contact me if you are looking for high-quality loudspeaker drivers or systems."
 

In 2023, Radian Audio Engineering launched a much improved new-generation Planar Ribbon series, including the largest driver in the family, the wide band LM10n (pictured), already followed by the next-generation LT2.2 HF Planar Ribbon Transducer and soon to be followed by the LT3.2 HF Compact Planar Ribbon model and updated waveguides.

"Dan’s deep understanding of the relationship between technology and system design and performance provides valuable insight on how customers interact with products, what developers, designers and product managers need, and how to best integrate these into solutions that help our end customers achieve their goals," comments Dwight Tobiano, CEO of Radian Audio Engineering.

Radian Audio Engineering, Inc. was founded in 1988 with initial offerings being replacement compression driver diaphragms. The diaphragms took off so well that it wasn’t long before the company was making compression drivers, coaxials and woofers for several major loudspeaker manufacturers, which became OEM customers. Under new management since 2016, today, Radian Audio is a major player in the OEM loudspeaker driver business, with modern facilities in Pomona, California serving its R&D and manufacturing operations. Those are complemented by the ability to scale production with affiliate manufacturing resources based in The Philippines.
www.radianaudio.com
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