All items tagged with sensors (116)

MIPI I3C v1.1 Update for I2C Implementers Simplifies Development for Wearables and Connected Devices

January 20, 2020 by audioXpress Staff

MIPI I3C v1.1 Update for I2C Implementers Simplifies Development for Wearables and Connected Devices

The MIPI Alliance, the international organization that develops interface specifications for mobile and mobile-influenced industries, announced MIPI I3C v1.1, the first update to the interface that eliminates the historical pain points of I2C development. MIPI I3C v1.1 is a scalable, medium-speed, utility and control bus that connects peripherals to an application processor, streamlining integration and improving cost efficiencies in development.

CEVA Debuts SenslinQ Platform to Streamline Development of Contextually Aware Connected Devices

January 7, 2020 by audioXpress Staff

CEVA Debuts SenslinQ Platform to Streamline Development of Contextually Aware Connected Devices

At CES 2020 CEVA unveiled SenslinQ, its first integrated hardware IP and software platform that aggregates sensor fusion, sound and connectivity technologies to enable contextually aware connected devices. The CEVA SenslinQ integrated hardware IP and software platform collects, processes and links data from multiple sensors to enable intelligent devices to understand their surroundings - a key development for augmented hearing using wireless headphones and earbuds.

PCB Completes Construction of $1 Million Clean Room Facility

January 6, 2020 by audioXpress Staff

PCB Completes Construction of $1 Million Clean Room Facility

As a leading global sensor supplier, PCB Piezotronics continues to invest in state-of-the-art pressure assembly operations. The company, a wholly owned subsidiary of MTS Systems Corporation, announced the completion of new environmentally controlled clean rooms totaling 4,300 sq. ft. at their Walden Avenue headquarters. Earlier this year, the sensor manufacturer began assembly of all pressure and force products in this new state-of-the-art facility.

TDK Announces InvenSense CTO as Inductee to MSIG Hall of Fame

October 25, 2019 by audioXpress Staff

TDK Announces InvenSense CTO as Inductee to MSIG Hall of Fame

Dr. Peter G. Hartwell, Chief Technology Officer at InvenSense, a TDK group company, has been named a 2019 inductee into the SEMI-MEMS & Sensors Industry Group (MSIG) Hall of Fame for his outstanding contributions to MSIG and well-known industry activity.. The recognition honors those who inspire a sense of mission, purpose and dedication that drives the MEMS and sensors industry forward.

How Motion Sensors Can Revolutionize Hearables

October 8, 2019 by Charles Pao

How Motion Sensors Can Revolutionize Hearables

The hearables market is exploding, growing at a CAGR of 37.6%. And, like nearly all wireless devices, hearables need low-latency motion sensors in order to not only perform their critical functions but also enable a variety of enhanced features that improve the user experience. This article takes a look at five key features that a sensor must have in order to deliver enhanced functionality such as activity tracking.

TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

October 4, 2019 by Cristina Costa

TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

Following its acquisition of Chirp Microsystems in February 2018, TDK Corporation now announced the immediate availability of the latest Chirp SmartSonic platform family of ultrasonic sensor time-of-flight (ToF) solutions. The SmartSonic platform is currently available with the Chirp CH-101, an ultra-low power ultrasonic ToF range sensor that provides millimeter-accurate range measurements up to 1.2m, independent of target color and transparency.

Senseg Introduces World’s First Flexible Actuators Manufactured with Roll-To-Roll Technology

September 17, 2019 by Cristina Costa

Senseg Introduces World’s First Flexible Actuators Manufactured with Roll-To-Roll Technology

Senseg, a leading manufacturer of electrostatic sensors based in Finland, announced that it has created a new category of flexible electronics by launching a family of roll-to-roll manufactured actuators for use in traditional flat actuator applications as well as for new applications, such as wearables, soft robotics, VR/AR devices, and interior integrated sensors. Called Senseg ELFIAC (for Elastomeric Film Actuator), the new product will deliver large-scale manufacturable actuators that are far less expensive to produce than comparable traditional actuators (such as piezos) and use cheaper, non-toxic materials.

Klippel Controlled Sound (KCS) - Controlled Sound Technology for Nonlinear Compensation of Loudspeakers

August 3, 2019 by Vance Dickason

Klippel Controlled Sound (KCS) - Controlled Sound Technology for Nonlinear Compensation of Loudspeakers

Following extensive research, Klippel GmbH has announced its new Klippel Controlled Sound (KCS) technology. This is an integrated approach that leverages the company's software and hardware tools for development, measurement and evaluation of new-generation loudspeaker systems, providing mechanical and thermal protection, automatic system alignment, active compensation of transducer nonlinearities and stabilization of the voice coil rest position. In other words, enabling research towards the speakers of the future.

CEVA Acquires Hillcrest Labs Intelligent Sensor Technologies Business from InterDigital

July 23, 2019 by audioXpress Staff

CEVA Acquires Hillcrest Labs Intelligent Sensor Technologies Business from InterDigital

CEVA announced the acquisition of the Hillcrest Laboratories, Inc. (Hillcrest Labs) business from InterDigital. Hillcrest Labs is a leading global supplier of software and components for sensor processing in consumer and IoT devices, and the acquisition extends CEVA’s connected technology portfolio with highly complementary sensor processing technologies that have powered more than 100 million devices.

ams Announces New Augmented Hearing Engine with ANC for True Wireless Earbuds

June 27, 2019 by audioXpress Staff

ams Announces New Augmented Hearing Engine with ANC for True Wireless Earbuds

ams announced a new digital noise cancellation technology that the Austrian sensor solutions supplier says will transform the experience of hearing music and voice calls when wearing new, more comfortable, loose-fit true wireless earbuds. The new Augmented Hearing Engine from ams supports development of features such as selectable noise cancellation to optimize listening when in social situations and allows audio manufacturers to develop highly differentiated product designs with unique capabilities.

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