All items tagged with sensors (122)
AMS Launches Smallest Proximity Sensor To Enable Integration of New Functionality In Space-Constrained Wireless Earbuds
February 17, 2021 by Joao Martins

AMS Launches Smallest Proximity Sensor To Enable Integration of New Functionality In Space-Constrained Wireless Earbuds

AMS launched the TMD2636, a fully integrated proximity sensor which occupies 30% less space than currently available solutions, and delivers transformational added value to manufacturers of True Wireless Stereo (TWS) earbuds. The new TMD2636 fully integrated proximity sensor module is supplied in an ultra-low-profile package. This means that an earbud can now accommodate multiple proximity sensors to increase reliability or add new features and still save power when the earbud is not in use.
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TDK Introduces Lowest Pulse Density Modulation Multi-Mode MEMS Microphone With Acoustic Activity Detect
January 13, 2021 by audioXpress Staff

TDK Introduces Lowest Pulse Density Modulation Multi-Mode MEMS Microphone With Acoustic Activity Detect

InvenSense, a TDK Group company, announced a comprehensive portfolio of new technology solutions during the 2021 Consumer Electronics Showcase. Among the expanded MEMS portfolio, the new T5838 SmartSound MEMS microphone offers a low power mode of just 130uAmps and a high-quality mode of 330uAmps, while supporting a dynamic range of 68dN SNR and 133dB AOP at 20kHz bandwidth. Optimized for smartphones, microphone arrays, smart speakers, and headsets, the T5838 supports configurable wake-on-sound at power levels as low as 20 µA.
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CEVA Expands Possibilities in Sensor Hub DSPs with 2nd Generation SensPro Family
January 13, 2021 by audioXpress Staff

CEVA Expands Possibilities in Sensor Hub DSPs with 2nd Generation SensPro Family

CEVA introduced its 2nd generation SensPro DSP family, a hub for AI and DSP processing workloads associated with a wide range of sensors including camera, Radar, LiDAR, Time-of-Flight, microphones and inertial measurement units (IMUs). The new, lower power, SensPro2 DSPs deliver up to 10X performance improvement versus CEVA-BX2 DSP for AI networks used for voice assistants, natural language processing and spatial audio. They are also automotive-ready with high-precision floating-point capability.
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7 Sensing Software Joins Qualcomm Extension Program with Hearing Augmentation and Voice Processing Solutions
December 15, 2020 by audioXpress Staff

7 Sensing Software Joins Qualcomm Extension Program with Hearing Augmentation and Voice Processing Solutions

7 Sensing Software, an embedded software development company active in audio processing and machine learning targeting wearable and hearable applications, announced that it joined the Qualcomm Extension Program. With this confirmation, 7 Sensing Software is now able to offer its Hearing Augmentation and Pure Voice solutions for wireless earbuds and headsets running on the ultra low power, premium-tier Qualcomm QCC5100 Bluetooth SoC family.
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Webinar December 8: Your Hearables and True Wireless Designs Need Sensor Fusion
December 7, 2020 by audioXpress Staff

Webinar December 8: Your Hearables and True Wireless Designs Need Sensor Fusion

Want to understand the complexities of context awareness and user interface for the hearables market? Attend a quick webinar December 8 to learn about sensor fusion solutions for TWS designs. OEMs and IC companies need to manage sensor fusion for the latest cutting edge wearables, hearables and true wireless designs. Product managers and design, system, and product engineers wanting to understand the complexities of context awareness and user interface for the hearables market should join CEVA's experts Seth Sternberg and Ken Walker to learn more.
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Elliptic Labs Expands its Ultrasound Sensing Framework to More Devices and Mobile Platforms
November 19, 2020 by Joao Martins

Elliptic Labs Expands its Ultrasound Sensing Framework to More Devices and Mobile Platforms

Norwegian company Elliptic Labs has successfully introduced its ultrasound sensing technology to the market, leveraging early agreements with major chip suppliers to the IT and mobile industries. Following partnerships with Texas Instruments, Infineon, Knowles, Cirrus Logic and AAC Technologies, at the implementation level, Elliptic Labs this year expanded its support directly with chipset manufacturers ARM, Intel, Qualcomm and more recently MediaTek. And the company's efforts in ultrasound-based sensing are just in early stages.
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ABI Research Projects Transformational Smart Home Trends
November 9, 2020 by audioXpress Staff

ABI Research Projects Transformational Smart Home Trends

Homes will change more over the next 20 years than they did during the past hundred says ABI Research. The next generation home, the Transformational Smart Home, is emerging and will transform life inside homes and reshape the world of consumer services and citizen interactions. In its latest research, now available, the tech market advisory firm outlines six major smart home concepts that will drive Smart Home investment and adoption.
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What Does the Future Hold for the Hearables Market?
November 3, 2020 by audioXpress Staff

What Does the Future Hold for the Hearables Market?

A new market report from IDTechEx Research, the research and consultancy focused on emerging technologies from Cambridge, UK, offers a in-depth perspective on the market for Hearables. The new IDTechEx research covers ear-worn electronic products, including headphones, hearing aids and related product areas. The new report offers an overview of trends, technology, players and expanded forecasts from 2020 to 2030.
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STMicroelectronics Establishes World’s First “Lab-in-Fab” to Advance Adoption of Piezoelectric MEMS in Singapore
November 2, 2020 by audioXpress Staff

STMicroelectronics Establishes World’s First “Lab-in-Fab” to Advance Adoption of Piezoelectric MEMS in Singapore

STMicroelectronics, a leading manufacturer of Micro-Electromechanical Systems (MEMS) technology, announced a collaboration with A*STAR’s Institute of Microelectronics (IME), a research institute in Singapore, and ULVAC, a leading Japanese manufacturing-tool vendor, to jointly setup and operate an 8-inch (200mm) R&D line focused on Piezo MEMS technology within ST’s existing manufacturing facility in Singapore. The concept aims to advance the adoption of piezoelectric MEMS in new applications including augmented reality.
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New Jaguar Land Rover Features Road Noise Cancellation Technology From Silentium
October 23, 2020 by audioXpress Staff

New Jaguar Land Rover Features Road Noise Cancellation Technology From Silentium

Jaguar Land Rover has revealed that it will start including Active Road Noise Cancellation technology from Silentium to remove unwanted road and tyre sounds from the cabin and provide a quieter and more refined experience for drivers and passengers. The technology, introduced on the new Jaguar F-PACE, new Jaguar XF and Range Rover Velar models, is capable of lowering unwanted noise peaks by 10dB and overall noise levels by 3-4dB – the equivalent of turning down the in-car sound system by four ‘steps’.
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