All items tagged with sensors (116)

Amphenol Completes Acquisition of MTS Systems Corporation and Resells Test and Simulation Business to ITW

April 8, 2021 by audioXpress Staff

Amphenol Completes Acquisition of MTS Systems Corporation and Resells Test and Simulation Business to ITW

Amphenol Corporation, the global provider of high-technology interconnect, antenna and sensor solutions, continues its expansion and now announced that it has completed the planned acquisition of MTS Systems Corporation. MTS is the company that had acquired PCB Group in 2016, becoming the owner of PCB Piezotronics and Larson Davis. Amphenol will now sell the test and simulation business of MTS to ITW (Illinois Tool Works), as agreed in December 2020.

Contextual Awareness: What Is It, and How Is It Being Used?

March 17, 2021 by Elia Shenberger

Contextual Awareness: What Is It, and How Is It Being Used?

Context-aware devices, such as the embedded smartphone keyboards, have been around for some time, though in a very limited form. By learning regularly used names, locations and phrases, they seem to know your next move, that is, predictive text. Similarly, but at a higher level, the next generation of smart audio devices will combine user-specific data, such as location, preferences and other device sensor data, including audio, to better serve the user.

DSP Concepts and CloudNav Partnership Brings Best-in-Class Sensor Fusion Technology to Audio Weaver

February 24, 2021 by audioXpress Staff

DSP Concepts and CloudNav Partnership Brings Best-in-Class Sensor Fusion Technology to Audio Weaver

DSP Concepts, the audio platform powering more than 50M devices for many of the world’s best consumer and automotive brands, announced a partnership with CloudNav to bring its sensor fusion technology to Audio Weaver. This means that developers can seamlessly deploy CloudNav’s Performance Fusion technology through Audio Weaver’s drag-and-drop graphical interface to integrate and automatically calibrate inertial sensors for optimal product performance.

Developers Get Easy Access to Amazon Voice Services with OKdo and Qualcomm

February 24, 2021 by Cristina Costa

Developers Get Easy Access to Amazon Voice Services with OKdo and Qualcomm

OKdo, the global technology company from Electrocomponents, announced it is now supplying the Qualcomm Home Hub 100 Development Kit for Amazon Voice Services (AVS), a ready to use environment for voice-controlled applications in connected devices. Based on Qualcomm’s highly integrated, multi-mode System-on-Chip (SoC), the QCA4020, the Home Hub 100 kit is provided with pre-integrated software support for AVS, to help kickstart the development of voice-controlled applications.

AMS Launches Smallest Proximity Sensor To Enable Integration of New Functionality In Space-Constrained Wireless Earbuds

February 17, 2021 by Joao Martins

AMS Launches Smallest Proximity Sensor To Enable Integration of New Functionality In Space-Constrained Wireless Earbuds

AMS launched the TMD2636, a fully integrated proximity sensor which occupies 30% less space than currently available solutions, and delivers transformational added value to manufacturers of True Wireless Stereo (TWS) earbuds. The new TMD2636 fully integrated proximity sensor module is supplied in an ultra-low-profile package. This means that an earbud can now accommodate multiple proximity sensors to increase reliability or add new features and still save power when the earbud is not in use.

TDK Introduces Lowest Pulse Density Modulation Multi-Mode MEMS Microphone With Acoustic Activity Detect

January 13, 2021 by audioXpress Staff

TDK Introduces Lowest Pulse Density Modulation Multi-Mode MEMS Microphone With Acoustic Activity Detect

InvenSense, a TDK Group company, announced a comprehensive portfolio of new technology solutions during the 2021 Consumer Electronics Showcase. Among the expanded MEMS portfolio, the new T5838 SmartSound MEMS microphone offers a low power mode of just 130uAmps and a high-quality mode of 330uAmps, while supporting a dynamic range of 68dN SNR and 133dB AOP at 20kHz bandwidth. Optimized for smartphones, microphone arrays, smart speakers, and headsets, the T5838 supports configurable wake-on-sound at power levels as low as 20 µA.

CEVA Expands Possibilities in Sensor Hub DSPs with 2nd Generation SensPro Family

January 13, 2021 by audioXpress Staff

CEVA Expands Possibilities in Sensor Hub DSPs with 2nd Generation SensPro Family

CEVA introduced its 2nd generation SensPro DSP family, a hub for AI and DSP processing workloads associated with a wide range of sensors including camera, Radar, LiDAR, Time-of-Flight, microphones and inertial measurement units (IMUs). The new, lower power, SensPro2 DSPs deliver up to 10X performance improvement versus CEVA-BX2 DSP for AI networks used for voice assistants, natural language processing and spatial audio. They are also automotive-ready with high-precision floating-point capability.

7 Sensing Software Joins Qualcomm Extension Program with Hearing Augmentation and Voice Processing Solutions

December 15, 2020 by audioXpress Staff

7 Sensing Software Joins Qualcomm Extension Program with Hearing Augmentation and Voice Processing Solutions

7 Sensing Software, an embedded software development company active in audio processing and machine learning targeting wearable and hearable applications, announced that it joined the Qualcomm Extension Program. With this confirmation, 7 Sensing Software is now able to offer its Hearing Augmentation and Pure Voice solutions for wireless earbuds and headsets running on the ultra low power, premium-tier Qualcomm QCC5100 Bluetooth SoC family.

Webinar December 8: Your Hearables and True Wireless Designs Need Sensor Fusion

December 7, 2020 by audioXpress Staff

Webinar December 8: Your Hearables and True Wireless Designs Need Sensor Fusion

Want to understand the complexities of context awareness and user interface for the hearables market? Attend a quick webinar December 8 to learn about sensor fusion solutions for TWS designs. OEMs and IC companies need to manage sensor fusion for the latest cutting edge wearables, hearables and true wireless designs. Product managers and design, system, and product engineers wanting to understand the complexities of context awareness and user interface for the hearables market should join CEVA's experts Seth Sternberg and Ken Walker to learn more.

Elliptic Labs Expands its Ultrasound Sensing Framework to More Devices and Mobile Platforms

November 19, 2020 by Joao Martins

Elliptic Labs Expands its Ultrasound Sensing Framework to More Devices and Mobile Platforms

Norwegian company Elliptic Labs has successfully introduced its ultrasound sensing technology to the market, leveraging early agreements with major chip suppliers to the IT and mobile industries. Following partnerships with Texas Instruments, Infineon, Knowles, Cirrus Logic and AAC Technologies, at the implementation level, Elliptic Labs this year expanded its support directly with chipset manufacturers ARM, Intel, Qualcomm and more recently MediaTek. And the company's efforts in ultrasound-based sensing are just in early stages.

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