All items tagged with sensors (116)
Energous Commends ITU Recommendation for Radio Frequency-based Wireless Power Transfer in the 900MHz Band
October 10, 2022 by Joao Martins

Energous Commends ITU Recommendation for Radio Frequency-based Wireless Power Transfer in the 900MHz Band

Energous Corporation, a leading developer of RF-based charging for wireless power networks, applauded the International Telecommunication Union (ITU) Recommendation ITU-R SM.2151-0, which includes an approval and recommendation for the 900 MHz frequency band for wireless power transfer for the wireless charging of devices such as sensors, smart tags, asset trackers and other connected applications. Energous helped lead the process to develop the global recommendation, representing a significant step forward for wireless power delivery.
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Silicon Labs Extends Portfolio for Matter and Wi-Fi at Developer Conference
September 16, 2022 by Joao Martins

Silicon Labs Extends Portfolio for Matter and Wi-Fi at Developer Conference

Silicon Labs announced a slate of new multiprotocol connectivity products that are driven by interoperability, advancing innovations in the Internet of Things and Smart Home, including Matter and Wi-Fi 6. Standing out among the announcements is the new low power SiWx917 Wi-Fi 6 and Bluetooth LE combination SoC that Silicon Labs says is Matter-ready. The SoC includes an integrated applications processor, and is ideal for battery-powered or energy-efficient connected devices with always-on cloud connectivity.
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CEVA Celebrates 15 Billionth CEVA-powered Chip Shipped
August 9, 2022 by audioXpress Staff

CEVA Celebrates 15 Billionth CEVA-powered Chip Shipped

CEVA, Inc., the wireless connectivity and smart sensing technologies licensing company, announced that cumulative royalty-bearing chip shipments that include CEVA IP surpassed 15 billion units during the second quarter of 2022. This significant milestone has been achieved as CEVA approaches it’s 20-year anniversary of being a public company. While the first 10 billion CEVA-powered shipments spanned more than 15 years, the next 5 billion shipments took less than three and a half years.
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Synaptics’ Triple Combo Wireless System-on-Chip Wins "2022 Best of Sensors" Award
June 29, 2022 by audioXpress Staff

Synaptics’ Triple Combo Wireless System-on-Chip Wins "2022 Best of Sensors" Award

Synaptics received the "2022 Best of Sensors” Award for Connectivity with its SYN4381 Triple Combo, the industry’s first Matter-compliant SoC with integrated Wi-Fi 6/6E, Bluetooth 5.2, and 802.15.4/Thread. The award was presented at Sensors Converge 2022 in a ceremony that honors the best technologies in the large and growing ecosystem. Synaptics’ FlexSense 4-in-1 sensor fusion processor was also recognized as a Finalist in the “Best of Sensors” Awards’ for wearables.
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Nordic Semiconductor Showcases Bluetooth LE Audio with Auracast Development Solutions
June 27, 2022 by Joao Martins

Nordic Semiconductor Showcases Bluetooth LE Audio with Auracast Development Solutions

Nordic Semiconductor has used the latest trade shows globally to showcase its latest low power wireless solutions, and introduced a series of new development solutions targeting Bluetooth LE Audio. At the Embedded World Exhibition that took place in Nuremberg, Germany, Nordic offered demonstrations of its new nRF5340 Audio Development Kit (DK), a design platform for rapid development of LE Audio products, and the Nordic Thingy:53 a rapid prototyping solution, both based on Nordic’s nRF5340 SoC.
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STMicroelectronics Updates NanoEdge AI Studio to Support On-Device Learning and Inferencing in Recently Announced AI-Native MEMS Sensors
June 24, 2022 by audioXpress Staff

STMicroelectronics Updates NanoEdge AI Studio to Support On-Device Learning and Inferencing in Recently Announced AI-Native MEMS Sensors

STMicroelectronics has expanded its NanoEdge AI Studio machine-learning design software with support for smart sensors that contain ST’s embedded Intelligent Sensor Processing Unit (ISPU). The new release extends the market-unique tool’s capability to enable on-device learning of AI models for anomaly detection inside intelligent sensors.
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New STMicroelectronics Smart Inertial Modules Bring AI To Remote Sensors
June 20, 2022 by Cristina Costa

New STMicroelectronics Smart Inertial Modules Bring AI To Remote Sensors

STMicroelectronics has introduced new inertial sensors that contain the intelligent sensor processing unit (ISPU) to power applications interacting with trained devices, allowing intelligence moving from “on” the edge to “in” the edge. The sensor's on-chip signal processing core, programmable with ST’s NanoEdge AI Studio, is ideal for machine-learning applications.
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Metalenz and STMicroelectronics Deliver World's First Optical Metasurface Technology for Consumer Electronics Devices
June 14, 2022 by Cristina Costa

Metalenz and STMicroelectronics Deliver World's First Optical Metasurface Technology for Consumer Electronics Devices

Metalenz, the first company to commercialize meta-optics, and STMicroelectronics announced that ST’s currently released VL53L8 direct Time-of-Flight (dToF) sensor is the highly anticipated market debut of the meta-optics devices developed through their partnership, which was disclosed in June 2021. Metalenz metasurfaces are now on the market, marking the introduction of this revolutionary optical technology in real-world devices.
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Lavoce Launches Powersoft IpalMod Compatible 18" And 21" Subwoofers
May 10, 2022 by audioXpress Staff

Lavoce Launches Powersoft IpalMod Compatible 18" And 21" Subwoofers

Lavoce Italiana is attending ISE 2022 and announced the official launch of its new SAN184.50iP and SAN216.00iP high motor strength neodymium subwoofers, designed to partner with Powersoft's IpalMod amplifier and software platform (8500W @ 1ohm). Just one of many new products that the dynamic Italian transducer company is presenting as it returns to in-person pro audio trade shows. Lavoce has a heritage of 35 years designing and manufacturing professional loudspeaker components and is now extending its portfolio with new IpalMod compatible subwoofers.
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MIT Researchers Develop Flexible, Thin-Film Loudspeaker
April 28, 2022 by audioXpress Staff

MIT Researchers Develop Flexible, Thin-Film Loudspeaker

Researchers at the Massachusetts Institute of Technology (MIT) have developed an ultra-thin loudspeaker that can turn any rigid surface into an active audio source. To demonstrate the concept, MIT engineers have developed a paper-thin loudspeaker, which was now presented in public, pitching a straightforward fabrication process that could be introduced to enable the flexible, thin-film solution to be produced at scale.
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