All items tagged with sensor fusion (39)

Azoteq Announces New IQS390 and IQS396 Haptic ICs for Improved Interfaces

January 31, 2025 by Joao Martins

Azoteq Announces New IQS390 and IQS396 Haptic ICs for Improved Interfaces

Already a market reference in sensor fusion solutions for consumer electronics and automotive interfaces, Azoteq announced the launch of two integrated circuits (ICs) designed to provide precise, customizable, and energy-efficient haptic feedback for a wide range of applications. The IQS390 Haptics Driver and the IQS396 ProxFusion IC enhance the user experience by providing improved interactions

TDK Launches VibeSense360 Next-Generation TWS Motion Sensor Solution

January 21, 2025 by Joao Martins

TDK Launches VibeSense360 Next-Generation TWS Motion Sensor Solution

During CES 2025, TDK announced an enhanced next-generation InvenSense VibeSense360 motion sensor solution that will enable state-of-the-art spatial audio head tracking in new true wireless earbuds. The new VibeSense360 TWS solution includes motion sensor software, running on the latest SmartMotion ICM-45606 inertial measurement unit (IMU) that enables concurrent features of spatial audio, keyword assist, transparency for talk, head/UI gestures, and machine learning. The 220µA @50Hz 6-Axis IMU delivers industry-leading performance and battery life for TWS applications.

AONDevices Unveils Edge AI Sensor Module in Collaboration with P-Logic Consulting

December 16, 2024 by Joao Martins

AONDevices Unveils Edge AI Sensor Module in Collaboration with P-Logic Consulting

AONDevices announced the launch of its AONix Edge AI sensor module, a new platform that addresses key challenges for battery-operated connected devices running artificial intelligence on the edge. Developed in collaboration with P-Logic Consulting and featuring sensor integration from TDK InvenSense, this compact 32mm x 32mm module is an energy-efficient platform with the ability to deliver real-time AI performance in always-on applications, particularly for consumer electronics.

Azoteq Appoints Iton as Independent Design House

December 4, 2024 by audioXpress Staff

Azoteq Appoints Iton as Independent Design House

Azoteq, the semiconductor company that pioneered sensor fusion and multi-sensor technologies on single ICs for consumer electronics, announced the signing of Iton as an independent design house (IDH). This partnership reinforces Azoteq's commitment to delivering cutting-edge solutions while speeding up product development processes and turnkey design, leveraging Iton's expertise in embedded systems, and manufacturing.

Alif Semiconductor Now Sampling BLE and Matter Wireless Microcontroller with Neural Co-Processor for AI/ML Workloads

November 7, 2024 by Cristina Costa

Alif Semiconductor Now Sampling BLE and Matter Wireless Microcontroller with Neural Co-Processor for AI/ML Workloads

The Balletto Bluetooth MCU family was announced by Alif Semiconductor in April 2024, and the company is now sampling its development kit, the DK-B1, to enable rapid prototyping of products that require ultra-low power Bluetooth Low Energy or 802.15.4 wireless connectivity. The MCU is also the world's first BLE/Matter solution to feature a DSP engine and an NPU for efficient hardware acceleration of AI/ML workloads.

Microchip Technology Expands dsPIC Digital Signal Controller Family to Enhance Real-Time Precision and Execution

August 2, 2024 by Cristina Costa

Microchip Technology Expands dsPIC Digital Signal Controller Family to Enhance Real-Time Precision and Execution

Meeting the requirements for more complex and higher performance embedded systems, Microchip Technology has launched its new dsPIC33A Core family of Digital Signal Controllers (DSCs). The new DSCs feature a 32-bit architecture with a double-precision floating-point unit and DSP engine for faster computation in time-critical applications, ideal for fast-charging, wireless charging, and sensing systems such as those required for adaptive audio applications.

Analog Devices Now Sampling New ADXL380 and ADXL382 Triaxial MEMS Accelerometers

July 22, 2024 by Joao Martins

Analog Devices Now Sampling New ADXL380 and ADXL382 Triaxial MEMS Accelerometers

It was a big product announcement from Analog Devices at Sensors Converge 2024, but aside for what was revealed to those attending the event, there has yet to be a formal announcement. The ADXL380 and ADXL382 are low noise, low power, wide bandwidth, 16-bit sensors that cover a dynamic range of 85dB, making them good options for precision applications with minimal calibration, with the ADXL380 being ideal for new true wireless ANC earbuds. audioXpress explores here all the important details about these two new 3-axis MEMS accelerometers.

Ceva and THX Partner to Bring Premium Spatial Audio to Hearables, Consumer and Mobile Products

January 11, 2024 by Joao Martins

Ceva and THX Partner to Bring Premium Spatial Audio to Hearables, Consumer and Mobile Products

Ceva and THX announced RealSpace Tuned by THX, a premium software offering for original equipment manufacturers (OEMs) to add support for immersive spatial audio customized to any consumer or prosumer audio device including true wireless earbuds, wireless headphones, smartphones, speakers and soundbars. Ceva RealSpace Tuned by THX delivers was demonstrated at CES 2024.

CEVA Acquires Spatial Audio Business from VisiSonics

May 10, 2023 by Joao Martins

CEVA Acquires Spatial Audio Business from VisiSonics

CEVA announced the acquisition of the RealSpace 3D Spatial Audio business, technology and patents from VisiSonics Corporation. The acquisition of RealSpace enables CEVA to offer a complete spatial audio solution to OEMs, targeting high volume markets including true wireless stereo, OTC hearables, gaming headphones, AR/VR, audio conferencing, automotive and media entertainment.

STMicroelectronics Announces All-in-One Motion and Bone-Conduction Sensor for Hearables

March 7, 2023 by audioXpress Staff

STMicroelectronics Announces All-in-One Motion and Bone-Conduction Sensor for Hearables

STMicroelectronics has announced the LSM6DSV16BX, a unique highly integrated sensor that delivers important space savings inside hearable devices or general-purpose TWS earbuds, including for sports. The new device delivers longer listening experiences and superior hearing by combining a 6-axis inertial measurement unit (IMU) for head tracking and activity detection with an audio accelerometer for detecting voice through bone conduction in a frequency range that exceeds 1KHz.

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