All items tagged with sensor fusion (35)

Alif Semiconductor Now Sampling BLE and Matter Wireless Microcontroller with Neural Co-Processor for AI/ML Workloads

November 7, 2024 by Cristina Costa

Alif Semiconductor Now Sampling BLE and Matter Wireless Microcontroller with Neural Co-Processor for AI/ML Workloads

The Balletto Bluetooth MCU family was announced by Alif Semiconductor in April 2024, and the company is now sampling its development kit, the DK-B1, to enable rapid prototyping of products that require ultra-low power Bluetooth Low Energy or 802.15.4 wireless connectivity. The MCU is also the world's first BLE/Matter solution to feature a DSP engine and an NPU for efficient hardware acceleration of AI/ML workloads.

Microchip Technology Expands dsPIC Digital Signal Controller Family to Enhance Real-Time Precision and Execution

August 2, 2024 by Cristina Costa

Microchip Technology Expands dsPIC Digital Signal Controller Family to Enhance Real-Time Precision and Execution

Meeting the requirements for more complex and higher performance embedded systems, Microchip Technology has launched its new dsPIC33A Core family of Digital Signal Controllers (DSCs). The new DSCs feature a 32-bit architecture with a double-precision floating-point unit and DSP engine for faster computation in time-critical applications, ideal for fast-charging, wireless charging, and sensing systems such as those required for adaptive audio applications.

Analog Devices Now Sampling New ADXL380 and ADXL382 Triaxial MEMS Accelerometers

July 22, 2024 by Joao Martins

Analog Devices Now Sampling New ADXL380 and ADXL382 Triaxial MEMS Accelerometers

It was a big product announcement from Analog Devices at Sensors Converge 2024, but aside for what was revealed to those attending the event, there has yet to be a formal announcement. The ADXL380 and ADXL382 are low noise, low power, wide bandwidth, 16-bit sensors that cover a dynamic range of 85dB, making them good options for precision applications with minimal calibration, with the ADXL380 being ideal for new true wireless ANC earbuds. audioXpress explores here all the important details about these two new 3-axis MEMS accelerometers.

Ceva and THX Partner to Bring Premium Spatial Audio to Hearables, Consumer and Mobile Products

January 11, 2024 by Joao Martins

Ceva and THX Partner to Bring Premium Spatial Audio to Hearables, Consumer and Mobile Products

Ceva and THX announced RealSpace Tuned by THX, a premium software offering for original equipment manufacturers (OEMs) to add support for immersive spatial audio customized to any consumer or prosumer audio device including true wireless earbuds, wireless headphones, smartphones, speakers and soundbars. Ceva RealSpace Tuned by THX delivers was demonstrated at CES 2024.

CEVA Acquires Spatial Audio Business from VisiSonics

May 10, 2023 by Joao Martins

CEVA Acquires Spatial Audio Business from VisiSonics

CEVA announced the acquisition of the RealSpace 3D Spatial Audio business, technology and patents from VisiSonics Corporation. The acquisition of RealSpace enables CEVA to offer a complete spatial audio solution to OEMs, targeting high volume markets including true wireless stereo, OTC hearables, gaming headphones, AR/VR, audio conferencing, automotive and media entertainment.

STMicroelectronics Announces All-in-One Motion and Bone-Conduction Sensor for Hearables

March 7, 2023 by audioXpress Staff

STMicroelectronics Announces All-in-One Motion and Bone-Conduction Sensor for Hearables

STMicroelectronics has announced the LSM6DSV16BX, a unique highly integrated sensor that delivers important space savings inside hearable devices or general-purpose TWS earbuds, including for sports. The new device delivers longer listening experiences and superior hearing by combining a 6-axis inertial measurement unit (IMU) for head tracking and activity detection with an audio accelerometer for detecting voice through bone conduction in a frequency range that exceeds 1KHz.

Syntiant Launches NDP115 Neural Decision Processor for Always-On Speech and Sensor-Fusion

February 14, 2023 by Joao Martins

Syntiant Launches NDP115 Neural Decision Processor for Always-On Speech and Sensor-Fusion

It was one of the key audio-related demonstrations at the Syntiant suite during CES 2023, and the new NDP115 Neural Decision Processor is now positioned as a key strategic platform for new compact, ultra-low-power designs with always-on voice and sensor fusion applications. The newest addition to Syntiant's family of special purpose silicon is built using the company’s Syntiant Core 2 inference engine that can run multiple neural network loads at under 1mW.

xMEMS Announces World's First Solid-State MEMS DynamicVent, Enabling Active Ambient Control for Next-Generation TWS and Hearing Aids

January 9, 2023 by Joao Martins

xMEMS Announces World's First Solid-State MEMS DynamicVent, Enabling Active Ambient Control for Next-Generation TWS and Hearing Aids

Part of xMEMS Labs announcements at CES 2023, the innovative MEMS speaker company introduced Skyline, the world’s first discrete solid-state MEMS DynamicVent, a specific design with a valve that opens or closes by sensor fusion input from the earbud DSP and enables the benefits of both an open-fit (spatially aware) and closed-fit (occluded) earbud design. This enables smart TWS earbuds and hearing aids that create best-of-both-worlds user experiences in the same product.

Syntiant Partners with Telink and Murata to Present New Edge AI Audio Solutions at CES 2023

December 26, 2022 by Joao Martins

Syntiant Partners with Telink and Murata to Present New Edge AI Audio Solutions at CES 2023

Syntiant is heading to CES 2023 with an exciting range of announcements and presentations of end-to-end edge AI solutions for always-on applications. The company will unveil a new reference design created in partnership with Telink that will enable ODMs and OEMs to easily and quickly deploy complete, ultra-low-power, deep learning voice processing applications in remote controls. Another major announcement is the launch of the Murata Type2DA neural decision processor module for edge AI audio and sensor applications.

Gaudio Lab Audio Technologies Recognized with Two CES 2023 Innovation Awards

December 2, 2022 by audioXpress Staff

Gaudio Lab Audio Technologies Recognized with Two CES 2023 Innovation Awards

Gaudio Lab, the innovative audio technology solutions company from Seoul, South Korea, received two CES 2023 Innovation Awards ahead of the company's presentation at the world's biggest consumer technology trade show, taking place in Las Vegas, Nevada, 5-8 January, 2023. Gaudio Lab was honored with two awards for its Loudness Management 1 (LM1) technology, and for the Gaudio Spatial Audio (GSA) audio software for wireless earbuds.

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