All items tagged with sensor fusion (39)

Webinar December 8: Your Hearables and True Wireless Designs Need Sensor Fusion

December 7, 2020 by audioXpress Staff

Webinar December 8: Your Hearables and True Wireless Designs Need Sensor Fusion

Want to understand the complexities of context awareness and user interface for the hearables market? Attend a quick webinar December 8 to learn about sensor fusion solutions for TWS designs. OEMs and IC companies need to manage sensor fusion for the latest cutting edge wearables, hearables and true wireless designs. Product managers and design, system, and product engineers wanting to understand the complexities of context awareness and user interface for the hearables market should join CEVA's experts Seth Sternberg and Ken Walker to learn more.

Elliptic Labs Expands its Ultrasound Sensing Framework to More Devices and Mobile Platforms

November 19, 2020 by Joao Martins

Elliptic Labs Expands its Ultrasound Sensing Framework to More Devices and Mobile Platforms

Norwegian company Elliptic Labs has successfully introduced its ultrasound sensing technology to the market, leveraging early agreements with major chip suppliers to the IT and mobile industries. Following partnerships with Texas Instruments, Infineon, Knowles, Cirrus Logic and AAC Technologies, at the implementation level, Elliptic Labs this year expanded its support directly with chipset manufacturers ARM, Intel, Qualcomm and more recently MediaTek. And the company's efforts in ultrasound-based sensing are just in early stages.

CEVA and VisiSonics Offer 3D Spatial Audio Development for True Wireless Earbuds and Headphones

September 24, 2020 by audioXpress Staff

CEVA and VisiSonics Offer 3D Spatial Audio Development for True Wireless Earbuds and Headphones

CEVA and VisiSonics, a developer of patented 3D spatial audio technologies, announced that the companies have collaborated closely together to develop a comprehensive 3D spatial audio solution for embedded devices, including true wireless audio (TWS) earbuds, headphones and other hearables. The collaboration combines VisiSonics' RealSpace 3D audio software optimized for CEVA’s low power audio and sensor hub DSPs together with CEVA’s MotionEngine head tracking algorithms running on its BNO080 9-axis System in Package (SiP).

CEVA Extends Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software

September 22, 2020 by audioXpress Staff

CEVA Extends Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software

In the wake of the acquisition of the Hillcrest Laboratories (Hillcrest Labs) business from InterDigital in mid-2019, CEVA now introduced the Hillcrest Labs MotionEngine Hear, a sensor and processor agnostic embedded software solution for hearable devices. The new solution allows SoC vendors, OEMs and ODMs to take advantage of a configurable sensor fusion platform to add intuitive user interface, gesture control, activity tracking and spatial audio capabilities to hearable devices.

Our Future Car: Audio Bubbles, Sterile Cockpits, New Business Models

July 8, 2020 by Elia Shenberger

Our Future Car: Audio Bubbles, Sterile Cockpits, New Business Models

We probably listen to more music and podcasts in our cars than anywhere else. Which means this is where we’re pushing the boundaries of audio experience — less noise, personalized sound zones, and control. And we’re more aware of the safety implications, not distracting or tiring the driver. This article was published in audioXpress, June 2020.

CEVA Announces SensPro High Performance Sensor Hub DSP Architecture for Smart Devices

April 7, 2020 by audioXpress Staff

CEVA Announces SensPro High Performance Sensor Hub DSP Architecture for Smart Devices

CEVA announced a new high performance sensor hub DSP architecture designed to handle the broad range of sensor processing and sensor fusion workloads for contextually-aware devices. The new SensPro device family serves as a hub for processing and fusing of data from multiple sensors including camera, Radar, LiDAR, Time-of-Flight, microphones and inertial measurement units. This highly-configurable and self-contained architecture brings together scalar and parallel processing for floating point and integer data types, as well as deep learning training and inferencing.

CEVA Debuts SenslinQ Platform to Streamline Development of Contextually Aware Connected Devices

January 7, 2020 by audioXpress Staff

CEVA Debuts SenslinQ Platform to Streamline Development of Contextually Aware Connected Devices

At CES 2020 CEVA unveiled SenslinQ, its first integrated hardware IP and software platform that aggregates sensor fusion, sound and connectivity technologies to enable contextually aware connected devices. The CEVA SenslinQ integrated hardware IP and software platform collects, processes and links data from multiple sensors to enable intelligent devices to understand their surroundings - a key development for augmented hearing using wireless headphones and earbuds.

Lattice Announces Nexus Low Power FPGA Platform for Edge Applications

December 10, 2019 by Cristina Costa

Lattice Announces Nexus Low Power FPGA Platform for Edge Applications

Lattice Semiconductor announced its new low power FPGA platform, Lattice Nexus. The platform is architected to deliver power-efficient performance that will benefit developers of a wide range of applications, including voice processing and edge computing for connected devices. Built with innovations at every level of design, from solutions, to architecture, to circuit, the new Lattice Nexus FPGAs deliver higher system performance at significantly reduced power consumption.

Bragi Offers New Technology Suite and Reference Design for Consumer and Professional Hearables

February 26, 2019 by audioXpress Staff

Bragi Offers New Technology Suite and Reference Design for Consumer and Professional Hearables

Bragi, the company which can rightfully claim to be the creators of the world’s first Hearable, is unveiling the next-generation of its technology suite and is to introduce it at MWC 2019. As previously announced, Bragi is now developing ultra-efficient artificial intelligence and edge computing technologies for ultra-low power devices that intends to make available to other manufacturers. At MWC 2019, the German company will disclose details of the new platform as a reference design for professional Hearables.

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