All items tagged with sensor fusion (39)

Upgrade Sensing for Your True Wireless Stereo Designs. Why Buy Four Chips if You Only Need One?

October 1, 2021 by Special Content

Upgrade Sensing for Your True Wireless Stereo Designs. Why Buy Four Chips if You Only Need One?

Azoteq recently released its second-generation four-in-one chip for earbuds. The IQS7222A IC is a multifunctional capacitive, inductive, and Hall-effect sensor with additional temperature sensing for reference tracking. The 1.62 x 1.62 mm chip allows you to add a touch-and-swipe interface, wear detection, docking detection and your choice of an inductive waterproof button or the inductive force-sensing features.

Sondrel Unveils Edge Computing IP Platform for Smart Devices

September 8, 2021 by audioXpress Staff

Sondrel Unveils Edge Computing IP Platform for Smart Devices

Sondrel has created a powerful, quad core IP platform that is ideal for ASIC solutions for remote gathering and processing of video and data at the Edge with secure onwards transmission of the results. The SFA 200 reference design is targeted at battery powered applications in Smart Home, Sensor Fusion, voice-control, and other devices where a compact chip can add processing ‘smarts’ by providing local end-point data processing for data collection and analysis along with inference processing.

Cadence Announces New Tensilica FloatingPoint DSP Family for Low Power AI/ML

June 18, 2021 by audioXpress Staff

Cadence Announces New Tensilica FloatingPoint DSP Family for Low Power AI/ML

Cadence Design Systems unveiled the Cadence Tensilica FloatingPoint DSP family, optimized for power, performance and area (PPA). The new DSP IP cores extend from small, ultra-low power to very high performance and are well-suited for a broad array of applications, from energy-efficient solutions for battery powered devices to artificial intelligence/machine learning (AI/ML), sensor fusion, object tracking and augmented reality applications in the mobile, automotive, and consumer markets.

Elliptic Labs Optimizes Its Advanced Virtual Sensors for Cadence Tensilica HiFi DSPs

March 31, 2021 by audioXpress Staff

Elliptic Labs Optimizes Its Advanced Virtual Sensors for Cadence Tensilica HiFi DSPs

Elliptic Labs, the Norwegian software sensor technology company, announced a collaboration with Cadence Design Systems to optimize its machine learning algorithms on Cadence Tensilica HiFi DSPs. Enabling Elliptic Labs to expand its software sensor user interfaces to more embedded systems, while simultaneously reducing power consumption for energy-critical applications, this collaboration benefits manufacturers in a wide range of markets, including mobile consumer devices, and automotive.

Contextual Awareness: What Is It, and How Is It Being Used?

March 17, 2021 by Elia Shenberger

Contextual Awareness: What Is It, and How Is It Being Used?

Context-aware devices, such as the embedded smartphone keyboards, have been around for some time, though in a very limited form. By learning regularly used names, locations and phrases, they seem to know your next move, that is, predictive text. Similarly, but at a higher level, the next generation of smart audio devices will combine user-specific data, such as location, preferences and other device sensor data, including audio, to better serve the user.

DSP Concepts and CloudNav Partnership Brings Best-in-Class Sensor Fusion Technology to Audio Weaver

February 24, 2021 by audioXpress Staff

DSP Concepts and CloudNav Partnership Brings Best-in-Class Sensor Fusion Technology to Audio Weaver

DSP Concepts, the audio platform powering more than 50M devices for many of the world’s best consumer and automotive brands, announced a partnership with CloudNav to bring its sensor fusion technology to Audio Weaver. This means that developers can seamlessly deploy CloudNav’s Performance Fusion technology through Audio Weaver’s drag-and-drop graphical interface to integrate and automatically calibrate inertial sensors for optimal product performance.

CEVA Introduces Bluebud Turnkey IP Wireless Audio Platform for TWS Earbuds and Bluetooth Audio Devices

February 22, 2021 by Joao Martins

CEVA Introduces Bluebud Turnkey IP Wireless Audio Platform for TWS Earbuds and Bluetooth Audio Devices

CEVA unveiled Bluebud, a highly-integrated wireless audio platform aimed at standardizing DSP-enabled Bluetooth audio IP for fast-growing applications, including True Wireless Stereo (TWS) earbuds, hearables, gaming headsets, smartwatches and other wearable devices. The solution fully supports Bluetooth 5.2 and LE Audio design and is ready to support brands in the transition from Bluetooth Classic.

CEVA Expands Possibilities in Sensor Hub DSPs with 2nd Generation SensPro Family

January 13, 2021 by audioXpress Staff

CEVA Expands Possibilities in Sensor Hub DSPs with 2nd Generation SensPro Family

CEVA introduced its 2nd generation SensPro DSP family, a hub for AI and DSP processing workloads associated with a wide range of sensors including camera, Radar, LiDAR, Time-of-Flight, microphones and inertial measurement units (IMUs). The new, lower power, SensPro2 DSPs deliver up to 10X performance improvement versus CEVA-BX2 DSP for AI networks used for voice assistants, natural language processing and spatial audio. They are also automotive-ready with high-precision floating-point capability.

DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor

January 7, 2021 by audioXpress Staff

DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor

DSP Group announced the DBM10, a new low-power, cost-effective artificial intelligence (AI) and machine learning (ML) system-on-chip (SoC). This new open platform, with a cost- and power-optimized architecture, enables rapid development of AI and ML applications for mobile, wearables, hearables, and connected devices in general. It provides a complete platform in terms of voice and audio processing, without compromising the battery life of new designs, and allowing developers to implement their own differentiating algorithms.

CEVA Establishes Partnership with DARPA for Technology Innovation

January 5, 2021 by audioXpress Staff

CEVA Establishes Partnership with DARPA for Technology Innovation

CEVA announced an open licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation for DARPA programs. The commercial partnership, as part of the DARPA Toolbox initiative, establishes an access framework under which DARPA organizations can access all of CEVA’s commercially available IPs, tools and support to expedite their programs. This provides DARPA researchers with access to CEVA’s portfolio of wireless connectivity and smart sensing IPs.

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