Founded by Moti Margalit and Ari Mizrachi in 2019, SonicEdge has developed a unique sound generation technology for microspeakers based on proven silicon MEMS technology. As pioneers in active ultrasound modulation, providing enhanced audio at low frequencies and extended operation up to 20kHz and beyond, the SonicEdge MEMS speakers are smaller in size, produce no vibrations, have a reduced back cavity, are easy to use and integrate, and can be manufactured with high uniformity.
SonicEdge's focus is on the true wireless stereo (TWS) market, where their ultrasound drivers enable smaller and potentially better sounding earphones. SonicEdge's first product uses 200 modulated ultrasound transducers, each composed of an ultrasound speaker and an acoustic modulator, all integrated in a MEMS packaged device with an active area of just 10mm2. Packaged devices available for evaluation include the rectangular-shaped SE1000 and the SE2000 in a square format, both including the MEMS chip generating sound and an amplifier chip (M-Amp) receiving a digital audio signal.
For CES 2025, SonicEdge will now launch SonicTwin, promoted as the world's smallest integrated speaker-microphone in a single package. Measuring just 8x4x1mm - smaller than its original SE1000 driver, the new device combines the company's unique modulated ultrasound generation technology combined with sensing capabilities, setting a new benchmark for noise cancelation in TWS designs. According to SonicEdge, the fact that its modulated ultrasound technology is able to deliver high Sound Pressure Levels (SPL) and still eliminate traditional mechanical vibrations is a unique benefit to allow direct integration with a MEMS microphone in a single device. Although no specifications for the microphone part are confirmed for now, SonicEdge believes the unique, ultra-compact form factor will inspire developers to explore the possibilities in earbuds and wearables, allowing also more space for larger batteries.
"SonicTwin is a game-changer," says Moti Margalit, co-founder and CEO of SonicEdge. "It unlocks immersive, integrated audio solutions and sets a new standard for wearables and beyond. Its ultra-compact size enables true in-ear canal integration, providing unmatched performance, comfort, and active noise cancellation (ANC) for TWS earbuds and headphones. With SonicTwin, manufacturers can design smaller devices or allocate more space for larger batteries, offering unprecedented freedom in product design."
Traditional noise cancelation systems (ANC) performance is limited by speaker and microphone placement, an area that this integrated solution addresses. "SonicTwin reduces latency and enables better ANC," adds Ari Mizrachi, CTO and co-founder of SonicEdge. "Our modulated ultrasound technology replaces traditional voice coils, resulting in higher efficiency, superior sound quality, and co-packaged sensors — all in a size once thought impossible."
Expanding SonicEdge's MEMS-based product portfolio, the new SonicTwin integrated device also paves the way for next-generation integrated speaker-sensor solutions that can power applications in environmental awareness, health monitoring, and beyond. SonicTwin also promises to bring advantages to the production process by reducing the number of components, minimizing complexity on the production line, while the design integration contributes to accelerate time-to-market.
SonicEdge says that engineering samples of SonicTwin will become available in 2025, targeting to appear in consumer audio products in 2026.
www.sonicedge.io
