All items tagged with ultrasound (13)

xMEMS Designs Thinner Microspeaker Engineered for Smart Watches and Fitness Bands

May 13, 2025 by Joao Martins

xMEMS Designs Thinner Microspeaker Engineered for Smart Watches and Fitness Bands

Following the debut of the original Sycamore microspeaker in late 2024, xMEMS Labs is already working on expanding the technology to even thinner form factors with the Sycamore-W. This new full-range driver is an evolution of the company's Cypress "sound from ultrasound" MEMS platform introduced in 2023, and currently waiting for the results of safety reports on long-term ultrasound exposure for humans. xMEMS is confident in those reports and is doubling down with the even thinner, Sycamore-W.

GRAS Releases New Production Line Microphones with EQset

February 19, 2025 by audioXpress Staff

GRAS Releases New Production Line Microphones with EQset

GRAS Sound & Vibration launched the new GRAS 40PO-L and 40PO-H measurement microphones with EQset technology. These new production line microphones enable consistent and reliable audio testing, ensuring high-quality results across different locations. With a new capsule design and a frequency response up to 40kHz — suitable for High-Res compliance and ultrasonic applications — these microphones deliver improved accuracy in test results.

USound Expands MEMS Speaker Integrations to Support Health Monitoring and Proximity Sensing

January 28, 2025 by Joao Martins

USound Expands MEMS Speaker Integrations to Support Health Monitoring and Proximity Sensing

During CES 2025, USound introduced two new innovative integrations in its growing range of MEMS speakers, unlocking new features for true wireless stereo (TWS) earbuds with no additional components. The Austrian specialist in micro-electromechanical systems (MEMS) speakers announced a breakthrough that enables earbuds to feature advanced health monitoring and proximity detection, directly in the same device.

SonicEdge Presents Integrated MEMS Speaker and Microphone Solution at CES 2025

December 23, 2024 by Joao Martins

SonicEdge Presents Integrated MEMS Speaker and Microphone Solution at CES 2025

To be unveiled at CES 2025 is a new example of a MEMS microspeaker company that now offers an integration with a MEMS microphone. SonicEdge, the startup that pioneered ultrasound MEMS drivers and has yet to enter the market, will present SonicTwin, an integrated speaker-microphone in a single package. Combining the company's patented modulated ultrasound technology that eliminates traditional mechanical vibrations, makes the integration with a microphone and sensors much easier with potential benefits also for ANC and lower-power in TWS earbuds and headphones.

xMEMS Introduces Nearfield Full-Range Ultrasonic MEMS Microspeaker

November 19, 2024 by Joao Martins

xMEMS Introduces Nearfield Full-Range Ultrasonic MEMS Microspeaker

xMEMS Labs, recognized for its piezo MEMS innovation and creating a leading range of all-silicon microspeakers that until now mostly target earbuds and in-ear applications, has announced a new full-range driver that meets the requirements for nearfield applications. The newly announced xMEMS Sycamore full-range driver uses the company "sound from ultrasound" platform, making it suitable for laptops, smart glasses, or open ear designs.

Noveto Is Back and Will Present Second-Generation Solution at CES 2024

December 29, 2023 by Joao Martins

Noveto Is Back and Will Present Second-Generation Solution at CES 2024

Putting an end to rumors that the company was out of business, Noveto is back at CES 2024 to demonstrate its ultrasonic audio technology integrated within a 3rd party soundbar. Noveto has partnered with BeStar and SEI to build this new generation of soundbar and will showcase the demonstrator at the IAI Smart booth at CES. Learning the lessons from past errors, Noveto will also unveil its new licensing business approach at the show.

xMEMS Achieves Extended Bass Response, Making ANC Applications Possible From a Single MEMS Driver

November 14, 2023 by Joao Martins

xMEMS Achieves Extended Bass Response, Making ANC Applications Possible From a Single MEMS Driver

The new Cypress MEMS speaker from xMEMS Labs achieves 40X louder bass response on a single monolithic, miniaturized device, achieving well above the 130dB SPL at low frequencies, required for ANC implementations on TWS earbuds. The new xMEMS Cypress achieves this groundbreaking performance by using ultrasound technology. The new development will be demonstrated at CES 2024 by appointment only, with mass production scheduled for late-2024.

Simulation Techniques: SonicEdge Ultrasound Speaker - Modeling and Application

September 27, 2023 by René Christensen

Simulation Techniques: SonicEdge Ultrasound Speaker - Modeling and Application

The SonicEdge transducer - a cutting-edge microspeaker based on a unique MEMS technology that generates sound using active ultrasound modulation - introduces a completely new class of devices that can deliver constant volume velocity across audio frequencies and beyond. The article details how to model the transducer in lumped-element and finite-element acoustic simulations and how to tailor a desired SPL response using acoustic features. As originally published in audioXpress, August 2023.

Active Acoustics, Noise Cancellation, and Product Development in audioXpress August 2023

July 14, 2023 by audioXpress Staff

Active Acoustics, Noise Cancellation, and Product Development in audioXpress August 2023

As audioXpress August 2023 focus on Acoustics, read the report on Electroacoustic Enhancement and Active Acoustics. René Christensen details the model and application of the SonicEdge Ultrasound Speaker. Philipp Paul Klose writes about Noise Cancellation in Automotive Audio. And we visit the Western Electric Tube Factory in Rossville, GA. Read the AXPONA 2023 show report, how to Design a True Midrange Driver, and how to build an Instrumentation Amplifier-Based Preamplifier Line Stage.

SonicEdge MEMS Ultrasound Speaker-In-Chip: Next Gen MEMS for TWS Earbuds and Hearing Aids

February 24, 2023 by Mike Klasco

SonicEdge MEMS Ultrasound Speaker-In-Chip: Next Gen MEMS for TWS Earbuds and Hearing Aids

Mike Klasco writes all about the cutting-edge SonicEdge MEMS Ultrasound Speaker-In-Chip. A next-gen MEMS solution for TWS earbuds, hearing aids, and hearables. Entering production in 2023, this unique ultrasonic shutter MEMS-based speaker system represents a decade's work in a unique topology. The core of the design is one or more apertures driven by the ultrasonic carrier signal and one or more movable and over-sized obstruction elements that are configured to modulate the ultrasonic carrier signal (think of a shutter) thereby generating audio.

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