All items in category Industry News
Tempow Launches Partnership Program for Chipset Manufacturers to Accelerate Adoption of Bluetooth LE Audio
by audioXpress Staff

Tempow Launches Partnership Program for Chipset Manufacturers to Accelerate Adoption of Bluetooth LE Audio

Tempow, the company that specializes in software-only solutions to enhance the core Bluetooth protocol, announced the release of a new Bluetooth Software Stack for hearables and speakers, with an early prototype of the freshly revealed LE Audio, the next generation of Bluetooth audio. The company also announced a partnership program for chipset manufacturers to use Tempow’s implementation. Telink Semiconductor was the first to join the program.
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Waves Unveils Nx Speakers 3D Audio Technology at CES 2020
by audioXpress Staff

Waves Unveils Nx Speakers 3D Audio Technology at CES 2020

The Waves Maxx suite of audio and voice modules with Waves Nx 3D audio already enhances the sound experience on millions of laptops, tablets, smartphones, smart speakers, headphones, and is available on SoCs from the world's foremost chip makers. Now, with the new Waves Nx Speakers audio technology, any music, movie, or game expands into 3D, delivering a 3D audio experience on laptops, tablets, 2-in-1s, and more without subwoofers or special formats.
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Sonarworks Enables Personalized Audio, Perfected for Any Device, with SoundID
by audioXpress Staff

Sonarworks Enables Personalized Audio, Perfected for Any Device, with SoundID

Sonarworks unveiled SoundID at CES 2020, and is promoting public demonstrations also at NAMM, from January 16-19. Combining all the know-how from Sonarworks professional and consumer technologies, correcting the frequency response of headphones, the Latvian company has now created a new simplified approach, combining software and machine learning to deliver personalized audio, regardless of device. And Sonarworks confirmed that it will be delivering the SoundID experience to 1MORE headphone users in 2020.
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Dirac and NXP Announce Collaboration to Support i.MX 8M Chipset Family with Premium Digital Audio
by audioXpress Staff

Dirac and NXP Announce Collaboration to Support i.MX 8M Chipset Family with Premium Digital Audio

Swedish sound pioneer Dirac and NXP Semiconductors announced a collaboration to combine one of the world’s most powerful audio chipsets with a market-leading digital audio platform. By equipping the NXP i.MX 8M family of chipsets with Dirac’s digital audio platform, OEMs can enable their devices with maximized, immersive, and adaptive sound across their complete range of products. The strategic partnership announcement was made at CES 2020.
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Libre Wireless Technologies Introduces New Universal Wireless Audio Streaming and Multiroom Audio End Point
by audioXpress Staff

Libre Wireless Technologies Introduces New Universal Wireless Audio Streaming and Multiroom Audio End Point

During CES 2020, Libre Wireless Technologies announced a unique new industry-leading consumer wireless audio streaming solution characterized as the “Universal Audio Streaming Endpoint.” The new embedded solution, based on Libre’s latest LS9X mainstream WiFi media module, enables new audio product developments that seamlessly and concurrently support all major streaming ecosystems, directly in single-end and multiroom configurations.
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Cadence Confirms Bluetooth LE Audio LC3 Codec Support for Tensilica HiFi DSPs
by audioXpress Staff

Cadence Confirms Bluetooth LE Audio LC3 Codec Support for Tensilica HiFi DSPs

Cadence Design Systems announced that an implementation of the Low Complexity Communications Codec (LC3) that is part of the next generation Bluetooth LE Audio specification, is available now for Cadence Tensilica HiFi DSPs and has even been delivered to a lead customer. LC3 provides higher audio quality at lower bandwidth and affords developers greater flexibility in making tradeoffs between audio quality, power consumption and other features for a more optimal user experience.
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Synopsys Announces Bluetooth LE Audio LC3 Codec for ARC Processor
by audioXpress Staff

Synopsys Announces Bluetooth LE Audio LC3 Codec for ARC Processor

Synopsys collaborated with Fraunhofer IIS to release an implementation of the LC3 codec, part of the next-generation Bluetooth LE Audio specification. The new LC3 codec is optimized to deliver high-quality audio and voice playback in battery-powered devices incorporating ARC EM and HS DSP processors, and expands Synopsys' DesignWare Bluetooth Low Energy IP offerings and the portfolio of DesignWare ARC audio codecs and post-processing software.
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Selective Noise Cancellation with ams AS3460 Digital Augmented Hearing Chip for True Wireless Earbuds Demonstrated at CES 2020
by audioXpress Staff

Selective Noise Cancellation with ams AS3460 Digital Augmented Hearing Chip for True Wireless Earbuds Demonstrated at CES 2020

ams showcased its new Earbud Innovation Demo Kit at CES 2020. The ready-to-use reference design shows how loose-fit true wireless earbuds can achieve selective noise cancellation for augmented hearing, while supporting features such as proximity sensing for automatic power saving and usability enhancements. Based on the new ams AS3460 Digital Augmented Hearing companion chip, the solution currently provides the world’s best performing noise cancellation for loose- and closed-fit earbuds.
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Syntiant and Sensory Demonstrate First Ultra-Low-Power Multi-Language Voice Solution At The Edge
by audioXpress Staff

Syntiant and Sensory Demonstrate First Ultra-Low-Power Multi-Language Voice Solution At The Edge

At CES 2020, Syntiant announced a partnership with Sensory, combining the expertise and technologies in AI and speech recognition at the Edge, to deliver a deep learning, multi-lingual voice interface for battery-powered devices. The combined solution merges Sensory’s larger, higher-performance TrulyHandsfree wake word engine and voice control with Syntiant’s microwatt-power Neural Decision Processors (NDPs), bringing low-latency, real-time inference to edge devices.
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Riedel Expands Networked Video Technology Portfolio with Acquisition of Embrionix
by audioXpress Staff

Riedel Expands Networked Video Technology Portfolio with Acquisition of Embrionix

The Canada-based IP video processing pioneer Embrionix is now a part of Riedel Communications. With this combination of two success stories in state-of-the-art signal transport and processing for the media and entertainment markets, Riedel strengthens its expertise in IP-enabled hardware and software and further broadens its extensive portfolio of video solutions, opening up new possibilities in signal transmission and processing.
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